SYS-421GE-TNRT
4U GPU Server. 32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 4800MHz ECC DDR5

- 32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 4800MHz ECC DDR5
- 13 PCIe Gen 5.0 X16 FHFL Slots
AIOM/OCP 3.0 Support - 8x 2.5" Hot-swap SATA drive bays
8x HOT SWAP 2.5” SATA/SAS (AOC required)
8x2.5" Hot-swap NVMe drive bays - 8 Hot-Swap Heavy Duty Fans with Optimal Fan Speed Control
- 4x 2700W (2+2) Redundant Power Supplies, Titanium Level

Product SKUs | SuperServer SYS-421GE-TNRT (Black Front & Silver Body) |
Motherboard | Super X13DEG-OA |
Processor | |
CPU | Dual Socket E (LGA-4677) 4th Gen Intel® Xeon® Scalable processors |
Note | Supports up to 350W TDP CPUs (Aircooled) Supports up to 350W TDP CPUs (Liquid Cooled) |
GPU | |
Supported GPU | GPU-NVH100-80,GPU-NVA100-80-NC |
CPU-GPU Interconnect | PCIe 5.0 x16 Switch Dual-Root |
GPU-GPU Interconnect | NVIDIA® NVLink™ Bridge (optional) |
System Memory | |
Memory | Memory Capacity: 32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 4800MHz ECC DDR5 DRAM |
Memory Voltage | 1.2 V |
Error Detection | ECC |
On-Board Devices | |
Chipset | Intel® C741 |
Network Connectivity | 2x 10GbE BaseT with Intel® X710-AT2 |
IPMI | Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support |
Input / Output | |
Video | 1 VGA port(s) |
System BIOS | |
BIOS Type | AMI 32MB SPI Flash EEPROM |
Management | |
Software | OOB Management Package (SFT-OOB-LIC ) Redfish API IPMI 2.0 SSM Intel® Node Manager SPM KVM with dedicated LAN SUM NMI Watch Dog SuperDoctor® 5 |
Power Configurations | ACPI Power Management Power-on mode for AC power recovery |
PC Health Monitoring | |
CPU | 8+4 Phase-switching voltage regulator Monitors for CPU Cores, Chipset Voltages, Memory |
FAN | Fans with tachometer monitoring Pulse Width Modulated (PWM) fan connectors Status monitor for speed control |
Temperature | Monitoring for CPU and chassis environment Thermal Control for fan connectors |
Chassis | |
Form Factor | 4U Rackmount |
Model | CSE-418G2TS-R5K40P |
Dimensions and Weight | |
Height | 7" (178mm) |
Width | 17.2" (437mm) |
Depth | 29" (737mm) |
Package | 26.57" (H) x 27" (W) x 41" (D) |
Weight | Net Weight: 65.5 lbs (29.7 kg) Gross Weight: 100 lbs (45.3 kg) |
Available Color | Black Front & Silver Body |
Front Panel | |
Buttons | Power On/Off button System Reset button |
LEDs | Hard drive activity LED Network activity LEDs Power status LED System Overheat & Power Fail LED |
Expansion Slots | |
PCI-Express (PCIe) | 12 PCIe 5.0 x16 LP slot(s) 1 PCIe 5.0 X16 slot(s) |
Drive Bays / Storage | |
Hot-swap | 24x 2.5" hot-swap NVMe/SATA/SAS drive bays (8x 2.5" NVMe hybrid; 8x 2.5" NVMe dedicated) |
M.2 | 2 M.2 NVMe |
System Cooling | |
Fans | 8 heavy duty fans with optimal fan speed control |
Liquid Cooling | Direct to Chip (D2C) Cold Plate (optional) |
Power Supply | 2700W Redundant Power Supplies with PMBus |
Dimension (W x H x L) | 73.5 x 40 x 203 mm |
AC Input | 2700W: 200-240Vac / 50-60Hz |
+12V | Max: 225A / Min: 0A (200Vac-240Vac) |
12V SB | Max: 3.5A / Min: 0A |
Output Type | 25 Pairs Gold Finger Connector |
Operating Environment | |
Environmental Spec. | Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing) |

Omniverse Optimized Systems
Highest Performance, Tailored for NVIDIA Omniverse
Benefits & Advantages
- New next-generation purpose-built system for NVIDIA Omniverse™ Enterprise
- Optimized for power immersive, photorealistic 3D models, simulations, and digital twins
- Flexible storage configurations
- Up to 2x more storage and I/O flexibility
Key Features
- 8 NVIDIA L40S/L40 PCIe GPUs
- Dual 3rd Gen Intel® Xeon® Scalable processors per node
- Dual 4th Gen Intel® Xeon® Scalable processors
- Supports PCIe 5.0, DDR5 and Compute Express Link (CXL) 1.1+
- 3 NVIDIA ConnectX-7
- Optimized thermal capacity and airflow to support CPUs up to 350W and GPUs up to 700W with air cooling
Deliver optimized systems for the most demanding AI, Cloud, and 5G Edge workloads

Performance Optimized
Enhanced thermal capacity to support the highest performing CPUs and GPUs, plus support for the latest industry technologies including PCIe 5.0, DDR5, CXL 1.1 and high-bandwidth memory.
Energy Efficient
Systems designed for optimal airflow to run in high-temperature data center environments up to 40°C, optional rack-scale liquid cooling solutions and in-house design of Titanium Level power supplies for maximum efficiency.
Improved Security and Manageability
Industry standard compliance for hardware and silicon Root of Trust (RoT), cryptographical attestation of components throughout the entire supply chain and comprehensive remote management capabilities.
Supports Open Industry Standards
Futureproofing and interoperability with support for Open Compute Project (OCP) standards including OCP 3.0, OAM, ORV2 and OSF as well as Open BMC and the E1.S storage form factor.