2U Twin Server. Socket E (LGA 4677) support 4th Gen Intel® Xeon® Scalable processors

Anewtech Systems Supermicro Servers Supermicro Singapore Twin-Server-Supermicro-SYS-221BT-DNTR
  • Socket E (LGA 4677) support 4th Gen Intel® Xeon® Scalable processors
  • Intel® C741
  • Up to 16 DIMMs ECC DDR5 Slots
  • 1 PCIe 5.0 x16 (LP) slot;
  • 2 PCIe 5.0 x8 (LP) slot;
  • Tool-less support
  • Internal PCIe 4.0 x8 for 2 M.2 NVMe support onboard
  • Optional M.2 NVMe Boot Controller via SCC-A2NM2241G3-B1
  • Network connectivity via AIOM (OCP 3.0 compliant)
  • 12 hot-Swap 2.5” drive bays (2x PCIe 5.0 NVMe and 10x PCIe 4.0 NVMe/SATA)
  • 4 cooling fans per 2U enclosure, 16.5K RPM; Shared Cooling Design
  • Liquid Cooling Support
  • 2200W Redundant Power Supplies Titanium Level (96%+); Shared Power Design
Product Specification
Product SKUSuperServer SYS-221BT-DNTR (Black front & silver body)
MotherboardSuper X13DET-B
Processor (per Node)
CPUDual Socket E (LGA 4677) 4th Gen Intel® Xeon® Scalable processors 
Intel Xeon CPU Max Series with high bandwidth memory (HBM)
CoresUp to 32C/64T; Up to 112.5MB Cache
NoteSupports up to 350W TDP CPUs (Aircooled) 
Supports up to 350W TDP CPUs (Liquid Cooled)
System Memory (per Node)
MemoryMemory Capacity: 16 DIMM slots Up to 4TB: 16x 256 GB DRAM 
Memory Type: 4800MHz ECC DDR5 RDIMM
On-Board Devices (per Node)
ChipsetIntel® C741
Network ConnectivityVia AIOM
IPMISupport for Intelligent Platform Management Interface v.2.0 
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output (per Node)
LAN1 RJ45 Dedicated BMC LAN port
USB2 USB 3.1 port(s) (2 rear)
Video1 VGA port(s)
Others2x M.2 for boot drive or caching   
M.2 form factor: NVMe double-sided 22x110mm 
Note: Enterprise-grade M.2 only for caching application
System BIOS
SoftwareSupemicro Out of Band (OOB) License (Included per Node) 
SuperCloud Composer 
Intel® Node Manager 
KVM with dedicated LAN 
IPMI 2.0 
Watch Dog 
SuperDoctor® 5
Power ConfigurationsACPI / APM Power Management
PC Health Monitoring
CPU8+4 Phase-switching voltage regulator 
Monitors for CPU Cores, Chipset Voltages, Memory.
FANFans with tachometer monitoring 
Pulse Width Modulated (PWM) fan connectors 
Status monitor for speed control
TemperatureMonitoring for CPU and chassis environment
Form Factor2U Rackmount
Dimensions and Weight
Height3.47" (88mm)
Width17.68" (449mm)
Depth28.75" (730mm)
Package9.76" (H) x 24.65" (W) x 45.28" (D)
WeightNet Weight: 55.1 lbs (25 kg) Gross Weight: 80.7 lbs (36.6 kg)
Available ColorBlack front & silver body
Front Panel
ButtonsPower On/Off button 
UID button
LEDsHDD activity LED 
Network activity LEDs 
Power status LED 
Universal Information (UID) LED
Expansion Slots (per Node)
PCI-Express (PCIe)2 PCIe 5.0 x8 LP slot(s) 
1 PCIe 5.0 x16 LP slot(s)
Drive Bays / Storage (per Node)
Hot-swap12x 2.5" hot-swap NVMe/SATA drive bays 
(2x PCI-E 5.0 NVMe and 10x PCI-E 4.0 NVMe/SATA)
M.22 M.2 NVMe
System Cooling
Fans4x 16.5K RPM Heavy Duty 8cm Fan(s)
Liquid CoolingDirect to Chip (D2C) Cold Plate (optional)
Power Supply2200W Redundant Power Supplies with PMBus
Total Output Power2200W : 100 - 240 Vac 
2090W : 230 - 240 Vdc for CCC only
Dimension (W x H x L)45 x 40 x 480 mm
AC Input1200W: 100-127Vac / 50-60Hz 
2090W: 180-220Vac (for UL/cUL only) 
1800W: 200-220Vac / 50-60Hz 
1980W: 220-230Vac / 50-60Hz 
2200W: 220-240Vac (for UL/cUL only) 
2090W: 230-240Vac / 50-60Hz 
2090W: 230-240Vdc (for CCC only)
+12VMax: 100A / Min: 0A (100-127Vac) 
Max: 150A / Min: 0A (200-220Vac) 
Max: 165A / Min: 0A (220-230Vac) 
Max: 174.17A / Min: 0A (180-220Vac, UL/cUL only) 
Max: 174.17A / Min: 0A (230-240Vac) 
Max: 174.17A / Min: 0A (230-240Vdc, CCC only) 
Max: 183.33A / Min: 0A (220-240Vac, UL/cUL only)
12V SBMax: 2.1A / Min: 0A
Operating Environment
RoHSRoHS Compliant
Environmental Spec.Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) 
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) 
Operating Relative Humidity: 8% to 90% (Non-Condensing) 
Non-operating Relative Humidity: 5% to 95% (Non-Condensing)

Deliver optimized systems for the most demanding AI, Cloud, and 5G Edge workloads


Performance Optimized

  • Enhanced thermal capacity to support the highest performing CPUs and GPUs, plus support for the latest industry technologies including PCIe 5.0, DDR5, CXL 1.1 and high-bandwidth memory.

Energy Efficient

  • Systems designed for optimal airflow to run in high-temperature data center environments up to 40°C, optional rack-scale liquid cooling solutions and in-house design of Titanium Level power supplies for maximum efficiency.

Improved Security and Manageability

  • Industry standard compliance for hardware and silicon Root of Trust (RoT), cryptographical attestation of components throughout the entire supply chain and comprehensive remote management capabilities.

Supports Open Industry Standards

  • Futureproofing and interoperability with support for Open Compute Project (OCP) standards including OCP 3.0, OAM, ORV2 and OSF as well as Open BMC and the E1.S storage form factor.