Digi XBee® 802.15.4

Low-cost, easy-to-deploy RF modules provide critical end-point connectivity to devices and sensors

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Features

  • Simple, out-of-the-box RF communications, no configuration needed
  • Point-to-multipoint network topology
  • 2.4 GHz for worldwide deployment
  • Common XBee footprint for a variety of RF modules
  • Industry leading sleep current of sub 1uA
  • Firmware upgrades via UART, SPI or over the air
  • Migratable to DigiMesh and Zigbee PRO protocols and vice-versa

Specification

Item Digi XBee S2C 802.15.4 Digi XBee-PRO S2C 802.15.4
PERFORMANCE
TRANSCEIVER CHIPSET Silicon Labs EM357 SoC
DATA RATE RF 250 Kbps, Serial up to 1 Mbps
INDOOR/URBAN RANGE 200 ft (60 m) 300 ft (90 m)
OUTDOOR/RF LINE-OF-SIGHT RANGE 4000 ft (1200 m) 2 miles (3200 m)
TRANSMIT POWER 3.1 mW (+5 dBm) / 6.3 mW (+8 dBm)boost mode 63 mW (+18 dBm)
RECEIVER SENSITIVITY (1% PER) -100 dBm / -102 dBm boost mode -101 dBm
FEATURES
SERIAL DATA INTERFACE UART, SPI
CONFIGURATION METHOD API or AT commands, local or over-the-air (OTA)
FREQUENCY BAND ISM 2.4 GHz
FORM FACTOR Through-Hole, Surface Mount
HARDWARE S2C
ADC INPUTS (4) 10-bit ADC inputs
DIGITAL I/O 15
ANTENNA OPTIONS Through-Hole: PCB Antenna, U.FL Connector, RPSMA Connector, or Integrated Wire
SMT: RF Pad, PCB Antenna, or U.FL Connector
OPERATING TEMPERATURE -40º C to +85º C
DIMENSIONS (L X W X H) AND WEIGHT Through-Hole: 0.960 x 1.087 in (2.438 x 2.761 cm)
SMT: 0.866 x 1.33 x 0.120 in (2.199 x 3.4 x 0.305 cm)
Through-Hole: 0.960 x 1.297 in (2.438 x 3.294 cm)
SMT: 0.866 x 1.33 x 0.120 in (2.199 x 3.4 x 0.305 cm)
NETWORKING AND SECURITY
PROTOCOL XBee 802.15.4 (Proprietary 802.15.4)
UPDATABLE TO DIGIMESH PROTOCOL Yes
UPDATABLE TO ZIGBEE PROTOCOL Yes
INTERFERENCE IMMUNITY DSSS (Direct Sequence Spread Spectrum)
ENCRYPTION 128-bit AES
RELIABLE PACKET DELIVERY Retries/Acknowledgements
FILTRATION OPTIONS PAN ID, Channel, and 64-bit addresses
CHANNELS 16 channels 15 channels
POWER REQUIREMENTS
SUPPLY VOLTAGE 2.1 to 3.6V 2.7 to 3.6V
TRANSMIT CURRENT 33 mA @ 3.3 VDC / 45 mA boost mode 120 mA @ 3.3 VDC
RECEIVE CURRENT 28 mA @ 3.3 VDC / 31 mA boost mode 31 mA @ 3.3 VDC
POWER-DOWN CURRENT <1 μA @ 25º C <1 μA @ 25º C
REGULATORY APPROVALS
FCC, IC (NORTH AMERICA) Yes Yes
ETSI (EUROPE) Yes No
RCM (AUSTRALIA AND NEW ZEALAND) No (Coming soon) No (Coming soon)
TELEC (JAPAN) No (Coming soon) No (Coming soon)

Digi XBee RF modules provide OEMs with a common footprint shared by multiple platforms, including multipoint and ZigBee/ Mesh topologies, and both 2.4 GHz and 900 MHz solutions. OEMs deploying the XBee can substitute one Digi XBee for another, depending upon dynamic application needs, with minimal development, reduced risk and shorter time-to-market.

Digi XBee 802.15.4 RF modules are ideal for applications requiring low latency and predictable communication timing. Providing quick, robust communication in point-to-point, peer-to-peer, and multipoint/star configurations, Digi XBee 802.15.4 products enable robust end-point connectivity with ease. Whether deployed as a pure cable replacement for simple serial communication, or as part of a more complex hub-and-spoke network of sensors, Digi XBee 802.15.4 RF modules maximize performance and ease of development.

XBee 802.15.4 modules seamlessly interface with compatible gateways, device adapters and range extenders, providing developers with true beyond-the-horizon connectivity.

The updated Digi XBee S2C 802.15.4 module is built with the SiliconLabs EM357 SoC and offers improved power consumption, support for over-the-air firmware updates, and provides an upgrade path to DigiMesh® or Zigbee® mesh protocols if desired.


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