AS-2145GH-TNMR
2U 4-GPU Server, AMD Instinct MI300A Accelerator (liquid-cooled)
- Quad AMD® EPYC™ MI300A processors
- HBM3 Stacks 512GB
- Optional PCIe configurations up to 6 PCIe slots x16 FHHL
- Flexible networking options with 2 AIOM networking slot (OCP NIC 3.0 compatible)
- Default 8x 2.5" Hot-swap NVMe or Optional 8x 2.5" SAS3/SATA3 via storage add-on card;
- 2x internal M.2 NVMe/SATA;
- 3 heavy duty fans w/ Liquid Cooled
- 4x 1600W redundant Titanium level power supplies
| Product SKUs | A+ Server AS -2145GH-TNMR (Black) |
| Motherboard | Super H13QSH |
| Processor | |
| CPU | Quad Socket SH5 AMD Instinct™ MI300A Accelerated Processing Units (APUs) |
| Note | Supports up to 760W TDP CPUs (Liquid Cooled) |
| GPU | |
| Max GPU Count | 4 onboard GPU(s) |
| Supported GPU | AMD: MI300A |
| System Memory | |
| Memory | Max Memory (1DPC): Up to 512GB ECC HBM3 |
| On-Board Devices | |
| Chipset | AMD SH5 |
| Network Connectivity | Via AIOM |
| Input / Output | |
| LAN | 1 RJ45 Dedicated IPMI LAN port |
| USB | 2 USB 2.0 port(s) (2 front) 2 USB 3.0 port(s) (2 rear) |
| Video | 1 VGA port(s) 1 DisplayPort (s) |
| Serial Port | 1 COM Port(s) (1 rear) |
| System BIOS | |
| BIOS Type | AMI 32MB SPI Flash EEPROM |
| Security | |
| Hardware | Trusted Platform Module (TPM) 2.0 |
| PC Health Monitoring | |
| CPU | 4+1 Phase-switching voltage regulator Monitors for CPU Cores, Chipset Voltages, Memory |
| FAN | Fans with tachometer monitoring Pulse Width Modulated (PWM) fan connectors Status monitor for speed control |
| Temperature | Monitoring for CPU and chassis environment Thermal Control for fan connectors |
| Chassis | |
| Form Factor | 2U Rackmount |
| Model | CSE-218H2TS-R3K2AWP |
| Dimensions and Weight | |
| Height | 3.5" (87.9mm) |
| Width | 17.3" (438.4mm) |
| Depth | 32" (812.9mm) |
| Package | 9.75" (H) x 26.5" (W) x 43.5" (D) |
| Weight | Net Weight: 45.5 lbs (20.64 kg) Gross Weight: 71.5 lbs (32.43 kg) |
| Available Color | Black |
| Expansion Slots | |
| PCI-Express (PCIe) | 4 PCIe 5.0 x16 FHHL slot(s) 2 PCIe 5.0 x16 AIOM slot(s) |
| Drive Bays / Storage | |
| Hot-swap | 8x 2.5" hot-swap NVMe/SAS3/SATA3 drive bays |
| M.2 | 2 M.2 NVMe OR 2 M.2 SATA3 |
| System Cooling | |
| Fans | 3 Heavy duty counter-rotating 8cm Fan(s) |
| Liquid Cooling | Direct to Chip (D2C) Cold Plate (optional) |
| Power Supply | 1600W Redundant Titanium Level power supplies |
| Dimension (W x H x L) | 73.5 x 40 x 203 mm |
| AC Input | 1000W: 100-127Vac / 50-60Hz 1600W: 200-240Vac / 50-60Hz |
| +12V | Max: 83.3A / Min: 0A (100Vac-127Vac) Max: 133A / Min: 0A (200Vac-240Vac) |
| 12V SB | Max: 2.1A / Min: 0A |
| Output Type | Backplanes (gold finger) |
| Operating Environment | |
| RoHS | RoHS Compliant |
| Environmental Spec. | Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (Non-Condensing) Non-operating Relative Humidity: 5% to 95% (Non-Condensing) |
Targeting accelerated HPC workloads, this 2U 4-way multi-APU system with liquid cooling integrates 4 AMD Instinct™ MI300A accelerators. Each APU combines high-performance AMD CPU, GPU and HBM3 memory for a total of 912 AMD CDNA™ 3 GPU compute units and 96 “Zen 4” cores in one system. Supermicro's direct-to-chip custom liquid-cooling technology enables exceptional TCO with over 51% data center energy cost savings. Furthermore, there is a 70% reduction in fans compared to air-cooled solutions. The rack-scale integration optimized with the dual AIOM and 400G networking creates a high-density supercomputing cluster with up to 21 2U systems in a 48U rack.
Quad APU Liquid Cooled Server
Powered by AMD Instinct™ MI300A Accelerators
Targeting accelerated HPC workloads, 2U liquid cooled systems integrate 4 AMD Instinct™ MI300A APU accelerators
- 4 APUs combine high-performance AMD CPU, GPU and HBM3 memory for a total of 912 AMD CDNA™ 3 GPU compute units and 96 “Zen 4” cores, and 512GB of unified HBM3 memory in one system.
- PCIe 5.0 expansion slots for high-speed networking including RDMA to APU memory
- 2 PCIe 5.0 Open Compute Project (OCP) 3.0 AIOM slots
- Fully optimized for the most popular AI & ML frameworks—PyTorch, TensorFlow, JAX, ONYX-RT, Triton
Proven to Perform at Scale
Industry-Proven System Designs
8U high-performance fabric 8-GPU system leveraging industry-standard OCP Accelerator Module (OAM) to support AMD’s MI300X Accelerators. 4U and 2U multi-processor APU systems integrate 4 AMD Instinct™ MI300A accelerators.
Purpose Built for AI & HPC
Feature maximized and power optimized, supporting up to 16x dedicated hot-swap NVMe drives, full-performance GPUs, CPUs, and memory, and high-speed networking for large-scale cluster deployments.
Advanced Cooling Options
Flexible cooling options for air- and liquid-cooled racks, with liquid-cooled solutions delivering exceptional TCO with over 51% data center energy cost savings.
Designed to Scale
Designed with full scalability in mind, supporting 8 high-speed 400G networking cards providing direct connectivity to each GPU for massive AI clusters.
Optimized Solutions for AI and HPC
Supermicro Systems with AMD Instinct™ MI300 Series Accelerator
 |  |  | |
| Form Factor | 8U 8-GPU System with AMD Instinct MI300X Accelerators (air-cooled) | 2U 4-GPU System with AMD Instinct MI300A Accelerators (liquid-cooled) | 4U 4-GPU System with AMD Instinct MI300A Accelerators (air-cooled) |
| CPU | Dual AMD EPYC 9004 Series Processors with up to 128 cores/256 threads per socket | Quad AMD Instinct MI300A APUs with total of 96 CPU cores (4x 24 AMD “Zen4” cores) | Quad AMD Instinct MI300A APUs with total of 96 CPU cores (4x 24 AMD “Zen4” cores) |
| GPU | 8x AMD Instinct MI300X Accelerators with 192GB HBM3 memory per GPU interconnected on AMD Universal Base Board (UBB 2.0) | 4x AMD Instinct MI300A with 228 AMD CDNA 3 GPU compute units per APU | 4x AMD Instinct MI300A with 228 AMD CDNA 3 GPU compute units per APU |
| Memory | Up to 6TB (24x 256GB DRAM) 4800MT/s ECC DDR5 RDIMM/LRDIMM | 512 GB unified HBM3 memory with up to 5.3 TB/s bandwidth | 512 GB unified HBM3 memory with up to 5.3 TB/s bandwidth |
| Drives | 16x hot-swap PCIe 5.0 U.2 NVMe, 1x onboard M.2 NVMe, 2x 2.5" SATA | 2x onboard 2280 or 22110 M.2 NVMe and 8x hot-swap 2.5" U.2 NVMe | 2x onboard 2280 or 22110 M.2 NVMe and 8x hot-swap 2.5" U.2 NVMe or 24x 2.5" SAS/SATA |
| Networking | 8x PCIe 5.0 high-performance networking cards, up to 400G with Ethernet or InfiniBand | 2x AIOM (OCP 3.0) with up to 400G and additional 4x PCIe 5.0 (x8) slots | 2x AIOM (OCP 3.0) with up to 400G and additional 4x PCIe 5.0 (x8) slots |
| Interconnect | AMD Infinity Fabric™ Links, up to 896GB/s of peer-to-peer inter-GPU connectivity | AMD Infinity Fabric Links, up to 384GB/s of peer-to-peer inter-GPU connectivity | AMD Infinity Fabric Links, up to 384GB/s of peer-to-peer inter-GPU connectivity |
| Power | 6x or 8x 3000W redundant Titanium Level power supplies | 4x 1600W redundant Titanium Level power supplies | 4x 1600W redundant Titanium Level power supplies |
| Cooling | Air Cooling | Liquid Cooling | Air Cooling |