Comprehensive Supermicro Server based on 3rd Gen Intel® Xeon® Scalable Processor
Comprehensive server, storage and networking product lines optimized for IT, Data Center, Embedded, HPC and cloud computing that supports 3rd Gen Intel® Xeon® Scalable Processor.
Universal GPU System
Multi-Architecture Flexibility for AI/Deep Learning and HPC
Optimized for the most demanding AI, Deep Learning and HPC workloads, Supermicro X13 Universal GPU systems are designed for maximum flexibility, supporting multiple industry-standard GPUs including OAM, SXM5 and PCIe from Intel, NVIDIA and other industry partners.
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PCIe GPU Systems
Maximum Flexibility for AI, 3D Simulation and Metaverse
Optimized for the next generation of HPC, action-oriented AI, 3D simulation and advanced graphic design and rendering.
Supermicro X13 PCIe GPU systems support up to 10 next-generation accelerators in a 4U or 5U rackmount chassis.
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Hyper Systems
Best-in-class Performance and Flexibility Rackmount Server
X13 Hyper brings next-generation performance to Supermicro’s range of rackmount servers, built to take on the most demanding workloads along with the storage & I/O flexibility that provide customization for a wide range of applications. Up to 3 PCIe 5.0 slots in 1U or 8 slots in 2U for GPUs and add-on cards.
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BigTwin® Systems
Industry-leading 2U Multi-node Architecture
X13 BigTwin® systems provide maximum performance and serviceability in a multi-node architecture, with dual 4th Gen Intel® Xeon® Scalable processors per node and a hot-swappable tool-less design. Density (2U4N) or storage (2U2N) optimized configurations available with liquid cooling options for maximum performance.
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GrandTwin™ Systems
Multi-Node Architecture Optimized for Single-Processor Performance
X13 GrandTwin™ is optimized for cloud and media delivery workloads in space-constrained environments, with front-serviceable hot-swap nodes and front or rear I/O options to simplify installation and servicing. Highly modular design with resource saving architecture to reduce both power consumption and materials.
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FatTwin® Systems
Advanced Multi-node 4U Twin Architecture with 4 or 8 Nodes
X13 FatTwin® systems provide superior performance-per-dollar for virtualization and EDA applications. Front-serviceable single processor nodes with up to 6 drives provide maximum storage density and feature Resource Saving Architecture with shared power to further reduce both TCO and TCE.
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CloudDC Systems
Single or Dual Processor All-in-one Rackmount Platform for Cloud Data Centers
The X13 CloudDC family includes UP and DP configurations to support maximum memory and storage density in a single rackmount chassis, and up to 6 PCIe 5.0 slots capable of housing GPUs for AI inferencing at the edge. Tool-less brackets and hot-swap drive trays maximize serviceability in the data center.
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WIO Systems
Single Processor Platform Optimized for Maximum I/O Flexibility
A wide range of I/O options to deliver truly optimized systems for specific requirements.
Supermicro's X13 WIO systems can now accommodate double-width GPUs for accelerated AI/ML workloads through newly-designed top loading expansion slots.
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Multi-Processor Systems
Maximum Memory Footprint for Enterprise Applications
X13 multi-processor systems bring new levels of compute performance and flexibility to support mission-critical enterprise workloads. Up to 8 processors in a single rackmount system provides extreme core and memory density for large database and in-memory compute applications.
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Hyper-E Systems
Best-in-class Performance and Flexibility for Edge Data Centers
X13 Hyper-E brings the performance and flexibility of Supermicro's flagship Hyper series to the Edge with short-depth form factors designed for Edge data center and telco deployments. Systems are NEBS Level 3 certified and feature optional DC power supplies.
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SuperEdge Systems
High-Density Computing and Flexibility at the Intelligent Edge
X13 SuperEdge features 3 single-processor nodes in a 2U, short-depth form factor. Nodes are hot-swappable with front access I/O, making the system ideal for Edge, or telco deployments and 3 PCIe 5.0 slots per node enable a wide range of add-on cards.
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All-Flash EDSFF Systems
Revolutionary Petascale NVMe for Unprecedented Density and Capacity
Industry-leading storage density, performance and latency with industry-standard EDSFF drives for data-intensive workloads including mission-critical databases, virtualization, next-gen big data, HPC, media & entertainment, content distribution and hot-tier caching.
Datasheet
Better | Faster | Greener |
Better Performance Per Watt and Per Dollar | 40%-60% Better Performance on Cloud Workloads | Reduced Environmental Impact & Lower TCO |
OPTIMIZED SYSTEMS FOR YOUR WORKLOAD
| FIRST-TO-MARKET WITH MAXIMUM PERFORMANCE
| MAXIMUM POWER EFFICIENCY
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OPEN ARCHITECTURES
| CPU & MEMORY
| MULTI-NODE SYSTEMS
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SECURE
| I/O
| LONGEVITY
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MANAGEABLE & SERVICEABLE
| SUPERBLADE®
| SYSTEM REFRESH
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Benefits:
With the new 3rd Gen Intel Xeon Scalable processors, applications will benefit from several innovations.
- More cores – for applications that scale with the number of available cores, performance will increase.
- More extensive memory access – with more memory that can be accessed on the main memory bus, applications will perform better without waiting for data to be retrieved from storage devices.
- Faster memory access – with higher memory bandwidth, applications will execute faster, requiring less time to wait for critical data.
- Faster communication – with PCI-E 4.0, applications can communicate with PCIe devices at twice the speed as before, resulting in overall application performance increases.
- Interconnect between sockets – for applications that require socket-to-socket communication; the faster UPI channels will reduce execution time.
- AI instructions – accelerate AI inferencing applications with Intel Deep Learning Boost.