ID-M.2 (S42) 3TE7

Interface: SATA III 6.0 Gb/s. Flash Type: 3D TLC. Capacity: 32GB~1TB
Anewtech-Systems-Flash-Storage-ID-M2-S42-3TE7-innodisk
  • SATA III solution for industrial field
  • Exclusive L3 architecture
  • DRAM-less, 100% data integrity
  • Excellent random performance
  • Supports TRIM/NCQ/SMART
  • Built in iData Guard
  • Compatible with M.2 2242-D2-B-M standard
  • Designed with hardware LDPC ECC engine
Product Specification
Model NameM.2 (S42) 3TE7
InterfaceSATA III 6.0 Gb/s
Flash Type3D TLC
3D NAND Type64-layer | 96-layer | 112-layer
Capacity32GB~1TB
Max. Channels4
Sequential R/W (MB/sec, max.)550/520
Max. Power Consumption1.5W
Thermal SensorY
H/W Write ProtectOptional
ATA SecurityY
S.M.A.R.T.Y
Dimension (WxLxH/mm)22.0 X 42.0 X 3.5
Vibration20G@7~2000Hz
Shock1500G@0.5ms
MTBF>3 million hours
Storage Temperature-55°C ~ +95°C
Operation TemperatureStandard Grade: 0°C ~ +70°C;
Industrial Grade: -40°C ~ +85°C

M.2 (S42) 3TE7 is SATA III 6.0 Gb/s Flash based disk, which adopts latest SATA III NAND controller with L³ FW architecture. The upgraded L³ FW architecture, combining 4K mapping algorithm L² FW architecture with powerful LDPC technology, makes 3TE7 series have outstanding high IOPS, better data integrity and extended lifespan through reducing the bad block number happening. Built-in thermal sensor, and iData Guard ensure data integrity and reliability of 3TE7 for industrial applications. 

M.2 (S42) 3TE7 is designed for industrial field, and supports several standard features, including TRIM, NCQ, and S.M.A.R.T. In addition, industrial-oriented firmware provides a flexible customization service, making it perfect for a variety of industrial applications.


Ordering Information
Operating TemperatureStandard Grade  (0°C ~ 70°C)Industrial Grade  (-40°C ~ 85°C)
32GBDEM24-32GDK1EC1SFDEM24-32GDK1EW1SF
64GBDEM24-64GDK1%C*DFDEM24-64GDK1%W*&F   
128GBDEM24-A28DK1%C*DFDEM24-A28DK1%W*DF
256GBDEM24-B56DK1%C*&FDEM24-B56DK1%W*&F
512GBDEM24-C12DK1%CAQFDEM24-C12DK1%WAQF
1TBDEM24-01TDK1%CAQFDEM24-01TDK1%WAQF

%. E : 64 layers 3D TLC / G : 96 layers 3D TLC / K : 112 layers 3D TLC
*. PCB version control
&. S : 1 channel / D : 2 channels / Q : 4 channels