CT-RCO-6000-RPL
Industrial Computer w/ LGA 1700 for Intel 12/13/14th Gen CPU & R680E PCH
- LGA 1700 socket for 12/13/14th Gen. Intel® ADL & RPL Processor (65W/35W TDP)
- Intel® R680E Chipset
- 2x DDR5 4800/5600MHz SODIMM. Max. up to 64GB
- Triple Independent Display: 2x DisplayPort, 1x DVI-I
- 2x Intel® 2.5 GbE supporting Wake-on-LAN and PXE
- 1x Full-size Mini PCIe for communication or expansion modules, 2x SIM socket
- 1x 9mm 2.5" SATA SSD (Internal), 1x 7mm 2.5" SATA SSD (Hot-swap), Support RAID 0, 1
- 1x M.2 (E Key, PCIe x1, USB 2.0, 2230)
- 1x M.2 (B Key, 2242/3042/3052, PCIe x2, Support AI Module/NVMe Storage, PCIe x1 & USB 3.2 Gen1, Support 4G/5G)
- 6x RS-232/422/485 (4x internal), 8x USB 3.2 Gen 2, 1x USB 3.2 Gen 1 (internal)
- 8x DI + 8x DO with isolation
- 9 to 48VDC Wide Range Power Input Supporting AT/ATX Mode
- Wide Operating Temperature -25°C to 70°C (35W CPU); -25°C to 60°C (65W CPU)
- TPM 2.0 Supported
Product Specification
RCO-6000-RPL series is an extreme features integration, outstanding system performance, versatile I/O connections, and rugged reliability fanless embedded systems. It offers dramatically enhanced CPU and graphics performance, wide power and feature scalability, and advanced features, modularize expansion I/O, rich connectivity interfaces, wide range (9~48V) DC power input, and high reliability even operating in temperature extremes (-25°C~70°C).
Featuring with completely cable-less designed, high functional, one-piece housing design, and anti-vibration, RCO-6000-RPL series are ruggedized systems that can operate in harsh environments and easy to install and maintain. A build in over voltage protection (OVP), over current protection (OCP), reverse protection, and wide range DC power input makes RCO-6000-RPL series are safety system for all industrial applications.
| System | |
| Processor | Support 12/13th/14th(Non-vPRO) Gen Intel® ADL & RPL Processor (LGA 1700, 65W/35W TDP) •Intel® Core™ i9-14900/i9-13900E/i9-12900E, up to 24 Cores, 36MB Cache, up to 5.8 GHz, 65W •Intel® Core™ i9-14900T/i9-13900TE/i9-12900TE, up to 24 Cores, 36MB Cache, up to 5.5 GHz, 35W •Intel® Core™ i7-14700, up to 20 Cores, 33MB Cache, up to 5.4 GHz, 65W •Intel® Core™ i7-14700T, up to 20 Cores, 33MB Cache, up to 5.2 GHz, 35W •Intel® Core™ i7-13700E/i7-12700E, up to 16 Core, 30MB Cache, up to 5.1 GHz, 65W •Intel® Core™ i7-13700TE/i7-12700TE, up to 16 Cores, 30MB cache, up to 4.8 GHz, 35W •Intel® Core™ i5-14500/i5-13500E/i5-12500E, up to 14 Cores, 24MB Cache, up to 5.0 GHz, 65 W •Intel® Core™ i5-14500T/i5-13500TE/i5-12500TE, up to 14 Core, 24MB Cache, up to 4.8 GHz, 35W •Intel® Core™ i3-13100E/i3-12100E, up to 8 Cores, 12MB cache, up to 4.4 GHz, 60W •Intel® Core™ i3-14100T/i3-13100TE/i3-12100TE, up to 4 Cores, 12MB Cache, up to 4.4 GHz, 35W •Intel® Core™ 300T, up to 2 Cores, 6MB Cache, up to 3.4 GHz, 35W •Intel® Pentium® G7400E,2 Cores, 6MB Cache, 3.6 GHz, 46W •Intel® Pentium® G7400TE, 2 Cores, 6MB Cache, 3.0 GHz, 35W •Intel® Celeron® G6900E, 2 Cores, 4MB Cache, 3.0 GHz, 46W •Intel® Celeron® G6900TE, 2 Cores, 4MB Cache, 2.4 GHz, 35W |
| System Chipset | Intel® R680E Express Chipset |
| LAN Chipset | 2.5 GbE1: Intel I226, 2.5 GbE2: Intel I226 Support Wake-on-LAN and PXE, Support TSN |
| Audio Codec | Realtek ALC888S |
| System Memory | 2x 262-Pin DDR5 4800/5600MHz SODIMM. Max. up to 64GB (ECC and Non-ECC) |
| Graphics | Intel® UHD Graphics 770/710 |
| BIOS | AMI 256Mbit SPI BIOS |
| Watchdog | Software Programmable Supports 1~255 sec. System Reset |
| TPM | TPM 2.0 |
| Display | |
| Display Port | 2x DisplayPort, Support resolution 5120 x 3200, Up to 7680 x 4320 |
| DVI | 1x DVI-I, support resolution 1920 x 1200 |
| Multiple Display | Triple Display |
| VGA | Yes (by optional split cable) |
| Storage | |
| M.2 | 1x M.2 B Key, 2242/3042/3052 (PCIe x2, Support AI Module/NVMe Storage) (PCIe x1 & USB 3.2 Gen1, Support 4G/5G) |
| mSATA | 1x mSATA (Shared by 1x Mini PCI Express) |
| SIM Socket | 2x External SIM socket (Mini PCIE/M.2 B Key attached) |
| SSD/HDD | 1x 9mm 2.5" SATA HDD Bay (Internal) 1x 7mm 2.5" SATA HDD Bay (Hot-swappable) Support RAID 0, 1 |
| Expansion | |
| M.2 | 1x M.2 (E Key, PCIe x1, USB 2.0, 2230) |
| Mini PCIe | 1x Full-size Mini PCIe (1x shared by 1x mSATA) |
| Expansion Modules | |
| 2x EDGEBoost I/O Brackets | • 4-port GbE module with Intel® I350 Chipset, RJ-45/M12 connector (PoE optional) • 2-Port RJ45 10GbE with Intel X710 Chipset • 4-Port USB 3.0 (share PCIe Gen2 x1 bandwidth) • 1x M.2 B-Key, 2242 for AI/NVMe, 1x M.2 B-Key, 3042/3052 for 5G/AI/NVMe • 1x M.2 M-Key, PCIe x4 Lane, 2242/2260 for AI Module/NVMe • 1x M.2 for 5G (B Key, PCIe x1, USB 3.0, 3042/3052), 2x SIM socket, 1x SIM switch |
| Operating System | |
| Windows | Windows 10/11 |
| Linux | Linux kernel |
| I/O | |
| Audio | 1x Mic-in, 1x Line-out |
| CAN | 2x CAN 2.0 A/B 2-pin Internal header |
| COM | 2x RS-232/422/485 ; 4x RS-232/422/485 (Internal) |
| DIO | 8 in / 8 out (Isolated) |
| LAN | 2x RJ45 |
| EDGEBoost I/O Bracket | 2x EDGEBoost I/O Bracket (By mini PCIe interface) |
| USB | 8x USB 3.2 Gen 2 (10 Gbps) 1x USB 3.2 Gen 1 (5 Gbps, 1x Internal), 2x USB 2.0 (Internal) |
| Others | 5x WiFi Antenna Holes 1x Power Switch, 1x AT/ATX Switch, 1x Remote Power On/Off 1x PC/Car Mode Switch, 1x Delay Time Switch 1x Removable CMOS Battery |
| Power | |
| Power Adapter | Optional AC/DC 24V/9.2A, 220W Optional AC/DC 24V/15A, 360W (i7/i9 CPU) |
| Power Mode | AT, ATX |
| Power Ignition Sensing | Power Ignition Management |
| Power Supply Voltage | 9~48VDC |
| Power Connector | 5-pin Terminal Block |
| Power Protection | OVP (Over Voltage Protection); OCP (Over Current Protection) Reverse Protection |
| Environment | |
| Operating Temperature | -25°C to 70°C (35W CPU) -25°C to 60°C (65W CPU) (Optional External Fan Kit: Recommended for i9 CPU/65W) |
| Storage Temperature | -30°C to 85°C |
| Relative Humidity | 10% to 95% (non-condensing) |
| Certification | UL 62368 Ed. 3, CE, FCC Class A |
| Vibration | IEC60068-2-64:2008 With HDD: 1 Grms (5 - 500 Hz, 0.5 hr/axis) With SSD: 5 Grms (5 - 500 Hz, 0.5 hr/axis) Designed to comply with MIL-STD-810G Method 514.7 Procedure I |
| Shock | IEC60068-2-27:2008 With SSD: 50G half-sin 11ms Designed to comply with MIL-STD-810G Method 516.7 Procedure I |
| Physical | |
| Construction | 240 (W) x 261 (D) x 79 (H) mm |
| Weights | 4.5 kg |
| Construction | Extruded Aluminum with Heavy Duty Metal |
| Mounting Options | Wall Mounting |