AX-eBOX670-891-FL

Fanless Embedded System with LGA1151 Socket 7th/6th Gen Intel® Core™ i7/i5/i3 & Celeron® Processor, Intel® Q170

Anewtech-Systems-Embedded-PC-AI-Inference-System-AX-eBOX670-891-FL-Axiomtek
  • LGA1151 socket 7th/6th Intel® Core™ i7/i5/i3 & Celeron® processors (Kaby Lake/Skylake)
  • 260-pin DDR4-2133 SO-DIMM, up to 32GB
  • 2 internal PCI Express Mini Cards and 1 SIM slot for WLAN/WWAN/mSATA
  • 1 DisplayPort and 2 HDMI (1 HDMI 2.0) with triple view supported
  • Supports Jumbo Frame (9.5k), WoL, PXE Remote Boot, Teaming
  • 9 ~ 36 VDC wide range power input
  • Flexible I/O module design
Datasheet
AX-eBOX670-891-FL.pdf
Product Specification
CPULGA1151 socket
7th/6th gen Intel® Core™ i7/i5/i3 & Celeron® processor (CPU TDP max. up to 35 W)
ChipsetIntel® Q170
System Memory2 x 260-pin SO-DIMM DDR4-2133, up to 32 GB
BIOSAMI
COM4 x RS-232/422/485
USB6 x USB 3.0
2 x USB 2.0
Ethernet4 x 10/100/1000 Mbps (Intel® i210IT, i219LM)
Display2 x HDMI (1 x HDMI 2.0 & 1 x HDMI 1.4b)
1 x DisplayPort
Digital I/O32-channel programmable DI/DO
AudioMic-in/Line-out
Storage2 x 2.5" SATA HDD with RAID 0&1 (Max. up to 15 mm height)
1 x CFast™1 x mSATA
Expansion2 x Full-size PCI Express Mini Card (USB + PCI Express signal)
1 x SIM slot
Others4 x SMA type connector opening for antenna
1 x phoenix type VDC power input connector
1 x ATX power switch
1 x Remote power switch
1 x AT/ATX quick switch1 x Reset button
Power Supply9 - 36VDC
Watchdog Timer255 levels, 1 ~255 sec.
ConstructionAluminum extrusion and heavy-duty steel, IP40
Operating Temperature-40°C ~ +60°C (-40°F ~ +140°F) (with W.T. DRAM/SSD for Skylake)
-40°C ~ +55°C (-40°F ~ +131°F) (with W.T. DRAM/SSD for Kaby Lake)
Relative Humidity10% ~ 95% , non-condensing
Vibration3 Grms with CFast™ (5 - 500 Hz, X, Y, Z directions)
Dimensions(W x D x H)280 x 190 x 76 mm (11.02” x 7.48” x 2.99”)
Weight (net/gross)3.8 kg (8.37 lb)/ 4.6 kg (10.14 lb)
CertificateCE, FCC Class A
EOS SupportWE8S, Win 10 IoT, Linux
MountingWall mount, DIN-rail