I-TANK-XM810
High-Performance 10th / 11th Generation Intel® Core™ Processor Fanless Embedded Computer
- Intel® Core™ i3-10320 3.8 GHz (up to 4.6 GHz, quad-core, 65W TDP)
- Intel® Core™ i5-10500TE 2.3 GHz (up to 3.7 GHz, 6-core, 35W TDP)
- Intel® Core™ i7-10700TE 2.0 GHz (up to 4.4 GHz, 8-core, 35W TDP)
- 2 x 2.5GbE ports
- Multiple USB ports and serial ports
- Multiple internal expansion boards for flexible selection
- Various optional backplanes and chassis
- CE/FCC compliant
| Form factor | |
| SBC Form Factor | CPU: 10/11 th Gen Intel® Core™ CPU 35/65W Intel® Core™ i3-10320 3.8 GHz (up to 4.6 GHz, quad-core, 65W TDP) Intel® Core™ i5-10500TE 2.3 GHz (up to 3.7 GHz, 6-core, 35W TDP) Intel® Core™ i7-10700TE 2.0 GHz (up to 4.4 GHz, 8-core, 35W TDP) Chipset: Q470/Q470E System Memory: 2 x SO-DIMM DDR4 2933 MHz (up to 64GB) Power: DC Jack: 12 V~28 V DC Terminal Block: 12 V~28 V DC Consumption: 12V @ 8A (Intel ® Core™ i9-10900TE with 8GB memory) |
| I/O Interface | |
| I/O Ports | USB: 6 x USB 3.2 Gen 2 , 2 x USB 2.0 Ethernet: 2 x RJ-45: 2 x 2.5 GbE by Intel® I225V (colay I225LM) COM Port: 2 x RS-232/422/485, 4 x RS-232 Digital I/O: 12-bit Digital I/O (6-in/ 6-out) Display: 1 x HDMI , 1 x DP++ TPM: Support Intel PTT Watchdog Timer: Programmable 1 ~ 255 sec/min |
| Expansion Slots | |
| Expansion Slots | M.2: 2 x 2280 M-key (PCle x2) Backplane: Optional |
| System | |
| Cooling method / System Fan | Fanless 4-pin external system fan connector |
| Drive Bays | 1 x 2.5” SATA 6Gb/s HDD/SSD bay |
| Indicator&Buttons | |
| Buttons | 1 x Power button 1 x Reset button 1 x AT/ATX switch |
| Indicators | 1 x Power LED (green) 1 x HDD LED (yellow) |
| Physical Characteristics | |
| Construction | Extruded aluminum alloy |
| Color | |
| Color | Black |
| Dimensions | |
| Dimensions | 230.6 x 256.04 x 76.2 |
| Weight | |
| Weight | 3.2/3.5 kg |
| Environment | |
| Operating Temperature | -20°C ~ 60°C with air flow (CPU TDP35W & SSD) -20°C ~ 50°C with air flow (CPU TDP65W & SSD) |
| Humidity | 10% ~ 95% non-condensing |
| Operating Vibration | Half-sine wave shock 5G, 11ms, 100 shocks per axis (SSD) |
| Operating Shock | MIL-STD-810G 514.6C-1 (SSD) |
| Safety & EMC | CE/FCC compliant |
| OS Support | |
| OS Support | Microsoft Windows 10 / Windows 11, Linux |
Modular Edge AI Inference System: 10th Gen Intel® Core™ Outstanding Computing Power
I-TANK-XM810 features 11th/10th generation Intel® Core™ processors and comes with multiple I/O combinations and a modular expansion solution. With up to 8-core architecture and high-speed DDR4-2933 memory support, it provides low-latency edge responsiveness for data-driven industrial AI and machine vision applications
I-TANK-XM810 can support up to 65W processors and can operate in temperatures ranging from -20°C to 60°C. Moreover, the 10th Gen Core™ i7 CPU brings 50% better multi-tasking performance for compute-intensive application than 9th Gen CPU. DDR4 2933 MHz memory further increases speed by 10%. It is designed for use in harsh environments like digital surveillance, transportation system, machine vision and advanced manufacturing.
Highlights:
Flexible Expansion via PCIe/PCI slot
For performance upgradability and flexibility, I-TANK-XM810 supports eChassis and eBP modules to add edge inference capabilities. It also provides up to 7 system configuration options.
Users can select a specific package that provides extra PCIe expansion slots for add-on cards such as frame grabber cards, accelerator cards, I/O cards, motion control cards, and even GPU accelerators for machine learning and AI workloads.
Dual-Power Input Enables Performance Upgrade
I-TANK-XM810 provides a dual-power input solution for stably and efficiently powering the add-on cards requiring high power load. The IDD-X1228150 power board offers additional power for GPU cards and accelerators that require more than 75W. » 12-28V DC for host system » 12V DC or 16-28V DC for performance acceleration cards
Fanless System with Reliable Thermal Design
I-TANK-XM810 thermal design is optimized for better heat conduction using a pin-fin heatsink concept. This enhances two dimensional heat conduction and reduces flow impedance for better heat dissipation in this fan-less system. The overall weight and dimensions are thus reduced, significantly enhancing system reliability in vibration-sensitive applications, such as AGV. Moreover, this innovative thermal design allows the TANK-XM810 to maximize superior performance than those with traditional heatsink consisting of parallel fins.