SYS-111E-FWTR
1U Short-depth front I/O System with 2 x 10G ports, 2x 2.5" drive bays and AC redundant PSU
- 5th/4th Gen Intel® Xeon® Scalable processors (Sapphire Rapids)
- 8 DIMMs; Up to 2TB 3DS ECC DDR5-4800: RDIMM
- 2x 2.5" drive bays; 1 M.2 NVMe (PCIe 3.0 x2 from PCH)
- 6 heavy duty fans with optimal fan speed control; 1 Air Shroud(s)
- 800W AC Redundant Power Supplies Level
Datasheet
Product Specification
| Product SKUs | SuperServer SYS-111E-FWTR (Silver) |
| Motherboard | Super X13SEW-TF |
| Processor | |
| CPU | Single Socket E (LGA-4677) 5th and 4th Gen Intel® Xeon® Scalable processors |
| Core Count | Up to 32C/64T; Up to 60MB Cache per CPU |
| Note | Supports 85W - 350W TDP CPUs (Air Cooled)* *Air Cooled CPUs with TDP over 205W only supported under specific |
| System Memory | |
| Memory | Slot Count: 8 DIMM slots Max Memory (1DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM |
| Memory Voltage | 1.1 V |
| On-Board Devices | |
| SATA | SATA3 (6Gbps); RAID 0/1 support |
| Chipset | Intel® C741 |
| Network Connectivity | 2x 10GbE port(s) |
| IPMI | Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support |
| Input / Output | |
| LAN | 1 RJ45 Dedicated IPMI LAN port 2 RJ45 10GbE (Intel® X550-AT2) |
| USB | 2 USB 2.0 port(s) (2 USB)2 USB 3.0 port(s) (2 USB) |
| Video | 1 VGA port(s) |
| Others | 1x COM Port COM port |
| Management | |
| Software | IPMI 2.0 |
| Power Configurations | ACPI Power Management Power-on mode for AC power recovery |
| PC Health Monitoring | |
| CPU | Monitors for CPU Cores, Chipset Voltages, Memory |
| FAN | Fans with tachometer monitoring Pulse Width Modulated (PWM) fan connectors Status monitor for speed control |
| Temperature | CPU thermal trip support, PEPI Monitoring for CPU and chassis environment |
| Chassis | |
| Form Factor | 1U Rackmount |
| Model | CSE-515B-R801W |
| Dimensions and Weight | |
| Height | 1.7" (44.5mm) |
| Width | 17.2" (436.88mm) |
| Depth | 16.9" (429.3mm) |
| Package | 8" (H) x 27" (W) x 24" (D) |
| Weight | Net Weight: 10 lbs (4.54 kg) Gross Weight: 15 lbs (6.8 kg) |
| Available Color | Silver |
| Expansion Slots | |
| PCI-Express (PCIe) | 1 PCIe 5.0 x16 LP slot(s)2 PCIe 5.0 x16 FHFL slot(s) |
| Drive Bays / Storage | |
| Drive Bays | 2x 2.5" SATA drive bays |
| M.2 | 1x M-Key 22110/2280 (PCIe 3.0 x2 (NVMe)) |
| System Cooling | |
| Fans | 6 heavy duty fans with optimal fan speed control |
| Air Shroud | 1 Air Shroud(s) |
| Power Supply | 800W Redundant AC 100-240V Power Supplies with PMBus |
| Dimension (W x H x L) | 54.5 x 40 x 220 mm |
| Operating Environment | |
| Environmental Spec. | Operating Temperature: 0°C ~ 40°C (32°F ~ 104°F) Non-operating Temperature: -40°C to 70°C (-40°F to 158°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing) |
AI Edge Workloads
Short-Depth 5G/Edge & Hyper E
Compute and AI Performance at the Edge
Benefits & Advantages
- High-density systems for data center level performance at the Edge
- Flexible configurations with broad AI accelerator and AOC options
- Front I/O for easier serviceability in spaceconstrained environments
- Short-depth chassis design for easy deployment at edge locations
- Redundant AC or DC power supply options
Key Features
- Single 4th Gen Intel® Xeon® Scalable processor
- Dual 10 GbE connectivity
- Flexible configuration with 3 PCIe 5.0 x16 slots (2x FHFL and 1x LP)
- NEBS Level 3 design
- AC and DC power options available
5th Gen Intel® Xeon® Scalable Processors
- Up to 64 cores and 385W TDP per CPU
- Support for Intel Xeon® Max Series CPUs with High Bandwidth Memory
- Support for PCIe 5.0, DDR5 and CXL 1.1
- Built on the Intel® 7 process
- Built in accelerators:
- Intel AMX
- Intel® Dynamic Load Balancer
- Intel® QuickAssist
- Technology (QAT)
- Intel vRAN Boost
Delivering Solutions Optimized for Tomorrow’s Data Center Workloads
Complete Rack-Scale Solutions
- Full design, integration, validation and testing services for rack-scale and multi-rack clusters
- Complete rack-scale liquid cooling solutions developed in house
Performance and Energy Optimized
- Enhanced thermal capacity to support the highest performing CPUs and GPUs
- Optimized to run in high-temperature data center environments up to 40°C
Improved Security and Manageability
- Industry-standard compliance for hardware and silicon Root of Trust (RoT)
- Cryptographical attestation of components throughout the entire supply chain
Supports Open Industry Standards
- The latest industry technologies including PCIe 5.0, DDR5, and CXL
- Open Compute Project (OCP) standards including OCP 3.0, OAM, ORV2 and OSF as well as Open BMC