AS-3015MR-H8TNR
Microcloud A+ Server supports 8 set of AMD Ryzen (Zen4) CPU, AM5 Socket, LGA-1718
- 8 set of AMD Ryzen (Zen4) CPU, AM5 Socket, LGA-1718.
- AMD Knoll - Integrated I/O Controller Hub
- 8 set of Up to 128GB ECC/non ECC UDIMM; DDR5 5200MHz, in 4 DIMM sockets
- 8 set of PCIe 5.0 x8 (in x16 slot) low profile slot and 8 set of Micro-LP slots (MicroLP upgradable)
- 8 set of 2x Front NVMe U.2/ SAS/ SATA3 drives w/ optional kits
- 2200W Redundant 80+ Titanium Level high-efficiency power supplies
Key Applications
- Cloud Computing
- Web/Collocation Services
- Web Cache, CDN, Video Streaming
- Social Networking, Downloads
- Corporate - WINS, DNS, Print, Login
Datasheet
Product Specification
Product SKUs | A+ Server AS -3015MR-H8TNR |
Motherboard | Super H13SRD-F |
Processor (per Node) | |
CPU | Single Socket AM5 (LGA-1718) AMD Ryzen™ Zen4 7000 series Processors |
Core Count | Up to 16C/32T; Up to 16MB Cache per CPU |
Note | Supports 65W - 170W TDP CPUs (Air Cooled)* *Air Cooled CPUs with TDP over 120W only supported under specific conditions. |
GPU | |
Max GPU Count | Up to 1 single-width GPU(s) |
Supported GPU | NVIDIA PCIe: T4,A2,L4 |
System Memory (per Node) | |
Memory | Slot Count: 4 DIMM slots Max Memory (2DPC): Up to 128 5200MT/s non-ECC DDR5 UDIMM |
On-Board Devices (per Node) | |
NVMe | U.2 NVMe (Native) |
Chipset | AMD Knoll - Integrated I/O Controller Hub |
Network Connectivity | No NIC option supported |
Input / Output (per Node) | |
NVMe | 2 U.2 NVMe |
LAN | 2 |
Video | 1 VGA port(s) |
Serial Port | 1 COM Port(s) (1 KVM) |
System BIOS | |
BIOS Type | AMI 128MB SPI Flash EEPROM |
Management | |
Power Configurations | ACPI 6.0 Power Management Power-on mode for AC power recovery |
Security | |
Hardware | Trusted Platform Module (TPM) 2.0 |
PC Health Monitoring | |
CPU | 3-Phase-switching voltage regulator with auto-sense from 0.5V-2.3V Monitors for CPU Cores, +3.3V, +5V, +12V, +3.3V Standby, +5V Standby, VBAT, Memory, Chipset Voltages. |
FAN | Cooling zone |
Temperature | Monitoring for CPU and chassis environment |
Chassis | |
Form Factor | 3U Rackmount |
Model | CSE-938NH-R2K20BP2 |
Dimensions and Weight | |
Height | 5.21" (132mm) |
Width | 17.26" (438mm) |
Depth | 23.2" (589mm) |
Package | 11.65" (H) x 26.26" (W) x 34" (D) |
Weight | Net Weight: 62.2 lbs (28.21 kg) Gross Weight: 88 lbs (39.92 kg) |
Available Color | N/A |
Front Panel | |
Buttons | Power On/Off |
LEDs | 8 Individual Node Status Indicators Power Failure |
Expansion Slots (per Node) | |
PCI-Express (PCIe) | 1 PCIe 5.0 x16 LP slot(s) 1 PCIe 5.0 x8 MLP slot(s) |
Drive Bays / Storage (per Node) | |
Hot-swap | 2x 3.5" hot-swap NVMe/SAS/SATA drive bays 2 U.2 NVMe drive support Native |
M.2 | 1 M.2 NVMe |
System Cooling | |
Fans | 4x 8cm heavy duty fans with optimal fan speed control |
Air Shroud | 8 Air Shroud(s) |
Power Supply | 2200W Redundant Titanium Level power supplies |
Operating Environment | |
RoHS | RoHS Compliant |
Environmental Spec. | Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 70°C (-40°F to 158°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing) |
High Density Multi-Node System for the Cloud
Many cloud applications need dedicated servers with bare-metal performance. Powered by AMD Ryzen™ 7000 Series processors, the 3U, multi-node AS -3015MR-H8TNR MicroCloud is an easyto-configure system with 8 single-processor nodes delivering excellent node density.
You reap the benefits of low power consumption through shared power and cooling infrastructure, and affordable pricing that is favorable compared to the same number of 1U servers. With hot-swappable nodes, the system is easy to maintain and also easy to upgrade with future nodes.
3U, 8-Node-Per-Chassis Flexible Architecture
Maximize resource savings through shared power and cooling with the following resources per node:
- Single AMD Ryzen™ 7000 Series processor
- Up to 128 GB DDR5-5200 memory
- Two U.2 NVMe drives and one M.2 NVMe
- One PCIe 5.0 expansion slot
- Flexible networking options with PCIe 5.0
- MicroLP interfaces
- Redundant Titanium level shared power supplies