2U 4-Node BigTwin Server. 6 hot-swap 2.5" NVMe/SAS/SATA drives per node

Anewtech Systems Supermicro Servers Supermicro Singapore  SuperServer SYS-221BT-HNC8R Industrial Twin Server Supermicro Computer 4 Hot-plug System Nodes in 2U  SYS-221BT-HNC8R

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

  • Socket E (LGA 4677) support 5th/4th Gen Intel® Xeon® Scalable processors
  • Intel® C741
  • Up to 16 DIMMs ECC DDR5 Slots
    • 2 PCIe 5.0 x16 (LP) slot;
    • Tool-less support
    • Internal PCIe 4.0 x8 for 2 M.2 NVMe support onboard
    • Optional M.2 NVMe Boot Controller via SCC-A2NM2241G3-B1
  • Network connectivity via AIOM (OCP 3.0 compliant)
    • 6 hot-swap 2.5" drive bays (2x PCIe 5.0 NVMe and 4x PCIe 4.0 NVMe/SAS)
    • Built-in SAS3 Support via Broadcom 3808; IT Mode
    • 4 cooling fans per 2U enclosure, 16K RPM; Shared Cooling Design, Counter-Rotating
    • Liquid Cooling Support
  • 3000W Redundant Power Supplies Titanium Level (96%+); Shared Power Design
Product Specification
Anewtech Systems Supermicro Servers Supermicro Singapore Twin-Server-Supermicro-SYS-221BT-HNC8R-Superserver
Product SKUSuperServer SYS-221BT-HNC8R (Black front & silver body)
MotherboardSuper X13DET-B
Processor (per Node)
CPUDual Socket E (LGA 4677) 5th/4th Gen Intel® Xeon® Scalable processors
Intel Xeon CPU Max Series with high bandwidth memory (HBM)
CoresUp to 32C/64T; Up to 105MB Cache
NoteSupports up to 205W TDP CPUs (Aircooled)*   
Supports up to 350W TDP CPUs (Liquid Cooled)   
*CPUs (air cooled) with TDP over 205W are only supported under specific conditions. 
System Memory (per Node)
MemorySlot Count: 16 DIMM slots
Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM
On-Board Devices (per Node)
SASSAS3 (12Gbps) via Broadcom® 3808 (IT mode)
ChipsetIntel® C741
Network ConnectivityVia AIOM
IPMISupport for Intelligent Platform Management Interface v.2.0   
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output (per Node)
LAN1 RJ45 Dedicated BMC LAN port
USB2 USB 3.1 port(s) (2 rear)
Video1 VGA port(s)
Others2x M.2 for boot drive or caching     
M.2 form factor: NVMe double-sided 22x110mm   
Note: Enterprise-grade M.2 only for caching application
System BIOS
SoftwareSupemicro Out of Band (OOB) License (Included per Node)   
SuperCloud Composer   
Intel® Node Manager   
KVM with dedicated LAN   
IPMI 2.0   
Watch Dog   
SuperDoctor® 5
Power ConfigurationsACPI / APM Power Management
PC Health Monitoring
CPU8+4 Phase-switching voltage regulator   
Monitors for CPU Cores, Chipset Voltages, Memory.
FANFans with tachometer monitoring   
Pulse Width Modulated (PWM) fan connectors   
Status monitor for speed control
TemperatureMonitoring for CPU and chassis environment
Form Factor2U Rackmount
Dimensions and Weight
Height3.47" (88mm)
Width17.68" (449mm)
Depth28.75" (730mm)
Package9.76" (H) x 24.65" (W) x 45.28" (D)
WeightNet Weight: 66.1 lbs (30 kg)   
Gross Weight: 96.6 lbs (43.8 kg)
Available ColorBlack front & silver body
Front Panel
ButtonsPower On/Off button   
UID button
LEDsHDD activity LED   
Network activity LEDs   
Power status LED   
Universal Information (UID) LED
Expansion Slots (per Node)
PCI-Express (PCIe)2 PCIe 5.0 x16 LP slot(s)
Drive Bays / Storage (per Node)
Hot-swap6x 2.5" hot-swap NVMe/SAS drive bays   
(2x PCI-E 5.0 NVMe and 4x PCI-E 4.0 NVMe/SAS)
M.22 M.2 NVMe
System Cooling
Fans4x 16K RPM Counter Rotating 8cm Fan(s)
Liquid CoolingDirect to Chip (D2C) Cold Plate (optional)
Power Supply3000W 1U Redundant Power Supply
Total Output Power3000W : 208 - 240 Vac   
3000W : 240 - 240 Vdc for CQC only
Dimension (W x H x L)45 x 40 x 480 mm
AC Input1400W: 100-127Vac / 50-60Hz   
2880W: 200-207Vac / 50-60Hz   
3000W: 208-240Vac / 50-60Hz
DC Input3000W: 240-240Vdc for CQC only/ 50-60Hz
12V SBMax: 4.5A / Min: 0A
Operating Environment
RoHSRoHS Compliant
Environmental Spec.Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)   
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)   
Operating Relative Humidity: 8% to 90% (Non-Condensing)   
Non-operating Relative Humidity: 5% to 95% (Non-Condensing)

Highly Modular Multi-Node Systems with Tool-Less Design 

Supermicro X13 BigTwin® systems provide superior performance and serviceability with dual 5th/4th Gen Intel® Xeon® Scalable processors per node and hot-swappable tool-less design.

Superior modular mid-plane design with NVMe Gen 5 storage controller options. Optimized for density (2U4N) or storage (2U2N), BigTwin® systems with shared components can be more cost effective than standard 1U servers.

Anewtech-Systems-Twin-Server-Supermicro-SYS-221BT-HNC8R-superserver Supermicro Servers Supermicro Singapore

2U 4-Node BigTwin®


Industry-leading Multi-node Architectures

  • Highly configurable 2U 4-node systems optimized for density or storage
  • Optimized thermal design for dual socket 5th/4th Gen Intel® Xeon® Scalable processors
  • Optional direct-to-chip liquid cooling for increased thermal capacity
  • 16 DIMM slots per node supporting DDR5-5600MT/s
  • All-hybrid hot-swappable NVMe/SAS/SATA drive bays
  • Flexible networking with up to 400G Ethernet per node

Highly Modular Multi-Node Systems optimized for density or storage


SYS-621BT-H Series

2U 4-Node 
3x 3.5” NVMe/SAS/SATA drives (per node)


SYS-221BT-H Series

2U 4-Node
6x 2.5” NVMe/SAS/SATA drives (per node)


SYS-621BT-D Series

2U 2-Node
6x 3.5” NVMe/SAS/SATA drives (per node)


SYS-221BT-D Series

2U 2-Node 
12x 2.5” NVMe/SAS/SATA drives (per node)


5th Gen Intel® Xeon® Scalable Processors

  • Up to 64 cores and 385W TDP per CPU
  • Support for Intel Xeon® Max Series CPUs with High Bandwidth Memory
  • Support for PCIe 5.0, DDR5 and CXL 1.1
  • Built on the Intel® 7 process
  • Built in accelerators:
    • Intel AMX
    • Intel® Dynamic Load Balancer
    • Intel® QuickAssist
    • Technology (QAT)
    • Intel vRAN Boost

Delivering Solutions Optimized for Tomorrow’s Data Center Workloads

Complete Rack-Scale Solutions

  • Full design, integration, validation and testing services for rack-scale and multi-rack clusters
  • Complete rack-scale liquid cooling solutions developed in house

Performance and Energy Optimized

  • Enhanced thermal capacity to support the highest performing CPUs and GPUs
  • Optimized to run in high-temperature data center environments up to 40°C

Improved Security and Manageability

  • Industry-standard compliance for hardware and silicon Root of Trust (RoT)
  • Cryptographical attestation of components throughout the entire supply chain

Supports Open Industry Standards

  • The latest industry technologies including PCIe 5.0, DDR5, and CXL
  • Open Compute Project (OCP) standards including OCP 3.0, OAM, ORV2 and OSF as well as Open BMC