SYS-221BT-HNC8R
2U 4-Node BigTwin Server. 6 hot-swap 2.5" NVMe/SAS/SATA drives per node
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
- Socket E (LGA 4677) support 5th/4th Gen Intel® Xeon® Scalable processors
- Intel® C741
- Up to 16 DIMMs ECC DDR5 Slots
- 2 PCIe 5.0 x16 (LP) slot;
- Tool-less support
- Internal PCIe 4.0 x8 for 2 M.2 NVMe support onboard
- Optional M.2 NVMe Boot Controller via SCC-A2NM2241G3-B1
- Network connectivity via AIOM (OCP 3.0 compliant)
- 6 hot-swap 2.5" drive bays (2x PCIe 5.0 NVMe and 4x PCIe 4.0 NVMe/SAS)
- Built-in SAS3 Support via Broadcom 3808; IT Mode
- 4 cooling fans per 2U enclosure, 16K RPM; Shared Cooling Design, Counter-Rotating
- Liquid Cooling Support
- 3000W Redundant Power Supplies Titanium Level (96%+); Shared Power Design
Key Applications
- Container-as-a-Service; Application Accelerator
- Diskless HPC Clusters
- All-Flash Hyperconverged Infrastructure
Datasheet
Product Specification
| Product SKU | SuperServer SYS-221BT-HNC8R (Black front & silver body) |
| Motherboard | Super X13DET-B |
| Processor (per Node) | |
| CPU | Dual Socket E (LGA 4677) 5th/4th Gen Intel® Xeon® Scalable processors Intel Xeon CPU Max Series with high bandwidth memory (HBM) |
| Cores | Up to 32C/64T; Up to 105MB Cache |
| Note | Supports up to 205W TDP CPUs (Aircooled)* Supports up to 350W TDP CPUs (Liquid Cooled) *CPUs (air cooled) with TDP over 205W are only supported under specific conditions. |
| System Memory (per Node) | |
| Memory | Slot Count: 16 DIMM slots Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM |
| On-Board Devices (per Node) | |
| SAS | SAS3 (12Gbps) via Broadcom® 3808 (IT mode) |
| Chipset | Intel® C741 |
| Network Connectivity | Via AIOM |
| IPMI | Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support |
| Input / Output (per Node) | |
| LAN | 1 RJ45 Dedicated BMC LAN port |
| USB | 2 USB 3.1 port(s) (2 rear) |
| Video | 1 VGA port(s) |
| Others | 2x M.2 for boot drive or caching M.2 form factor: NVMe double-sided 22x110mm Note: Enterprise-grade M.2 only for caching application |
| System BIOS | |
| BIOS Type | AMI 32MB Flash ROM |
| Management | |
| Software | Supemicro Out of Band (OOB) License (Included per Node) SuperCloud Composer SSM Intel® Node Manager SPM KVM with dedicated LAN IPMI 2.0 SUM Watch Dog SuperDoctor® 5 |
| Power Configurations | ACPI / APM Power Management |
| PC Health Monitoring | |
| CPU | 8+4 Phase-switching voltage regulator Monitors for CPU Cores, Chipset Voltages, Memory. |
| FAN | Fans with tachometer monitoring Pulse Width Modulated (PWM) fan connectors Status monitor for speed control |
| Temperature | Monitoring for CPU and chassis environment |
| Chassis | |
| Form Factor | 2U Rackmount |
| Model | CSE-217BQ2-R3K04P |
| Dimensions and Weight | |
| Height | 3.47" (88mm) |
| Width | 17.68" (449mm) |
| Depth | 28.75" (730mm) |
| Package | 9.76" (H) x 24.65" (W) x 45.28" (D) |
| Weight | Net Weight: 66.1 lbs (30 kg) Gross Weight: 96.6 lbs (43.8 kg) |
| Available Color | Black front & silver body |
| Front Panel | |
| Buttons | Power On/Off button UID button |
| LEDs | HDD activity LED Network activity LEDs Power status LED Universal Information (UID) LED |
| Expansion Slots (per Node) | |
| PCI-Express (PCIe) | 2 PCIe 5.0 x16 LP slot(s) |
| Drive Bays / Storage (per Node) | |
| Hot-swap | 6x 2.5" hot-swap NVMe/SAS drive bays (2x PCI-E 5.0 NVMe and 4x PCI-E 4.0 NVMe/SAS) |
| M.2 | 2 M.2 NVMe |
| System Cooling | |
| Fans | 4x 16K RPM Counter Rotating 8cm Fan(s) |
| Liquid Cooling | Direct to Chip (D2C) Cold Plate (optional) |
| Power Supply | 3000W 1U Redundant Power Supply |
| Total Output Power | 3000W : 208 - 240 Vac 3000W : 240 - 240 Vdc for CQC only |
| Dimension (W x H x L) | 45 x 40 x 480 mm |
| AC Input | 1400W: 100-127Vac / 50-60Hz 2880W: 200-207Vac / 50-60Hz 3000W: 208-240Vac / 50-60Hz |
| DC Input | 3000W: 240-240Vdc for CQC only/ 50-60Hz |
| 12V SB | Max: 4.5A / Min: 0A |
| Operating Environment | |
| RoHS | RoHS Compliant |
| Environmental Spec. | Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (Non-Condensing) Non-operating Relative Humidity: 5% to 95% (Non-Condensing) |
Highly Modular Multi-Node Systems with Tool-Less Design
Supermicro X13 BigTwin® systems provide superior performance and serviceability with dual 5th/4th Gen Intel® Xeon® Scalable processors per node and hot-swappable tool-less design.
Superior modular mid-plane design with NVMe Gen 5 storage controller options. Optimized for density (2U4N) or storage (2U2N), BigTwin® systems with shared components can be more cost effective than standard 1U servers.
2U 4-Node BigTwin®
Industry-leading Multi-node Architectures
- Highly configurable 2U 4-node systems optimized for density or storage
- Optimized thermal design for dual socket 5th/4th Gen Intel® Xeon® Scalable processors
- Optional direct-to-chip liquid cooling for increased thermal capacity
- 16 DIMM slots per node supporting DDR5-5600MT/s
- All-hybrid hot-swappable NVMe/SAS/SATA drive bays
- Flexible networking with up to 400G Ethernet per node
Highly Modular Multi-Node Systems optimized for density or storage
5th Gen Intel® Xeon® Scalable Processors
- Up to 64 cores and 385W TDP per CPU
- Support for Intel Xeon® Max Series CPUs with High Bandwidth Memory
- Support for PCIe 5.0, DDR5 and CXL 1.1
- Built on the Intel® 7 process
- Built in accelerators:
- Intel AMX
- Intel® Dynamic Load Balancer
- Intel® QuickAssist
- Technology (QAT)
- Intel vRAN Boost
Delivering Solutions Optimized for Tomorrow’s Data Center Workloads
Complete Rack-Scale Solutions
- Full design, integration, validation and testing services for rack-scale and multi-rack clusters
- Complete rack-scale liquid cooling solutions developed in house
Performance and Energy Optimized
- Enhanced thermal capacity to support the highest performing CPUs and GPUs
- Optimized to run in high-temperature data center environments up to 40°C
Improved Security and Manageability
- Industry-standard compliance for hardware and silicon Root of Trust (RoT)
- Cryptographical attestation of components throughout the entire supply chain
Supports Open Industry Standards
- The latest industry technologies including PCIe 5.0, DDR5, and CXL
- Open Compute Project (OCP) standards including OCP 3.0, OAM, ORV2 and OSF as well as Open BMC