2U 4-Node BigTwin Server. 3 hot-swap 3.5" NVMe/SATA drives per node 

Anewtech Systems Supermicro Servers Supermicro Singapore  SuperServer SYS-621BT-HNTR  Industrial Twin Server Supermicro Computer 4 Hot-plug System Nodes in 2U SYS-221BT-HNTR

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

  • Socket E (LGA 4677) support 5th/4th Gen Intel® Xeon® Scalable processors
  • Intel® C741
  • Up to 16 DIMMs ECC DDR5 Slots
    • 2 PCIe 5.0 x16 (LP) slot;
    • Tool-less support
    • Internal PCIe 4.0 x8 for 2 M.2 NVMe support onboard
    • Optional M.2 NVMe Boot Controller via SCC-A2NM2241G3-B1
  • Network connectivity via AIOM (OCP 3.0 compliant)
  • 3 hot-swap 3.5" drive bays (2x PCIe 5.0 NVMe and 1x PCIe 4.0 NVMe/SATA)
    • 4 cooling fans per 2U enclosure, 14.9K RPM; Shared Cooling Design
    • Liquid Cooling Support
  • 3000W Redundant Power Supplies Titanium Level (96%+); Shared Power Design
Product Specification
Anewtech Systems Supermicro Servers Supermicro Singapore Twin-Server-Supermicro-SYS-621BT-HNTR-Superserver
Product SKUSuperServer SYS-621BT-HNTR (Black front & silver body)
MotherboardSuper X13DET-B
Processor (per Node)
CPUDual Socket E (LGA 4677) 5th/4th Gen Intel® Xeon® Scalable processors
Intel Xeon CPU Max Series with high bandwidth memory (HBM)
CoresUp to 32C/64T; Up to 82.5MB Cache
NoteSupports up to 185W TDP CPUs (Aircooled)* 
Supports up to 350W TDP CPUs (Liquid Cooled) 
*CPUs (air cooled) with TDP over 185W are only supported under specific conditions. Contact customer support for details.
System Memory (per Node)
MemoryMemory Capacity: 16 DIMM slots 
Up to 4TB: 16x 256 GB DRAM 
Memory Type: 4800MHz ECC DDR5 RDIMM
On-Board Devices (per Node)
ChipsetIntel® C741
Network ConnectivityVia AIOM
IPMISupport for Intelligent Platform Management Interface v.2.0 
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output (per Node)
LAN1 RJ45 Dedicated BMC LAN port
USB2 USB 3.1 port(s) (2 rear)
Video1 VGA port(s)
Others2x M.2 for boot drive or caching   
M.2 form factor: NVMe double-sided 22x110mm 
Note: Enterprise-grade M.2 only for caching application
System BIOS
SoftwareSupemicro Out of Band (OOB) License (Included per Node) 
SuperCloud Composer 
Intel® Node Manager 
KVM with dedicated LAN 
IPMI 2.0 
Watch Dog 
SuperDoctor® 5
Power ConfigurationsACPI / APM Power Management
PC Health Monitoring
CPU8+4 Phase-switching voltage regulator 
Monitors for CPU Cores, Chipset Voltages, Memory.
FANFans with tachometer monitoring 
Pulse Width Modulated (PWM) fan connectors 
Status monitor for speed control
TemperatureMonitoring for CPU and chassis environment
Form Factor2U Rackmount
Dimensions and Weight
Height3.47" (88mm)
Width17.68" (449mm)
Depth30.5" (774mm)
Package9.76" (H) x 24.65" (W) x 45.28" (D)
WeightNet Weight: 66.1 lbs (30 kg) 
Gross Weight: 96.6 lbs (43.8 kg)
Available ColorBlack front & silver body
Front Panel
ButtonsPower On/Off button 
UID button
LEDsHDD activity LED 
Network activity LEDs 
Power status LED 
Universal Information (UID) LED
Expansion Slots (per Node)
PCI-Express (PCIe)2 PCIe 5.0 x16 LP slot(s)
Drive Bays / Storage (per Node)
Hot-swap3x 3.5" hot-swap NVMe/SATA drive bays 
(2x PCI-E 5.0 NVMe and 1x PCI-E 4.0 NVMe/SATA)
M.22 M.2 NVMe
System Cooling
Fans4x 14.9K RPM Heavy Duty 8cm Fan(s)
Liquid CoolingDirect to Chip (D2C) Cold Plate (optional)
Power Supply3000W 1U Redundant Power Supply
Total Output Power3000W : 208 - 240 Vac 
3000W : 240 - 240 Vdc for CQC only
Dimension (W x H x L)45 x 40 x 480 mm
AC Input1400W: 100-127Vac / 50-60Hz 
2880W: 200-207Vac / 50-60Hz 
3000W: 208-240Vac / 50-60Hz
DC Input3000W: 240-240Vdc for CQC only/ 50-60Hz
12V SBMax: 4.5A / Min: 0A
Operating Environment
RoHSRoHS Compliant
Environmental Spec.Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) 
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) 
Operating Relative Humidity: 8% to 90% (Non-Condensing) 
Non-operating Relative Humidity: 5% to 95% (Non-Condensing)

Highly Modular Multi-Node Systems with Tool-Less Design 

Supermicro X13 BigTwin® systems provide superior performance and serviceability with dual 5th/4th Gen Intel® Xeon® Scalable processors per node and hot-swappable tool-less design.

Superior modular mid-plane design with NVMe Gen 5 storage controller options. Optimized for density (2U4N) or storage (2U2N), BigTwin® systems with shared components can be more cost effective than standard 1U servers.


2U 4-Node BigTwin®


Industry-leading Multi-node Architectures

  • Highly configurable 2U 4-node systems optimized for density or storage
  • Optimized thermal design for dual socket 5th/4th Gen Intel® Xeon® Scalable processors
  • Optional direct-to-chip liquid cooling for increased thermal capacity
  • 16 DIMM slots per node supporting DDR5-5600MT/s
  • All-hybrid hot-swappable NVMe/SAS/SATA drive bays
  • Flexible networking with up to 400G Ethernet per node

Highly Modular Multi-Node Systems optimized for density or storage


SYS-621BT-H Series

2U 4-Node 
3x 3.5” NVMe/SAS/SATA drives (per node)


SYS-221BT-H Series

2U 4-Node
6x 2.5” NVMe/SAS/SATA drives (per node)


SYS-621BT-D Series

2U 2-Node
6x 3.5” NVMe/SAS/SATA drives (per node)


SYS-221BT-D Series

2U 2-Node 
12x 2.5” NVMe/SAS/SATA drives (per node)


5th Gen Intel® Xeon® Scalable Processors

  • Up to 64 cores and 385W TDP per CPU
  • Support for Intel Xeon® Max Series CPUs with High Bandwidth Memory
  • Support for PCIe 5.0, DDR5 and CXL 1.1
  • Built on the Intel® 7 process
  • Built in accelerators:
    • Intel AMX
    • Intel® Dynamic Load Balancer
    • Intel® QuickAssist
    • Technology (QAT)
    • Intel vRAN Boost

Delivering Solutions Optimized for Tomorrow’s Data Center Workloads

Complete Rack-Scale Solutions

  • Full design, integration, validation and testing services for rack-scale and multi-rack clusters
  • Complete rack-scale liquid cooling solutions developed in house

Performance and Energy Optimized

  • Enhanced thermal capacity to support the highest performing CPUs and GPUs
  • Optimized to run in high-temperature data center environments up to 40°C

Improved Security and Manageability

  • Industry-standard compliance for hardware and silicon Root of Trust (RoT)
  • Cryptographical attestation of components throughout the entire supply chain

Supports Open Industry Standards

  • The latest industry technologies including PCIe 5.0, DDR5, and CXL
  • Open Compute Project (OCP) standards including OCP 3.0, OAM, ORV2 and OSF as well as Open BMC