AS-2126FT-HE-LCC
2U 4-Node FlexTwin™ Server with liquid cooling
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
- Dual AMD EPYC™ 9005/9004 Series Processors up to 500W with liquid cooling
- Up to 24 DIMMs supporting up to 9TB DDR5-6000 in 1DPC
- Flexible networking with up to 1 OCP 3.0 compatible AIOM slots
- Optional 1 PCIe 5.0 x16 FHHL slot + 1 PCIe 5.0 x16 LP slot
- Optional 2 E1.S Slots + Optional 2 M.2 NVME drive Slots
- 4 Redundant Up to 3200W Titanium Level Power Supplies
Key Applications
- Oil & Gas
- Scientific Research
- High Performance Computing (HPC)
- Research Lab
Datasheet
Product Specification
Featured Server Specs
Memory Slots & Capacity
- 24 DIMM slots for DDR5-6000 MHz RDIMM; up to 9 TB registered ECC
Processor Support
- Dual SP5 socket for up to two AMD EPYC™ 9005 Series processor. Up to 192 cores, up to 500W TDP per socket†
Storage
- Up to 2 E1.S drives per node (optional).
- Up to 2 M2 drives with optional hardware RAID per node
I/O Ports
- 1 RJ45 Dedicated IPMI LAN port
- 2 USB 3.0 ports (front)
- 1 VGA (front)
- 1 TPM 2.0 header
- Hardware root of trust
Shared Power
- 2–4 Titanium Level power supplies up to 3200W with N or N+N availability configurations
Expansion Slots
- 1 full-height,half-length, PCIe Gen 5 x16 slot (front, optional)
- 1 low-profile PCIe Gen 5 x16 (rear)
- 1 PCIe Gen 5 x16 AIOM/OCP 3.0 slot (rear)
| Product SKUs | A+ Server AS -2126FT-HE-LCC |
| Motherboard | Super H14DST-F |
| Processor (per Node) | |
| CPU | Dual processor(s) AMD EPYC™ 9005/9004 Series Processors |
| Core Count | Up to 192C/384T; Up to 512MB Cache per CPU |
| Note | Supports up to 500W TDP CPUs (Liquid Cooled) |
| System Memory (per Node) | |
| Memory | Slot Count: 24 DIMM slots Max Memory (1DPC): Up to 9TB 6000MT/s ECC DDR5 RDIMM |
| On-Board Devices (per Node) | |
| Chipset | System on Chip |
| Network Connectivity | Via AIOM |
| IPMI | Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support |
| Input / Output (per Node) | |
| LAN | 1 RJ45 1 GbE Dedicated BMC LAN port |
| USB | 2 USB 3.0 ports(front) |
| Video | 1 VGA port |
| TPM | 1 TPM Onboard/port 80 |
| System BIOS | |
| BIOS Type | AMI 64MB SPI Flash EEPROM |
| BIOS Features | Plug and Play (PnP) UEFI 2.8 USB Keyboard support ACPI 6.5 SMBIOS 3.7 or later |
| Management | |
| Software | Supermicro Server Manager (SSM) Super Diagnostics Offline (SDO) KVM with dedicated LAN Supermicro Thin-Agent Service (TAS) SuperServer Automation Assistant (SAA) New! |
| Power configurations | ACPI/APM Power Management Power-on mode control for AC power loss recovery Power button override mechanism, |
| Security | |
| Hardware | Trusted Platform Module (TPM) 2.0 Silicon Root of Trust (RoT) – NIST 800-193 Compliant |
| Features | Cryptographically Signed Firmware Secure Boot Secure Firmware Updates Automatic Firmware Recovery Supply Chain Security: Remote Attestation Runtime BMC Protections System Lockdown |
| PC Health Monitoring | |
| CPU | Monitors for CPU Cores, Chipset Voltages, Memory |
| FAN | Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors |
| Temperature | Monitoring for CPU and chassis environment |
| Voltage | System temperature, Memory temperature, CPU temperature, 3.3V standby, +5V standby, +5V, +3.3V, +12V, CPU thermal trip support |
| Chassis | |
| Form Factor | 2U Rackmount |
| Model | CSE-F214EC-000NP |
| Dimensions and Weight | |
| Height | 3.46" (88 mm) |
| Width | 17.67" (449 mm) |
| Depth | 37.09" (942 mm) |
| Package | 10.83" (H) x 27.29" (W) x 50.32" (D) |
| Weight | Gross Weight: 72.45 lbs (32.86 kg) Net Weight: 54.9 lbs (24.93 kg) |
| Available Color | Silver |
| Expansion Slots (per Node) | |
| PCI-Express (PCIe) Configuration | Default 1 PCIe 5.0 x16 LP slot 1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible) Option A* 1 PCIe 5.0 x16 (in x16) LP slot 1 PCIe 5.0 x16 (in x16) AIOM slot (OCP 3.0 compatible) 1 PCIe 5.0 x16 (in x16) FHHL slot (*Requires additional parts. |
| M.2 | 2 M.2 NVMe slots (M-key 22110(default); Optional Configuration) |
| Drive Bays / Storage (per Node) | |
| Drive Bays Configuration | Option A: Total 2 bays |
| M.2 | 2 M.2 PCIe 5.0 x4 NVMe slots (M-key 22110; Optional Configuration) |
| System Cooling | |
| Fans | 16 counter-rotating 40x40x56mm Fan(s) |
| Liquid Cooling | Direct to Chip (D2C) Cold Plate |
| Power Supply | |
| 4x 2000W | 4x 2000W Redundant (2 + 2) Titanium Level (96%) power supplies |
| 4x 2700W | 4x 2700W Redundant (2 + 2) Titanium Level (96%) power supplies |
| 4x 3200W | 4x 3200W Redundant (2 + 2) Titanium Level (96%) power supplies |
| Operating Environment | |
| ROHS | RoHS Compliant |
| Environmental Spec. | Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 70°C (-40°F to 158°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing) |
Supermicro New FlexTwin™ HPC-at-Scale Solution
Supermicro’s new FlexTwin is a liquid cooled dual processor multi-node architecture optimized for maximum performance density at rack scale.
With highly customizable storage, networking, and power supply options, FlexTwin is ideal for demanding HPC workloads including financial services, manufacturing, scientific research, and complex modeling.
Watch our short video to learn more!
Supermicro Rack-Scale HPC Servers with FlexTwin™ Accelerate Application Performance
New Supermicro High Density Rack-Scale Solution for HPC at Scale
H14 White Paper
Leading Performance and Power Efficiency with Supermicro Solutions Featuring AMD AMD EPYC™ 9005 series processors