SYS-222FT-HEA-LCC

2U 4-Node FlexTwin™ with 2 hot-swap E1.S drives per node

Anewtech-Systems-Twin-Server-Supermicro-FlexTwin-SuperServer-SYS-222FT-HEA-LCC 2U 4-Node FlexTwin

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

  • Dual Intel® Xeon® 6900 Series Processors with P-cores up to 500W with liquid cooling
  • Up to 24 DIMMs supporting up to 6TB 6400MT/s DDR5 RDIMM or 3TB 8800MT/s DDR5 MRDIMM
  • Flexible networking with up to 1 OCP 3.0 compatible AIOM slots
  • Optional 1 PCIe 5.0 x16 FHHL slot + Default 1 PCIe 5.0 x16 LP slot
  • Optional 2 E1.S Slots + Optional 2 M.2 NVME drive Slots
  • 4 Redundant Up to 3200W Titanium Level Power Supplies
Product Specification
Anewtech-Systems-Twin-Server-Supermicro-FlexTwin-SuperServer-SYS-222FT-HEA-LCC-liquid-cooled-servers
Anewtech-Systems-Twin-Server-Supermicro-FlexTwin-SuperServer-SYS-222FT-HEA-LCC-Supermicro-liquid-cooled-servers
Anewtech-Systems-Twin-Server-Supermicro-FlexTwin-SuperServer-SYS-222FT-HEA-LCC-Supermicro-liquid-cooled-servers-GPU
Product SKUsSuperServer SYS-222FT-HEA-LCC
MotherboardSuper X14DBT-FAP
Processor (per Node)
CPUDual Socket BR (LGA-7529)
Intel® Xeon® 6900 series processors with P-cores
Core CountUp to 128C/256T; Up to 504MB Cache per CPU
NoteSupports up to 500W TDP CPUs (Liquid Cooled)​
System Memory (per Node)
MemorySlot Count: 24 DIMM slots
Max Memory (1DPC): Up to 6TB 6400MT/s ECC DDR5 RDIMM 
Max Memory (1DPC): Up to 3TB 8800MT/s ECC DDR5 MRDIMM
On-Board Devices (per Node)
NVMeNVMe; RAID 0/1/5/10 support(Intel® VROC RAID key required)
ChipsetSystem on Chip
Network ConnectivityVia AIOM
Input / Output (per Node)
LAN1 RJ45 1 GbE Dedicated BMC LAN port
USB2 USB 2.0 Type-A ports(front)
Video1 VGA port(Front)
System BIOS
BIOS TypeAMI 64MB SPI Flash
Management
SoftwareSuperCloud Composer
Supermicro Server Manager (SSM)
Super Diagnostics Offline (SDO)
Supermicro Thin-Agent Service (TAS)
SuperServer Automation Assistant (SAA) New!
Power configurationsPower-on mode for AC power recovery
ACPI/APM Power Management
Security
HardwareTrusted Platform Module (TPM) 2.0
Silicon Root of Trust (RoT) – NIST 800-193 Compliant
FeaturesCryptographically Signed Firmware
Secure Boot
Secure Firmware Updates
Automatic Firmware Recovery
Supply Chain Security: Remote Attestation
Runtime BMC Protections
System Lockdown
PC Health Monitoring
FANFans with tachometer monitoring
Status monitor for speed control
Pulse Width Modulated (PWM) fan connectors
TemperatureMonitoring for CPU and chassis environment
CPUMonitors for CPU Cores, Chipset Voltages, Memory.
Chassis
Form Factor2U Rackmount
ModelCSE-F214EC-000NP
Dimensions and Weight
Height3.46" (88 mm)
Width17.67" (449 mm)
Depth37.09" (942 mm)
Package10.83" (H) x 27.29" (W) x 50.32" (D)
WeightGross Weight: 129 lbs (58.51 kg)
Net Weight: 105 lbs (47.63 kg)
Available ColorSilver
Expansion Slots (per Node)
PCI-Express (PCIe) ConfigurationDefault
1 PCIe 5.0 x16 LP slot 
1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible)
Option A*
1 PCIe 5.0 x16 LP slot 
1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible)
1 PCIe 5.0 x16 FHHL slot 
(*Requires additional parts, please see the optional parts list for details. For more details on PCIe slot configuration options, please refer to the system callout images above.)
M.22 M.2 NVMe slots (B+M-key 22110; VROC required for RAID)
Drive Bays / Storage (per Node)
Drive Bays ConfigurationDefault: Total 2 bays
2 front hot-swap E1.S PCIe 5.0 NVMe* drive bays 
(*NVMe support may require additional storage controller and/or cables)
M.22 M.2 PCIe 5.0 x4 NVMe slots (M-key 22110(default); VROC required for RAID)
System Cooling
Fans16x 31K RPM Counter Rotating 40x40x56mm Fan(s)
Liquid CoolingDirect to Chip (D2C) Cold Plate
Power Supply
4x 3200W4x 3200W Redundant (2 + 2) Titanium Level (96%) power supplies
4x 2000W4x 2000W Redundant (2 + 2) Titanium Level (96%) power supplies
4x 2700W4x 2700W Redundant (2 + 2) Titanium Level (96%) power supplies
Operating Environment
ROHSRoHS Compliant
Environmental Spec.Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: -30°C to 60°C (-22°F to 140°F)
Operating Relative Humidity: 8% to 80% (non-condensing)
Non-operating Relative Humidity: 8% to 90% (non-condensing)