SYS-222FT-HEA-LCC
2U 4-Node FlexTwin™ with 2 hot-swap E1.S drives per node
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
- Dual Intel® Xeon® 6900 Series Processors with P-cores up to 500W with liquid cooling
- Up to 24 DIMMs supporting up to 6TB 6400MT/s DDR5 RDIMM or 3TB 8800MT/s DDR5 MRDIMM
- Flexible networking with up to 1 OCP 3.0 compatible AIOM slots
- Optional 1 PCIe 5.0 x16 FHHL slot + Default 1 PCIe 5.0 x16 LP slot
- Optional 2 E1.S Slots + Optional 2 M.2 NVME drive Slots
- 4 Redundant Up to 3200W Titanium Level Power Supplies
Product Specification
| Product SKUs | SuperServer SYS-222FT-HEA-LCC |
| Motherboard | Super X14DBT-FAP |
| Processor (per Node) | |
| CPU | Dual Socket BR (LGA-7529) Intel® Xeon® 6900 series processors with P-cores |
| Core Count | Up to 128C/256T; Up to 504MB Cache per CPU |
| Note | Supports up to 500W TDP CPUs (Liquid Cooled) |
| System Memory (per Node) | |
| Memory | Slot Count: 24 DIMM slots Max Memory (1DPC): Up to 6TB 6400MT/s ECC DDR5 RDIMM Max Memory (1DPC): Up to 3TB 8800MT/s ECC DDR5 MRDIMM |
| On-Board Devices (per Node) | |
| NVMe | NVMe; RAID 0/1/5/10 support(Intel® VROC RAID key required) |
| Chipset | System on Chip |
| Network Connectivity | Via AIOM |
| Input / Output (per Node) | |
| LAN | 1 RJ45 1 GbE Dedicated BMC LAN port |
| USB | 2 USB 2.0 Type-A ports(front) |
| Video | 1 VGA port(Front) |
| System BIOS | |
| BIOS Type | AMI 64MB SPI Flash |
| Management | |
| Software | SuperCloud Composer Supermicro Server Manager (SSM) Super Diagnostics Offline (SDO) Supermicro Thin-Agent Service (TAS) SuperServer Automation Assistant (SAA) New! |
| Power configurations | Power-on mode for AC power recovery ACPI/APM Power Management |
| Security | |
| Hardware | Trusted Platform Module (TPM) 2.0 Silicon Root of Trust (RoT) – NIST 800-193 Compliant |
| Features | Cryptographically Signed Firmware Secure Boot Secure Firmware Updates Automatic Firmware Recovery Supply Chain Security: Remote Attestation Runtime BMC Protections System Lockdown |
| PC Health Monitoring | |
| FAN | Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors |
| Temperature | Monitoring for CPU and chassis environment |
| CPU | Monitors for CPU Cores, Chipset Voltages, Memory. |
| Chassis | |
| Form Factor | 2U Rackmount |
| Model | CSE-F214EC-000NP |
| Dimensions and Weight | |
| Height | 3.46" (88 mm) |
| Width | 17.67" (449 mm) |
| Depth | 37.09" (942 mm) |
| Package | 10.83" (H) x 27.29" (W) x 50.32" (D) |
| Weight | Gross Weight: 129 lbs (58.51 kg) Net Weight: 105 lbs (47.63 kg) |
| Available Color | Silver |
| Expansion Slots (per Node) | |
| PCI-Express (PCIe) Configuration | Default 1 PCIe 5.0 x16 LP slot 1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible) Option A* 1 PCIe 5.0 x16 LP slot 1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible) 1 PCIe 5.0 x16 FHHL slot (*Requires additional parts, please see the optional parts list for details. For more details on PCIe slot configuration options, please refer to the system callout images above.) |
| M.2 | 2 M.2 NVMe slots (B+M-key 22110; VROC required for RAID) |
| Drive Bays / Storage (per Node) | |
| Drive Bays Configuration | Default: Total 2 bays 2 front hot-swap E1.S PCIe 5.0 NVMe* drive bays (*NVMe support may require additional storage controller and/or cables) |
| M.2 | 2 M.2 PCIe 5.0 x4 NVMe slots (M-key 22110(default); VROC required for RAID) |
| System Cooling | |
| Fans | 16x 31K RPM Counter Rotating 40x40x56mm Fan(s) |
| Liquid Cooling | Direct to Chip (D2C) Cold Plate |
| Power Supply | |
| 4x 3200W | 4x 3200W Redundant (2 + 2) Titanium Level (96%) power supplies |
| 4x 2000W | 4x 2000W Redundant (2 + 2) Titanium Level (96%) power supplies |
| 4x 2700W | 4x 2700W Redundant (2 + 2) Titanium Level (96%) power supplies |
| Operating Environment | |
| ROHS | RoHS Compliant |
| Environmental Spec. | Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -30°C to 60°C (-22°F to 140°F) Operating Relative Humidity: 8% to 80% (non-condensing) Non-operating Relative Humidity: 8% to 90% (non-condensing) |
Supermicro New FlexTwin™ HPC-at-Scale Solution
Supermicro’s new FlexTwin is a liquid cooled dual processor multi-node architecture optimized for maximum performance density at rack scale.
With highly customizable storage, networking, and power supply options, FlexTwin is ideal for demanding HPC workloads including financial services, manufacturing, scientific research, and complex modeling.
Watch our short video to learn more!
Supermicro Rack-Scale HPC Servers with FlexTwin™ Accelerate Application Performance
New Supermicro High Density Rack-Scale Solution for HPC at Scale
Supermicro X14 Server Solutions
Accelerate Innovation: X14 Server Solutions supporting Intel® Xeon® 6 Processors