Digi XBee DigiMesh 2.4
Wireless Mesh Networking RF Module
- Dynamic peer-to-peer DigiMesh protocol
- No configuration needed for out-of-the-box RF communications
- 2.4 GHz globally deployable frequency
- Self-healing and discovery for network stability
| Item | Digi XBee S2C DigiMesh 2.4 | Digi XBee-PRO S2C DigiMesh 2.4 |
|---|---|---|
| PERFORMANCE | ||
| TRANSCEIVER CHIPSET | Silicon Labs EM357 SoC | |
| DATA RATE | RF 250 Kbps, Serial up to 1 Mbps | |
| INDOOR/URBAN RANGE | 200 ft (60 m) | 300 ft (90 m) |
| OUTDOOR/RF LINE-OF-SIGHT RANGE | 4000 ft (1200 m) | 2 miles (3200 m) |
| TRANSMIT POWER | 3.1 mW (+5 dBm) / 6.3 mW (+8 dBm)boost mode | 63 mW (+18 dBm) |
| RECEIVER SENSITIVITY (1% PER) | -100 dBm / -102 dBm boost mode | -101 dBm |
| FEATURES | ||
| SERIAL DATA INTERFACE | UART, SPI | |
| CONFIGURATION METHOD | API or AT commands, local or over-the-air (OTA) | |
| FREQUENCY BAND | ISM 2.4 GHz | |
| FORM FACTOR | Through-Hole, Surface Mount | |
| HARDWARE | S2C | |
| ADC INPUTS | (4) 10-bit ADC inputs | |
| DIGITAL I/O | 15 | |
| ANTENNA OPTIONS | Through-Hole: PCB Antenna, U.FL Connector, RPSMA Connector, or Integrated Wire SMT: RF Pad, PCB Antenna, or U.FL Connector | |
| OPERATING TEMPERATURE | -40º C to +85º C | |
| DIMENSIONS (L X W X H) AND WEIGHT | Through-Hole: 0.960 x 1.087 in (2.438 x 2.761 cm) SMT: 0.866 x 1.33 x 0.120 in (2.199 x 3.4 x 0.305 cm) | Through-Hole: 0.960 x 1.297 in (2.438 x 3.294 cm) SMT: 0.866 x 1.33 x 0.120 in (2.199 x 3.4 x 0.305 cm) |
| NETWORKING AND SECURITY | ||
| PROTOCOL | XBee 802.15.4 (Proprietary 802.15.4) | |
| UPDATABLE TO DIGIMESH PROTOCOL | Yes | |
| UPDATABLE TO ZIGBEE PROTOCOL | Yes | |
| INTERFERENCE IMMUNITY | DSSS (Direct Sequence Spread Spectrum) | |
| ENCRYPTION | 128-bit AES | |
| RELIABLE PACKET DELIVERY | Retries/Acknowledgements | |
| FILTRATION OPTIONS | PAN ID, Channel, and 64-bit addresses | |
| CHANNELS | 16 channels | 15 channels |
| POWER REQUIREMENTS | ||
| SUPPLY VOLTAGE | 2.1 to 3.6V | 2.7 to 3.6V |
| TRANSMIT CURRENT | 33 mA @ 3.3 VDC / 45 mA boost mode | 120 mA @ 3.3 VDC |
| RECEIVE CURRENT | 28 mA @ 3.3 VDC / 31 mA boost mode | 31 mA @ 3.3 VDC |
| POWER-DOWN CURRENT | <1 μA @ 25º C | <1 μA @ 25º C |
| REGULATORY APPROVALS | ||
| FCC, IC (NORTH AMERICA) | Yes | Yes |
| ETSI (EUROPE) | Yes | No |
| RCM (AUSTRALIA AND NEW ZEALAND) | No (Coming soon) | No (Coming soon) |
| TELEC (JAPAN) | No (Coming soon) | No (Coming soon) |
Digi XBee DigiMesh 2.4 delivers end-point device connectivity with a globally deployable 2.4 GHz transceiver. These modules use the innovative DigiMesh networking protocol. This innovative, peer-to-peer protocol offers users added network stability through self-healing, dense network operation and with a very low housekeeping overhead, it is capable of extending the operational life of battery dependent networks.
Digi XBee modules are ideal for low-power, low-cost applications. Digi XBee-PRO modules are power-amplified versions of Digi XBee modules for extended-range applications. Part of the Digi XBee family of RF products, these modules are easy-to-use, share a common hardware footprint, and are fully interoperable with other XBee products utilizing the same technology. Module users have the ability to substitute one Digi XBee for another with minimal development time and risk.
The updated Digi XBee S2C DigiMesh 2.4 module is built with the SiliconLabs EM357 SoC and offers improved power consumption, support for over-the-air firmware updates, and provides an upgrade path to IEEE 802.15.4 or ZigBee® mesh protocols if desired.
