ID-E3.S 4TS2-P
Form Factor: E3.S; Flash Type: 3D TLC; Capacity: 400GB~12.8TB
- PCIe Gen. 4x4, NVMe 1.4
- iCell technology for power loss protection
- Stable sustained performance
- LDPC ECC engine supported
- Dynamic thermal management
| Model | E3.S 4TS2-P |
| Form Factor | E3.S |
| Flash Type | 3D TLC |
| Capacity | 400GB~12.8TB |
| Sequential R/W (MB/sec, max.) | 6,000/3,500 |
| Max. Power Consumption | TBD |
| Max. Channels | 8 |
| Thermal Sensor | Y |
| External DRAM Buffer | Y |
| TCG Opal | Y |
| H/W Write Protect | N |
| Dimension (WxLxH/mm) | 76 x 112.75 x 7.5 |
| Vibration | 20G@7~2000Hz |
| Shock | 1500G@0.5ms |
| MTBF | >3 million hours |
| Storage Temperature | -40°C ~ +85°C |
E3.S 4TS2-P is an NVM Express SSD designed as the standard E1.S form factor with PCIe interface and 3D TLC NAND Flash. E3.S 4TS2-P supports PCIe Gen. 4x4, and it is compliant with NVMe 1.4 providing excellent performance. E3.S 4TS2-P with heatsink design dissipates heat generated from IC, making SSD performs more steadily. E3.S 4TS2-P has Die RAID protection to reduce bad blocks happening and optimize data integrity.
E3.S 4TS2-P provides ultra-speed and high IOPS and offers maximum capacity up to 12.8TB, making the SSD optimal for server and heavy data workload applications.
Enterprise and Datacenter Standard Form Factor (EDSFF)
Enterprise and Datacenter Standard Form Factor (EDSFF) encompasses a spectrum of form factors crafted for various storage requirements within the dynamic data center environment. These SSD variations incorporate advantages in capacity, thermal and power management, scalability, manageability, and performance.
PCIe Gen. 4x4, NVMe SSD.
Form Factor: E3.S; Flash Type: 3D TLC;
Capacity: 400GB~12.8TB
