ID-E3.S 4TS2-P
Form Factor: E3.S; Flash Type: 3D TLC; Capacity: 400GB~12.8TB
- PCIe Gen. 4x4, NVMe 1.4
- iCell technology for power loss protection
- Stable sustained performance
- LDPC ECC engine supported
- Dynamic thermal management
Datasheet
Product Specification
| Model | E3.S 4TS2-P |
| Form Factor | E3.S |
| Flash Type | 3D TLC |
| Capacity | 400GB~12.8TB |
| Sequential R/W (MB/sec, max.) | 6,000/3,500 |
| Max. Power Consumption | TBD |
| Max. Channels | 8 |
| Thermal Sensor | Y |
| External DRAM Buffer | Y |
| TCG Opal | Y |
| H/W Write Protect | N |
| Dimension (WxLxH/mm) | 76 x 112.75 x 7.5 |
| Vibration | 20G@7~2000Hz |
| Shock | 1500G@0.5ms |
| MTBF | >3 million hours |
| Storage Temperature | -40°C ~ +85°C |
E3.S 4TS2-P is an NVM Express SSD designed as the standard E1.S form factor with PCIe interface and 3D TLC NAND Flash. E3.S 4TS2-P supports PCIe Gen. 4x4, and it is compliant with NVMe 1.4 providing excellent performance. E3.S 4TS2-P with heatsink design dissipates heat generated from IC, making SSD performs more steadily. E3.S 4TS2-P has Die RAID protection to reduce bad blocks happening and optimize data integrity.
E3.S 4TS2-P provides ultra-speed and high IOPS and offers maximum capacity up to 12.8TB, making the SSD optimal for server and heavy data workload applications.