SYS-121C-TN2R
1U DP CloudDC Server. 8 hot-swap 2.5" SATA (2 NVMe hybrid) bays and 2 PCIe 5.0 x16 slots + 2 PCIe 5.0 x16 AIOM slots
- Dual sockets E (LGA-4677) 5th / 4th Gen Intel® Xeon® Scalable processors
- 16 DIMMs up to 4TB 3DS ECC DDR5-4800: RDIMM
2 PCIe 5.0 x16 FHHL;
2 PCIe 5.0 x16 AIOM (OCP 3.0);
2 PCIe 5.0 x4 NVMe M.2 - Dual AIOM with NCSI (OCP 3.0) for networking, 1 dedicated IPMI LAN
- 8x 2.5" hot-swap SATA/SAS w/ 2x hybrid NVME drive bays
- 1 VGA, 1 COM, 2 USB 3.0 (rear)
Datasheet
Product Specification
| Product SKU | SuperServer SYS-121C-TN2R (Black front & silver body) |
| Motherboard | Super X13DDW-A |
| Processor | |
| CPU | Dual Socket E (LGA-4677) 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors |
| Core Count | Up to 32C/64T; Up to 82.5MB Cache per CPU |
| Note | Supports up to 270W TDP CPUs (Air Cooled)* *Air Cooled CPUs with TDP over 250W only supported under specific conditions. |
| GPU | |
| Max GPU Count | Up to 2 single-width GPU(s) |
| Supported GPU | Intel PCIe: Intel Data Center GPU Flex 140NVIDIA PCIe: L4,A2 |
| System Memory | |
| Memory | Slot Count: 16 DIMM slots Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM |
| Memory Voltage | 1.1 V |
| On-Board Devices | |
| SATA | SATA3 (6Gbps); RAID 0/1/5/10 support |
| NVMe | NVMe |
| Chipset | Intel® C741 |
| Network Connectivity | with Advanced IO Module, AIOM (OCP 3.0 NIC, refer to AIOM Network Card(s) under Optional Parts List for options) |
| IPMI | Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support |
| Note | High TDP 200-400G NICs have support conditions due to thermal requirements. |
| Input / Output | |
| LAN | 1 Dedicated IPMI LAN port |
| USB | 2 USB 3.0 port(s) (2 rear) |
| Video | 1 VGA port(s) |
| Serial Port | 1 COM Port(s) (1 rear) |
| System BIOS | |
| BIOS Type | AMI 32MB SPI FLASH ROM |
| Management | |
| Software | SCC Redfish API IPMI 2.0 SSM Intel® Node Manager SPM KVM with dedicated LAN SUM NMI Watch Dog SuperDoctor® 5 |
| Power Configurations | ACPI/APM Power Management |
| PC Health Monitoring | |
| CPU | 4+1 Phase-switching voltage regulator Monitors for CPU Cores, Chipset Voltages, Memory. |
| FAN | Fans with tachometer monitorin Pulse Width Modulated (PWM) fan connectors Status monitor for speed control |
| Temperature | Monitoring for CPU and chassis environment Thermal Control for fan connectors |
| Chassis | |
| Form Factor | 1U Rackmount |
| Model | CSE-LB13AC2-R860AW2 |
| Dimensions and Weight | |
| Height | 1.7" (43mm) |
| Width | 17.2" (437mm) |
| Depth | 23.5" (597mm) |
| Package | 7.8" (H) x 23.8" (W) x 32.4" (D) |
| Weight | Net Weight: 25 lbs (11.3 kg) Gross Weight: 40 lbs (18.1 kg) |
| Available Color | Black front & sliver body |
| Front Panel | |
| Buttons | Power On/Off Reset button Universal Information (UID) |
| LEDs | Drive activity Network activity Power status Universal Information (UID) |
| Expansion Slots | |
| PCI-Express (PCIe) | 2 PCIe 5.0 x16 FHHL slot(s) |
| Drive Bays / Storage | |
| Hot-swap | 8x 2.5" hot-swap NVMe/SATA/SAS drive bays (2x 2.5" NVMe hybrid) (Storage drives require additional cables from the optional parts list.) |
| M.2 | 2 M.2 NVMeM-Key, 2280 |
| Peripheral Bays | 1 DVD-ROM drive bays (optional) |
| System Cooling | |
| Fans | 6x 4cm heavy duty fans with optimal fan speed control |
| Air Shroud | 2 Air Shroud(s) |
| Power Supply | 800W/860W 1U redundant power supply |
| Dimension (W x H x L) | 54.5 x 40.25 x 322 mm |
| AC Input | 800W: 100-127Vac / 9A-7.5A / 50-60Hz 860W: 200-240Vac / 6A-4.5A / 50-60Hz |
| +12V | Max: 66.6A / Min: 0A (100Vac-127Vac) Max: 71.6A / Min: 0A (200Vac-240Vac) |
| 5V SB | Max: 4A / Min: 0A |
| Output Type | Backplanes (gold finger) |
| Operating Environment | |
| Environmental Spec. | Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing) |
CloudDC All-in-one Rackmount Platform for Cloud Data Centers
Ultimate flexibility on I/O and storage with 2 or 6 PCIe 5.0 slots and dual AIOM slots (OCP 3.0 compliant) for maximum data throughput. Supermicro X13 CloudDC systems are designed for convenient serviceability with tool-less brackets, hot-swap drive trays and redundant power supplies that ensure rapid deployment and more efficient maintenance in data centers. High-efficiency Titanium Level redundant power supplies provide resiliency and lower carbon footprint.
1U rackmounts with NVMe and GPU support
High-density, Tool-less Mechanical Design for Rapid Cloud Deployment and Easy Maintenance
- Dual socket 5th/4th Gen Intel® Xeon® Scalable processors
- 16 DIMM slots supporting DDR5-5600MHz
- SYS-121C-TN10R: 10 hot-swap 2.5” NVMe/SATA/SAS hybrid drive bays
- SYS-121C-TN2R: 8 hot-swap 2.5” NVMe/SATA/SAS hybrid drive bays
- SYS-611C-TN4R: 4 hot-swap 3.5” NVMe/SATA/SAS hybrid drive bays
- 2 PCIe 5.0 x16 FHHL slots
- Dual PCIe 5.0 AIOM slots supporting up to 400G networking
Ultimate flexibility on I/O and storage for maximum data throughput
5th Gen Intel® Xeon® Scalable Processors
- Up to 64 cores and 385W TDP per CPU
- Support for Intel Xeon® Max Series CPUs with High Bandwidth Memory
- Support for PCIe 5.0, DDR5 and CXL 1.1
- Built on the Intel® 7 process
- Built in accelerators:
- Intel AMX
- Intel® Dynamic Load Balancer
- Intel® QuickAssist
- Technology (QAT)
- Intel vRAN Boost
Delivering Solutions Optimized for Tomorrow’s Data Center Workloads
Complete Rack-Scale Solutions
- Full design, integration, validation and testing services for rack-scale and multi-rack clusters
- Complete rack-scale liquid cooling solutions developed in house
Performance and Energy Optimized
- Enhanced thermal capacity to support the highest performing CPUs and GPUs
- Optimized to run in high-temperature data center environments up to 40°C
Improved Security and Manageability
- Industry-standard compliance for hardware and silicon Root of Trust (RoT)
- Cryptographical attestation of components throughout the entire supply chain
Supports Open Industry Standards
- The latest industry technologies including PCIe 5.0, DDR5, and CXL
- Open Compute Project (OCP) standards including OCP 3.0, OAM, ORV2 and OSF as well as Open BMC