SYS-122C-TN

1U CloudDC with DC-MHS, 12 hot-swap 2.5” NVMe/SATA/SAS bays, 3 PCIe 5.0 x16/x8 slots and 2 PCIe 5.0 x16

Designed for Data Center Modular Hardware Systems (DC-MHS) to simplify CSP deployments and serviceability
Optimized power & balanced performance for cloud applications
Server management flexibility with OpenBMC

Key Applications

Networking Appliance
Data Center Optimized, Value IaaS
HPC, Data Center

Cloud Computing
Private & Hybrid Cloud
Cloud Solution Provider (CSP)

Datasheet

SYS-122C-TN.pdf

Product Specification

Anewtech-Systems-Rackmount-Server-Supermicro-SYS-122C-TN-CloudDC-SuperServer

Anewtech-Systems-Data-center-Server-Supermicro-SYS-122C-TN-Supermicro-Singapore

Product SKUs	SuperServer SYS-122C-TN
Motherboard	Super X14DBHM
Processor
CPU	Dual Socket E2 (LGA-4710) Intel® Xeon® 6 6700 series processors with E-cores
Core Count	Up to 144C/144T
Note	Supports up to 350W TDP CPUs (Air Cooled)
GPU
Max GPU Count	Up to 3 single-width GPU(s)
System Memory
Memory	Slot Count: 32 DIMM slots Max Memory (2DPC): Up to 2TB 6400MT/s ECC DDR5 RDIMM
On-Board Devices
NVMe	NVMe; RAID 0/1/5/10 support (VROC HW key required)
Chipset	System on Chip
Network Connectivity	Via Slim-AIOM
Input / Output
LAN	1 RJ45 1 GbE Dedicated IPMI LAN port(s)
USB	2 USB 3.0 Type-A port(s) (Rear)
Video	1 VGA port(s) (Rear)
TPM	1 TPM header
System BIOS
BIOS Type	AMI 32MB SPI FLASH ROM
Management
Software	SuperCloud Composer Supermicro Server Manager (SSM) Super Diagnostics Offline (SDO) Supermicro Thin-Agent Service (TAS) SuperServer Automation Assistant (SAA)
Power configurations	ACPI/APM Power Management
Security
Hardware	Trusted Platform Module (TPM) 2.0 Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features	Cryptographically Signed Firmware Secure Boot Secure Firmware Updates Automatic Firmware Recovery Supply Chain Security: Remote Attestation Runtime BMC Protections System Lockdown
Chassis
Form Factor	1U Rackmount
Model	CSE-DC101TS-R000NP
Dimensions and Weight
Height	1.7" (43.6 mm)
Width	17.2" (438.4 mm)
Depth	29.7" (755.1 mm)
Package	7.28" (H) x 22.83" (W) x 42.5" (D)
Weight	Gross Weight: 41 lbs (19 kg) Net Weight: 31 lbs (17 kg)
Palletized Packing (W x H x L)	49.6" (1260 mm) x 4.7" (120 mm) x 44.5" (1130 mm)
Available Color	Silver
Front Panel
LED	HDD activity LAN1 activity LAN2 activity Power Fail LED Power status System information
Buttons	Power On/Off UID button
Expansion Slots
PCI-Express (PCIe) Configuration	Default 2 PCIe 5.0 x16 LP slot(s) 1 PCIe 5.0 x8 LP slot(s) 2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
Drive Bays / Storage
Drive Bays Configuration	Default: Total 12 bay(s) 12 front hot-swap 2.5" NVMe/SAS/SATA* drive bay(s) (*NVMe/SAS/SATA support may require additional storage controller and/or cables, please see the optional parts list for details)
M.2	2 M.2 PCIe 5.0 x4 NVMe slot(s) (M-key 22110(default)/2280; VROC required for RAID)
System Cooling
Fans	8x 4cm heavy duty fans with optimal fan speed control
Air Shroud	2 Air Shroud(s)
Power Supply	2x 1000W Redundant (1 + 1) Titanium Level (96%) power supplies 2x 2000W Redundant (1 + 1) Titanium Level (96%) power supplies
Operating Environment
ROHS	RoHS Compliant
Environmental Spec.	Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -30°C to 60°C (-30°F to 140°F) Operating Relative Humidity: 8% to 80% (Non-Condensing) Non-operating Relative Humidity: 8% to 90% (Non-Condensing)

X14 CloudDC with DC-MHS: All-in-one Rackmount Platform for Cloud Data Centers Designed to OCP DC-MHS Specifications

The new Supermicro X14 CloudDC with DC-MHS delivers ultimate flexibility on I/O and storage to support a range of cloud and data center workloads. The systems are designed to meet OCP DC-MHS specifications, improving modularity and flexibility for large-scale enterprises and cloud service providers to simplify data center management with DC-SCM modules. X14 CloudDC also features tool-less brackets, hot-swap drive trays and redundant power supplies that ensure a rapid deployment and more efficient maintenance in data centers.

High-efficiency Titanium Level redundant power supplies provide resiliency and low carbon footprint. Rich security features include Intel® SGX, TPM 2.0, signed firmware, Silicon Root of Trust, Secure Boot, System Erase, Runtime FW protection, FIPS Compliance and Trusted Execution Environment.