SYS-521C-NR
2U UP CloudDC Server. 12 hot-swap 3.5" SAS/SATA (2 NVMe hybrid) bays and 4 PCIe 5.0 x16 slots + 1 PCIe 5.0 x16 AIOM slot
- Single Socket E (LGA-4677) 4th/5th Gen Intel® Xeon® Scalable processors. Up to 350W TDP
- Intel® C741 Chipset
- 16 DIMMs; Supports 3DS DDR5 RDIMM. Up to 4800 MT/s
2 PCIe 5.0 x16 FHFL + 2 PCIe 5.0 x16 FHHL (OR) 4 PCIe 5.0 x8 FHFL and 2 PCIe 5.0 x16 FHHL;
1 PCIe 5.0 x16 AIOM NIC(OCP 3.0);
2 PCIe 3.0 x2 NVMe M.2 - Single AIOM with NCSI (OCP 3.0) for networking, 1 dedicated IPMI LAN
- 12x front hot-swap 3.5" SATA3 drive bays (Optional 2 hybrid Gen5 NVMe), SAS3 with additional SAS controller card
- Redundant Titanium 1200W Power Supplies
Datasheet
Product Specification
| Product SKUs | SuperServer SYS-521C-NR (Black front & sliver body) |
| Motherboard | Super X13SEDW-F |
| Processor | |
| CPU | Single Socket E (LGA-4677) 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors |
| Core Count | Up to 64C/128T; Up to 320MB Cache per CPU |
| Note | Supports up to 350W TDP CPUs (Air Cooled) |
| GPU | |
| Max GPU Count | Up to 2 double-width or 4 single-width GPU(s) |
| Supported GPU | NVIDIA PCIe: H100,T1000,RTX A4000,L4,A40,A16,L40,RTX A6000,L40S,A30,A2 |
| CPU-GPU Interconnect | PCIe 5.0 x16 CPU-to-GPU Interconnect |
| GPU-GPU Interconnect | PCIe |
| System Memory | |
| Memory | Slot Count: 16 DIMM slots/8 Channels Max Memory (1DPC): Up to 2TB 4800MT/s ECC DDR5 RDIMM Max Memory (2DPC): Up to 4TB 4400MT/s ECC DDR5 RDIMM |
| Memory Voltage | 1.1 V |
| On-Board Devices | |
| SATA | SATA3 (6Gbps); RAID 0/1/5/10 support |
| Chipset | Intel® C741 |
| Network Connectivity | Via AIOM & AOC |
| IPMI | Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support |
| Input / Output | |
| SATA | 12 SATA (6Gbps) port(s) |
| LAN | 1 RJ45 Dedicated IPMI LAN port |
| USB | 2 USB 2.0 port(s) (2 headers) 2 USB 3.2 Gen 1 port(s) (2 rear) |
| Video | 1 VGA port(s) |
| Serial Port | 1 COM Port(s) (1 rear) |
| System BIOS | |
| BIOS Type | AMI 32MB SPI Flash EEPROM |
| Management | |
| Software | IPMI 2.0 KVM with dedicated LAN Super Diagnostics Offline SuperDoctor® 5 Supermicro Update Manager (SUM) Supermicro Power Manager (SPM) Supermicro Server Manager (SSM) Redfish API |
| Power Configurations | ACPI/APM Power Management |
| Security | |
| Hardware | Trusted Platform Module (TPM) 2.0 Silicon Root of Trust (RoT) – NIST 800-193 Compliant |
| Features | Cryptographically Signed Firmware Secure Boot Secure Firmware Updates Automatic Firmware Recovery Supply Chain Security: Remote Attestation Runtime BMC Protections System Lockdown |
| PC Health Monitoring | |
| CPU | 8 Phase-switching voltage regulator Monitors for CPU Cores, Chipset Voltages, Memory |
| FAN | Fans with tachometer monitoring Pulse Width Modulated (PWM) fan connectors Status monitor for speed control |
| Temperature | Monitoring for CPU and chassis environment Thermal Control for fan connectors |
| Chassis | |
| Form Factor | 2U Rackmount |
| Model | CSE-LA26TS-R1K23AWP1 |
| Dimensions and Weight | |
| Height | 3.5" (89mm) |
| Width | 17.2" (437mm) |
| Depth | 25.5" (648mm) |
| Package | 11.4" (H) x 26.7" (W) x 34.5" (D) |
| Weight | Net Weight: 33 lbs (15 kg) Gross Weight: 59 lbs (26.76 kg) |
| Available Color | Black front & sliver body |
| Front Panel | |
| Buttons | Power On/Off Universal Information (UID) |
| LEDs | Drive activity Network activity Power status Universal Information (UID) |
| Expansion Slots | |
| PCI-Express (PCIe) | 4 PCIe 5.0 x8 FHFL slot(s) 2 PCIe 5.0 x16 FHHL slot(s) 1 PCIe 5.0 x16 OCP 3.0 AIOM NIC slot(s) |
| Note | AIOM slot shares PCIe lanes with NVMe drives. Acronyms: (FH = Full Height, LP = Low Profile, FL = Full Length, HL = Half Length) |
| Drive Bays / Storage | |
| Drive Bays | 12x 3.5" NVMe/SATA/SAS drive bays (2x 3.5" NVMe hybrid) |
| M.2 | 2x PCIe 3.0 x 2M-key, 2280, 22110 |
| System Cooling | |
| Fans | 3 heavy duty PWM 80x80x38mm Fan(s) |
| Power Supply | 2x 1200W Redundant Titanium Level power supplies |
| Dimension (W x H x L) | 76 x 40 x 336 mm |
| AC Input | 1000W: 100-127Vac / 50-60Hz 1200W: 200-240Vac / 50-60Hz 1200W: 200-240Vdc / 50-60Hz (for CCC only) |
| +12V | Max: 83A / Min: 0A (100Vac-127Vac) Max: 100A / Min: 0A (200Vdc-240Vdc) Max: 100A / Min: 0A (200Vac-240Vac) |
| 5V SB | Max: 4A / Min: 0A |
| Output Type | Backplanes (gold finger) |
| Operating Environment | |
| Environmental Spec. | Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -30°C to 60°C (-22°F to 140°F) Operating Relative Humidity: 8% to 80% (non-condensing) Non-operating Relative Humidity: 8% to 90% (non-condensing) |
Video Delivery Workloads
2U CloudDC UP
All-in-one Platform for Cloud Data Centers
Benefits & Advantages
- UP architecture for maximum performance with a single CPU
- Superior thermal design - Supports maximum power/performance CPUs and GPUs
- Flexible I/O and storage options supporting convenient serviceability with tool-less brackets and hot-swap drive bays
Key Features
- Up to 6 GPUs
- Single 4th Gen Intel® Xeon® Scalable processor
- Optimized thermal capacity and airflow to support CPUs up to 350W and GPUs up to 350W with air cooling
- Supports PCIe 5.0, DDR5 and Compute Express Link (CXL) 1.1+
- 16 DIMM slots DDR5
- Advanced I/O Module (AIOM) for flexible networking options (OCP 3.0 compatible)
High Density Cloud Storage Platform for Cloud Data Centers
High-density, Tool-less Mechanical Design for Rapid Cloud Deployment and Easy Maintenance
Ultimate flexibility on I/O and storage for maximum data throughput. Supermicro X13 CloudDC systems are designed for convenient serviceability with tool-less brackets, hot-swap drive trays and redundant power supplies that ensure a rapid deployment and more efficient maintenance in data centers. High-efficiency Titanium Level redundant power supplies provide resiliency and lower carbon footprint.
Rich Security Features include Intel® SGX, TPM 2.0, signed firmware, Silicon Root of Trust, Secure Boot, System Erase, Runtime FW protection, FIPS Compliance and Trusted Execution Environment.
5th Gen Intel® Xeon® Scalable Processors
- Up to 64 cores and 385W TDP per CPU
- Support for Intel Xeon® Max Series CPUs with High Bandwidth Memory
- Support for PCIe 5.0, DDR5 and CXL 1.1
- Built on the Intel® 7 process
- Built in accelerators:
- Intel AMX
- Intel® Dynamic Load Balancer
- Intel® QuickAssist
- Technology (QAT)
- Intel vRAN Boost
Delivering Solutions Optimized for Tomorrow’s Data Center Workloads
Complete Rack-Scale Solutions
- Full design, integration, validation and testing services for rack-scale and multi-rack clusters
- Complete rack-scale liquid cooling solutions developed in house
Performance and Energy Optimized
- Enhanced thermal capacity to support the highest performing CPUs and GPUs
- Optimized to run in high-temperature data center environments up to 40°C
Improved Security and Manageability
- Industry-standard compliance for hardware and silicon Root of Trust (RoT)
- Cryptographical attestation of components throughout the entire supply chain
Supports Open Industry Standards
- The latest industry technologies including PCIe 5.0, DDR5, and CXL
- Open Compute Project (OCP) standards including OCP 3.0, OAM, ORV2 and OSF as well as Open BMC