SYS-221H-TN24R
2U Hyper Server. 24 hot-swap 2.5" NVMe/SAS/SATA bays and 4 PCIe 5.0 x16 slots + up to 2 PCIe 5.0 x16 AIOM slots
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- Dual Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors
- 32 DIMM slots supporting up to 8TB of memory; RDIMMs up to DDR5-4800
- Optional PCIe slot configurations up to 8 PCIe 5.0 x8 or 4 PCIe 5.0 x16 slots with support for double-width GPU/Accelerator cards
- Flexible networking options with up to 2 AIOM networking slots (OCP NIC 3.0 compatible)
- 24x 2.5" hot-swap NVMe/SATA/SAS drive bays;
- 2x internal M.2 NVMe/SATA drive slots;
- Optional RAID support via storage add-on card
- 4 heavy duty hot-swap fans with optimal fan speed control
Key Applications
- Virtualization
- Software-defined Storage
- AI Inference and Machine Learning
- Cloud Computing
- Enterprise Server
Datasheet
Product Specification
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Product SKUs | SuperServer SYS-221H-TN24R |
Motherboard | Super X13DEM |
Processor | |
CPU | Dual Socket E (LGA-4677) 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors Supports Intel Xeon CPU Max Series with high bandwidth memory (HBM) |
Core Count | Up to 64C/128T; Up to 320MB Cache per CPU |
Note | Supports up to 350W TDP CPUs (Air Cooled) Supports up to 350W TDP CPUs (Liquid Cooled) |
GPU | |
Max GPU Count | Up to 4 double-width or 4 single-width GPU(s) |
Supported GPU | NVIDIA PCIe: RTX A2000, L40S, A100 |
CPU-GPU Interconnect | PCIe 5.0 x16 CPU-to-GPU Interconnect |
GPU-GPU Interconnect | PCIe |
System Memory | |
Memory | Slot Count: 32 DIMM slots Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM Max Memory (2DPC): Up to 8TB 4400MT/s ECC DDR5 RDIMM |
Memory Voltage | 1.1 V |
On-Board Devices | |
SATA | SATA3 (6Gbps); RAID 0/1/5/10 support |
NVMe | NVMe; RAID 0/1/5/10 support (Intel® VROC RAID Key required) |
Chipset | Intel® C741 |
Network Connectivity | 2x 1GbE BaseT with Intel® i350-AM2 (optional) 4x 1GbE BaseT or 4x 1GbE SFP with Intel® i350-AM4 (optional) 2x 10GbE BaseT with Intel® X550-AT2 (optional) 2x 10GbE SFP+ with Intel® X710-BM2 (optional) 4x 10GbE SFP+ with Intel® XL710-BM1 (optional) 4x 10GbE RJ45/SFP+ with Intel® X710-TM4 (optional) 2x 25GbE SFP28 with Broadcom® BCM57414 (optional) 4x 25GbE RJ45/SFP28 with Mellanox® CX-4 Lx EN Intel® X550-AT2 (optional) 2x 100GbE QSFP28 with Broadcom® BCM57508 (optional) |
IPMI | Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support |
Input / Output | |
LAN | 1 RJ45 Dedicated BMC LAN port |
USB | 2 USB 2.0 port(s) (2 rear) |
Video | 1 VGA port(s) |
System BIOS | |
BIOS Type | AMI 256MB SPI Flash |
Management | |
Software | IPMI 2.0 KVM with dedicated LAN Super Diagnostics Offline SuperDoctor® 5 Supermicro Update Manager (SUM) Supermicro Power Manager (SPM) Supermicro Server Manager (SSM) Redfish API |
Power Configurations | Power-on mode for AC power recovery ACPI Power Management |
Security | |
Hardware | Trusted Platform Module (TPM) 2.0 Silicon Root of Trust (RoT) – NIST 800-193 Compliant |
Features | Cryptographically Signed Firmware Secure Boot Secure Firmware Updates Automatic Firmware Recovery Supply Chain Security: Remote Attestation Runtime BMC Protections System Lockdown |
PC Health Monitoring | |
CPU | Monitors for CPU Cores, Chipset Voltages, Memory |
FAN | Fans with tachometer monitoring Pulse Width Modulated (PWM) fan connectors Status monitor for speed control |
Temperature | Monitoring for CPU and chassis environment Thermal Control for fan connectors |
Chassis | |
Form Factor | 2U Rackmount |
Model | CSE-HS219-R1K63P |
Dimensions and Weight | |
Height | 3.5" (88.9mm) |
Width | 17.2" (437mm) |
Depth | 29.9" (760mm) |
Package | 10.4" (H) x 23.8" (W) x 43.6" (D) |
Weight | Net Weight: 40 lbs (18.2 kg) Gross Weight: 66 lbs (30 kg) |
Available Color | N/A |
Front Panel | |
Buttons | Power On/Off UID button |
LEDs | HDD activity LAN1 activity Power System information |
Expansion Slots | |
PCI-Express (PCIe) | 4 (Optional) PCIe 5.0 x16 or x8 FH, 10.5"L slot(s) 4 (Optional) PCIe 5.0 x8 FH, 10.5"L slot(s) |
Note | For 16 NVMe configurations, PCIe slots 1,2 and AIOM slot A2 cannot be used. For 24 NVMe configurations, PCIe slots 1,2,5,6 and AIOM slot A2 cannot be used. |
Drive Bays / Storage | |
Hot-swap | 24x 2.5" hot-swap NVMe/SATA/SAS drive bays (NVMe, SATA, or SAS support requires additional parts. |
M.2 | 2 M.2 NVMe OR 2 M.2 SATA3 M-Key, 2280/2210 |
System Cooling | |
Fans | 4x 8cm heavy duty fans with optimal fan speed control |
Air Shroud | 2 Air Shroud(s) |
Liquid Cooling | Direct to Chip (D2C) Cold Plate (optional) |
Power Supply | 2x 1600W Redundant Titanium Level power supplies |
Dimension (W x H x L) | 73.5 x 40 x 265 mm |
AC Input | 1000W: 100-127Vac / 50-60Hz 1600W: 200-240Vac / 50-60Hz 1600W: 200-240Vdc / 50-60Hz (for CQC only) |
+12V | Max: 83.3A / Min: 0A (100Vac-127Vac) Max: 133.3A / Min: 0A (200Vac-240Vac) |
12V SB | Max: 3.5A |
Output Type | Backplanes (gold finger) |
Operating Environment | |
Environmental Spec. | Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 70°C (-40°F to 158°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing) |
Best-in-class Performance and Flexibility Rackmount Server
Ultimate Configurability for Enterprise Applications
The new X13 Hyper series brings next-generation performance to Supermicro’s range of rackmount servers, built to take on the most demanding workloads along with the storage & I/O flexibility that provide a custom fit for a wide range of application needs. Maintenance-friendly design innovations eliminate the need for tools when servicing the system to simplify rollout and installation.
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Optimized for Storage Performance
2U Hyper
Liquid Cooling options
Up to 24x 2.5” NVMe/SAS/SATA drives
5th Gen Intel® Xeon® Scalable Processors
- Up to 64 cores and 385W TDP per CPU
- Support for Intel Xeon® Max Series CPUs with High Bandwidth Memory
- Support for PCIe 5.0, DDR5 and CXL 1.1
- Built on the Intel® 7 process
- Built in accelerators:
- Intel AMX
- Intel® Dynamic Load Balancer
- Intel® QuickAssist
- Technology (QAT)
- Intel vRAN Boost
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Delivering Solutions Optimized for Tomorrow’s Data Center Workloads
Complete Rack-Scale Solutions
- Full design, integration, validation and testing services for rack-scale and multi-rack clusters
- Complete rack-scale liquid cooling solutions developed in house
Performance and Energy Optimized
- Enhanced thermal capacity to support the highest performing CPUs and GPUs
- Optimized to run in high-temperature data center environments up to 40°C
Improved Security and Manageability
- Industry-standard compliance for hardware and silicon Root of Trust (RoT)
- Cryptographical attestation of components throughout the entire supply chain
Supports Open Industry Standards
- The latest industry technologies including PCIe 5.0, DDR5, and CXL
- Open Compute Project (OCP) standards including OCP 3.0, OAM, ORV2 and OSF as well as Open BMC