SYS-221H-TN24R
2U Hyper Server. 24 hot-swap 2.5" NVMe/SAS/SATA bays and 4 PCIe 5.0 x16 slots + up to 2 PCIe 5.0 x16 AIOM slots
- Dual Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors
- 32 DIMM slots supporting up to 8TB of memory; RDIMMs up to DDR5-4800
- Optional PCIe slot configurations up to 8 PCIe 5.0 x8 or 4 PCIe 5.0 x16 slots with support for double-width GPU/Accelerator cards
- Flexible networking options with up to 2 AIOM networking slots (OCP NIC 3.0 compatible)
- 24x 2.5" hot-swap NVMe/SATA/SAS drive bays;
- 2x internal M.2 NVMe/SATA drive slots;
- Optional RAID support via storage add-on card
- 4 heavy duty hot-swap fans with optimal fan speed control
Key Applications
- Virtualization
- Software-defined Storage
- AI Inference and Machine Learning
- Cloud Computing
- Enterprise Server
Datasheet
Product Specification
Product SKUs | SuperServer SYS-221H-TN24R |
Motherboard | Super X13DEM |
Processor | |
CPU | Dual Socket E (LGA-4677) 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors Supports Intel Xeon CPU Max Series with high bandwidth memory (HBM) |
Core Count | Up to 64C/128T; Up to 320MB Cache per CPU |
Note | Supports up to 350W TDP CPUs (Air Cooled) Supports up to 350W TDP CPUs (Liquid Cooled) |
GPU | |
Max GPU Count | Up to 4 double-width or 4 single-width GPU(s) |
Supported GPU | NVIDIA PCIe: RTX A2000, L40S, A100 |
CPU-GPU Interconnect | PCIe 5.0 x16 CPU-to-GPU Interconnect |
GPU-GPU Interconnect | PCIe |
System Memory | |
Memory | Slot Count: 32 DIMM slots Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM Max Memory (2DPC): Up to 8TB 4400MT/s ECC DDR5 RDIMM |
Memory Voltage | 1.1 V |
On-Board Devices | |
SATA | SATA3 (6Gbps); RAID 0/1/5/10 support |
NVMe | NVMe; RAID 0/1/5/10 support (Intel® VROC RAID Key required) |
Chipset | Intel® C741 |
Network Connectivity | 2x 1GbE BaseT with Intel® i350-AM2 (optional) 4x 1GbE BaseT or 4x 1GbE SFP with Intel® i350-AM4 (optional) 2x 10GbE BaseT with Intel® X550-AT2 (optional) 2x 10GbE SFP+ with Intel® X710-BM2 (optional) 4x 10GbE SFP+ with Intel® XL710-BM1 (optional) 4x 10GbE RJ45/SFP+ with Intel® X710-TM4 (optional) 2x 25GbE SFP28 with Broadcom® BCM57414 (optional) 4x 25GbE RJ45/SFP28 with Mellanox® CX-4 Lx EN Intel® X550-AT2 (optional) 2x 100GbE QSFP28 with Broadcom® BCM57508 (optional) |
IPMI | Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support |
Input / Output | |
LAN | 1 RJ45 Dedicated BMC LAN port |
USB | 2 USB 2.0 port(s) (2 rear) |
Video | 1 VGA port(s) |
System BIOS | |
BIOS Type | AMI 256MB SPI Flash |
Management | |
Software | IPMI 2.0 KVM with dedicated LAN Super Diagnostics Offline SuperDoctor® 5 Supermicro Update Manager (SUM) Supermicro Power Manager (SPM) Supermicro Server Manager (SSM) Redfish API |
Power Configurations | Power-on mode for AC power recovery ACPI Power Management |
Security | |
Hardware | Trusted Platform Module (TPM) 2.0 Silicon Root of Trust (RoT) – NIST 800-193 Compliant |
Features | Cryptographically Signed Firmware Secure Boot Secure Firmware Updates Automatic Firmware Recovery Supply Chain Security: Remote Attestation Runtime BMC Protections System Lockdown |
PC Health Monitoring | |
CPU | Monitors for CPU Cores, Chipset Voltages, Memory |
FAN | Fans with tachometer monitoring Pulse Width Modulated (PWM) fan connectors Status monitor for speed control |
Temperature | Monitoring for CPU and chassis environment Thermal Control for fan connectors |
Chassis | |
Form Factor | 2U Rackmount |
Model | CSE-HS219-R1K63P |
Dimensions and Weight | |
Height | 3.5" (88.9mm) |
Width | 17.2" (437mm) |
Depth | 29.9" (760mm) |
Package | 10.4" (H) x 23.8" (W) x 43.6" (D) |
Weight | Net Weight: 40 lbs (18.2 kg) Gross Weight: 66 lbs (30 kg) |
Available Color | N/A |
Front Panel | |
Buttons | Power On/Off UID button |
LEDs | HDD activity LAN1 activity Power System information |
Expansion Slots | |
PCI-Express (PCIe) | 4 (Optional) PCIe 5.0 x16 or x8 FH, 10.5"L slot(s) 4 (Optional) PCIe 5.0 x8 FH, 10.5"L slot(s) |
Note | For 16 NVMe configurations, PCIe slots 1,2 and AIOM slot A2 cannot be used. For 24 NVMe configurations, PCIe slots 1,2,5,6 and AIOM slot A2 cannot be used. |
Drive Bays / Storage | |
Hot-swap | 24x 2.5" hot-swap NVMe/SATA/SAS drive bays (NVMe, SATA, or SAS support requires additional parts. |
M.2 | 2 M.2 NVMe OR 2 M.2 SATA3 M-Key, 2280/2210 |
System Cooling | |
Fans | 4x 8cm heavy duty fans with optimal fan speed control |
Air Shroud | 2 Air Shroud(s) |
Liquid Cooling | Direct to Chip (D2C) Cold Plate (optional) |
Power Supply | 2x 1600W Redundant Titanium Level power supplies |
Dimension (W x H x L) | 73.5 x 40 x 265 mm |
AC Input | 1000W: 100-127Vac / 50-60Hz 1600W: 200-240Vac / 50-60Hz 1600W: 200-240Vdc / 50-60Hz (for CQC only) |
+12V | Max: 83.3A / Min: 0A (100Vac-127Vac) Max: 133.3A / Min: 0A (200Vac-240Vac) |
12V SB | Max: 3.5A |
Output Type | Backplanes (gold finger) |
Operating Environment | |
Environmental Spec. | Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 70°C (-40°F to 158°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing) |
Best-in-class Performance and Flexibility Rackmount Server
Ultimate Configurability for Enterprise Applications
The new X13 Hyper series brings next-generation performance to Supermicro’s range of rackmount servers, built to take on the most demanding workloads along with the storage & I/O flexibility that provide a custom fit for a wide range of application needs. Maintenance-friendly design innovations eliminate the need for tools when servicing the system to simplify rollout and installation.
Optimized for Storage Performance
2U Hyper
Liquid Cooling options
Up to 24x 2.5” NVMe/SAS/SATA drives
5th Gen Intel® Xeon® Scalable Processors
- Up to 64 cores and 385W TDP per CPU
- Support for Intel Xeon® Max Series CPUs with High Bandwidth Memory
- Support for PCIe 5.0, DDR5 and CXL 1.1
- Built on the Intel® 7 process
- Built in accelerators:
- Intel AMX
- Intel® Dynamic Load Balancer
- Intel® QuickAssist
- Technology (QAT)
- Intel vRAN Boost
Delivering Solutions Optimized for Tomorrow’s Data Center Workloads
Complete Rack-Scale Solutions
- Full design, integration, validation and testing services for rack-scale and multi-rack clusters
- Complete rack-scale liquid cooling solutions developed in house
Performance and Energy Optimized
- Enhanced thermal capacity to support the highest performing CPUs and GPUs
- Optimized to run in high-temperature data center environments up to 40°C
Improved Security and Manageability
- Industry-standard compliance for hardware and silicon Root of Trust (RoT)
- Cryptographical attestation of components throughout the entire supply chain
Supports Open Industry Standards
- The latest industry technologies including PCIe 5.0, DDR5, and CXL
- Open Compute Project (OCP) standards including OCP 3.0, OAM, ORV2 and OSF as well as Open BMC