SYS-621H-TN12R

2U Hyper Server. 12 hot-swap 3.5" NVMe/SAS/SATA bays, 4 PCIe 5.0 x16 slots

Anewtech Systems Supermicro Singapore Supermicro Servers  Industrial Rackmount Server SuperServer SYS-621H-TN12R Supermicro SYS-621H-TN12R
  • Dual Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors
  • 32 DIMM slots supporting up to 8TB of memory; RDIMMs up to DDR5-4800
  • Optional PCIe slot configurations up to 8 PCIe 5.0 x8 or 4 PCIe 5.0 x16 slots with support for double-width GPU/Accelerator cards
  • Flexible networking options with up to 2 AIOM networking slots (OCP NIC 3.0 compatible)
  • 12x 3.5"/2.5" hot-swap NVMe/SATA/SAS drive bays;
  • 2x internal M.2 NVMe/SATA drive slots;
  • Optional RAID support via storage add-on card
  •  4 heavy duty hot-swap fans with optimal fan speed control
Datasheet
Product Specification
Anewtech-Systems-Rackmount-Server-Supermicro-SYS-621H-TN12R-Superserver Supermicro Singapore Supermicro ServersAnewtech-Systems-Rackmount-Server-Supermicro-Hyper-Superserver-SYS-621H-TN12R Supermicro Singapore Supermicro Servers
Product SKUSuperServer SYS-621H-TN12R
MotherboardSuper X13DEM
Processor
CPUDual Socket E (LGA-4677)      
5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors ​
Intel Xeon CPU Max Series with high bandwidth memory (HBM)
NoteSupports up to 350W TDP CPUs (Aircooled)      
Supports up to 350W TDP CPUs (Liquid Cooled)
GPU
Max GPU CountUp to 4 double-width or 4 single-width GPU(s)
Supported GPUNVIDIA PCIe: H100,A100,L40S,A40
CPU-GPU InterconnectPCIe 5.0 x16 CPU-to-GPU Interconnect
GPU-GPU InterconnectPCIe
System Memory
MemorySlot Count: 32 DIMM slots
Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM
Max Memory (2DPC): Up to 8TB 4400MT/s ECC DDR5 RDIMM
Memory Voltage1.1 V
On-Board Devices
ChipsetIntel® C741
Network Connectivity2x 1GbE BaseT with Intel® i350-AM2 (optional)      
4x 1GbE BaseT or 4x 1GbE SFP with Intel® i350-AM4 (optional)      
2x 10GbE BaseT with Intel® X550-AT2 (optional)      
2x 10GbE SFP+ with Intel® X710-BM2 (optional)      
4x 10GbE SFP+ with Intel® XL710-BM1 (optional)      
4x 10GbE RJ45/SFP+ with Intel® X710-TM4 (optional)      
2x 25GbE SFP28 with Broadcom® BCM57414 (optional)      
4x 25GbE RJ45/SFP28 with Mellanox® CX-4 Lx EN Intel® X550-AT2 (optional)      
2x 100GbE QSFP28 with Broadcom® BCM57508 (optional)
IPMISupport for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output
LAN1 RJ45 Dedicated BMC LAN port
USB2 USB 2.0 port(s) (2 rear)
Video1 VGA port(s)
System BIOS
BIOS TypeAMI 256MB SPI Flash
Management
Power ConfigurationsPower-on mode for AC power recovery      
ACPI Power Management
PC Health Monitoring
CPUMonitors for CPU Cores, Chipset Voltages, Memory
FANFans with tachometer monitoring      
Pulse Width Modulated (PWM) fan connectors      
Status monitor for speed control
TemperatureMonitoring for CPU and chassis environment      
Thermal Control for fan connectors
Chassis
Form Factor2U Rackmount
ModelCSE-HS829-R1K24P
Dimensions and Weight
Height3.5" (88.9mm)
Width17.2" (437mm)
Depth31.6" (803mm)
Package10.4" (H) x 23.8" (W) x 43.6" (D)
WeightNet Weight: 37 lbs (16.8 kg) Gross Weight: 63 lbs (28.6 kg)
Available ColorN/A
Front Panel
ButtonsPower On/Off      
UID button
LEDsHDD activity      
LAN1 activity      
Power status      
System information
Expansion Slots
PCI-Express (PCIe)4 (Optional) PCIe 5.0 x16 or x8 FH, 10.5"L slot(s)      
4 (Optional) PCIe 5.0 x8 FH, 10.5"L slot(s)
Drive Bays / Storage
Hot-swap12x 3.5" hot-swap NVMe/SATA/SAS drive bays
M.22 M.2 NVMe OR 2 M.2 SATA3
System Cooling
Fans4x 8cm heavy duty fans with optimal fan speed control
Air Shroud2 Air Shroud(s)
Liquid CoolingDirect to Chip (D2C) Cold Plate (optional)
Power Supply1U 800W/1200W Redundant Titanium CRPS w/PMBus power supply
Dimension (W x H x L)73.5 x 40 x 265 mm
AC Input800W: 100-127Vac / 9.8A-7A / 50-60Hz      
1200W: 200-240Vac / 7.5A-6A / 50-60Hz
+12VMax: 83A / Min: 0A (100Vac-127Vac)      
Max: 100A / Min: 0A (200Vac-240Vac)
12V SBMax: 2.1A / Min: 0A
Output Type25 Pairs Gold Finger Connector
Operating Environment
Environmental Spec.Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)      
Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)      
Operating Relative Humidity: 8% to 90% (non-condensing)      
Non-operating Relative Humidity: 5% to 95% (non-condensing)

Best-in-class Performance and Flexibility Rackmount Server

Ultimate Configurability for Enterprise Applications

 

The new X13 Hyper series brings next-generation performance to Supermicro’s range of rackmount servers, built to take on the most demanding workloads along with the storage & I/O flexibility that provide a custom fit for a wide range of application needs. Maintenance-friendly design innovations eliminate the need for tools when servicing the system to simplify rollout and installation.

Anewtech-Systems-Rackmount-Server-Supermicro-SYS-621H-TN12R Supermicro Singapore Supermicro Servers

Optimized for Storage Capacity

SYS-621H-TN12R

2U Hyper
12x 3.5” NVMe/SAS/SATA drives

Anewtech-Systems-Rackmount-Server-Supermicro-SYS-221H-TNR Supermicro Singapore Supermicro Servers

Optimized for Storage Performance

SYS-221H-TNR/ SYS-221H-TN24R 

2U Hyper
Liquid Cooling options
Up to 24x 2.5” NVMe/SAS/SATA drives

Anewtech-Systems-Rackmount-Server-Supermicro-SYS-121H-TNRSupermicro Singapore Supermicro Servers

Compute & Storage Powerhouse

SYS-121H-TNR

1U Hyper
Liquid Cooling options
12x 2.5” NVMe/SAS/SATA drives

 

5th Gen Intel® Xeon® Scalable Processors

  • Up to 64 cores and 385W TDP per CPU
  • Support for Intel Xeon® Max Series CPUs with High Bandwidth Memory
  • Support for PCIe 5.0, DDR5 and CXL 1.1
  • Built on the Intel® 7 process
  • Built in accelerators:
    • Intel AMX
    • Intel® Dynamic Load Balancer
    • Intel® QuickAssist
    • Technology (QAT)
    • Intel vRAN Boost
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Delivering Solutions Optimized for Tomorrow’s Data Center Workloads

Complete Rack-Scale Solutions

  • Full design, integration, validation and testing services for rack-scale and multi-rack clusters
  • Complete rack-scale liquid cooling solutions developed in house

Performance and Energy Optimized

  • Enhanced thermal capacity to support the highest performing CPUs and GPUs
  • Optimized to run in high-temperature data center environments up to 40°C
 

Improved Security and Manageability

  • Industry-standard compliance for hardware and silicon Root of Trust (RoT)
  • Cryptographical attestation of components throughout the entire supply chain

Supports Open Industry Standards

  • The latest industry technologies including PCIe 5.0, DDR5, and CXL
  • Open Compute Project (OCP) standards including OCP 3.0, OAM, ORV2 and OSF as well as Open BMC