SYS-111E-WR
1U UP WIO Server. 10 hot-swap 2.5" NVMe/SAS/SATA bays and 2 PCIe 5.0 x16 slots
- Single Socket E (LGA-4677) 4th/5th Gen Intel® Xeon® Scalable processors. Up to 300W TDP
- Intel® C741 Chipset
- 8 DIMMs; Supports 3DS DDR5 RDIMM. Up to 4800 MT/s
2 PCIe 5.0 x16 FHFL;
1 PCIe 5.0 x8(in x16) LP;
1 PCIe 3.0 x2 NVMe M.2 - Onboard 1G LAN ports (Intel® i210), 1 dedicated IPMI LAN
- 10x front hot-swap 2.5" SATA3 drive bays (Optional all 10 hybrid Gen5 NVMe), SAS3 with additional SAS controller card
- Redundant Platinum 860W Power Supplies
Datasheet
Product Specification
| Product SKUs | SuperServer SYS-111E-WR (Black) |
| Motherboard | Super X13SEW-F |
| Processor | |
| CPU | Single Socket E (LGA-4677) 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors |
| Core Count | Up to 52C/104T; Up to 300MB Cache per CPU |
| Note | Supports up to 300W TDP CPUs (Air Cooled) |
| GPU | |
| Max GPU Count | Up to 1 double-width or 2 single-width GPU(s) |
| Supported GPU | NVIDIA PCIe: RTX A4000,A2,L4,A10 |
| CPU-GPU Interconnect | PCIe 5.0 x16 CPU-to-GPU Interconnect |
| GPU-GPU Interconnect | PCIe |
| System Memory | |
| Memory | Slot Count: 8 DIMM slots/8 Channels Max Memory (1DPC): Up to 2TB 4800MT/s ECC DDR5 RDIMM |
| Memory Voltage | 1.1 V |
| On-Board Devices | |
| SATA | SATA3 (6Gbps); RAID 0/1/5/10 support |
| Chipset | Intel® C741 |
| Network Connectivity | Via AIOM & AOC |
| IPMI | Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support |
| Input / Output | |
| SATA | 12 SATA (6Gbps) port(s) |
| LAN | 1 RJ45 Dedicated IPMI LAN port |
| USB | 2 USB 2.0 port(s) (2 front) 2 USB 3.2 Gen 1 port(s) (2 rear) |
| Video | 1 VGA port(s) |
| Serial Port | 1 COM Port(s) (1 rear) |
| System BIOS | |
| BIOS Type | AMI 32MB SPI Flash EEPROM |
| Management | |
| Software | IPMI 2.0 KVM with dedicated LAN Super Diagnostics Offline SuperDoctor® 5 Supermicro Update Manager (SUM) Supermicro Power Manager (SPM) Supermicro Server Manager (SSM) Redfish API |
| Power Configurations | ACPI/APM Power Management |
| Security | |
| Hardware | Trusted Platform Module (TPM) 2.0 Silicon Root of Trust (RoT) – NIST 800-193 Compliant |
| Features | Cryptographically Signed Firmware Secure Boot Secure Firmware Updates Automatic Firmware Recovery Supply Chain Security: Remote Attestation Runtime BMC Protections System Lockdown |
| PC Health Monitoring | |
| CPU | 8 Phase-switching voltage regulator Monitors for CPU Cores, Chipset Voltages, Memory |
| FAN | Fans with tachometer monitoring Pulse Width Modulated (PWM) fan connectors Status monitor for speed control |
| Temperature | Monitoring for CPU and chassis environment Thermal Control for fan connectors |
| Chassis | |
| Form Factor | 1U Rackmount |
| Model | CSE-LB16TS-R0AWNP3 |
| Dimensions and Weight | |
| Height | 1.7" (43mm) |
| Width | 17.2" (437mm) |
| Depth | 23.5" (597mm) |
| Package | 7.8" (H) x 23.8" (W) x 32.4" (D) |
| Weight | Net Weight: 25 lbs (11.3 kg) Gross Weight: 40 lbs (18.1 kg) |
| Available Color | Black front & silver body |
| Front Panel | |
| Buttons | Power On/Off Unit Identifier (UID) |
| LEDs | Drive activity Network activity Power status Universal Information |
| Expansion Slots | |
| PCI-Express (PCIe) | 2 PCIe 5.0 x16 FHHL slot(s) 2 PCIe 5.0 x16 OCP 3.0 AIOM NIC slot(s) |
| Note | AIOM slots share PCIe lanes with NVMe drives. Acronyms: (FH = Full Height, LP = Low Profile, FL = Full Length, HL = Half Length) |
| Drive Bays / Storage | |
| Drive Bays | 10x 2.5" NVMe/SATA/SAS drive bays (10x 2.5" NVMe hybrid) |
| M.2 | 2x PCIe 3.0 x 2M-key, 2280, 22110 |
| System Cooling | |
| Fans | 6 middle cooling PWM 40x40x56mm Fan(s) |
| Power Supply | 2x 860W Titanium Level power supplies |
| AC Input | 800W: 100-127Vac 860W: 200-240Vdc 860W: 200-240Vac |
| +12V | Max: 66.67A / Min: 0A (100Vac-127Vac) Max: 71.67A / Min: 0A (200Vdc-240Vdc) Max: 71.67A / Min: 0A (200Vac-240Vac) |
| 5V SB | Max: 4A / Min: 0A |
| Operating Environment | |
| Environmental Spec. | Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -30°C to 60°C (-22°F to 140°F) Operating Relative Humidity: 8% to 80% (non-condensing) Non-operating Relative Humidity: 8% to 90% (non-condensing) |
WIO systems: Industry’s Widest Variety of I/O Optimized Servers
Supermicro WIO systems offer a wide range of I/O options to deliver truly optimized systems for specific requirements. Users can optimize the storage and networking alternatives to accelerate performance, increase efficiency and find the perfect fit for their applications.
In addition to enabling customizable configurations and optimization for multiple application requirements, the Supermicro WIO family of servers also provides attractive cost advantages and investment protection.
- Single socket 5th/4th Gen Intel® Xeon® Scalable processors
- 8 DIMM slots supporting DDR5-5600MHz
- Support for double-width GPUs via top-loading expansion mechanism
- Hot-swappable 2.5" or 3.5" SATA/NVMe storage
- Up to 10x NVMe hybrid storage supported (optional)
Single-processor optimized architecture supporting up to 4 PCIe 5.0 devices
Wide-ranging flexibility for any enterprise workload
5th Gen Intel® Xeon® Scalable Processors
- Up to 64 cores and 385W TDP per CPU
- Support for Intel Xeon® Max Series CPUs with High Bandwidth Memory
- Support for PCIe 5.0, DDR5 and CXL 1.1
- Built on the Intel® 7 process
- Built in accelerators:
- Intel AMX
- Intel® Dynamic Load Balancer
- Intel® QuickAssist
- Technology (QAT)
- Intel vRAN Boost
Delivering Solutions Optimized for Tomorrow’s Data Center Workloads
Complete Rack-Scale Solutions
- Full design, integration, validation and testing services for rack-scale and multi-rack clusters
- Complete rack-scale liquid cooling solutions developed in house
Performance and Energy Optimized
- Enhanced thermal capacity to support the highest performing CPUs and GPUs
- Optimized to run in high-temperature data center environments up to 40°C
Improved Security and Manageability
- Industry-standard compliance for hardware and silicon Root of Trust (RoT)
- Cryptographical attestation of components throughout the entire supply chain
Supports Open Industry Standards
- The latest industry technologies including PCIe 5.0, DDR5, and CXL
- Open Compute Project (OCP) standards including OCP 3.0, OAM, ORV2 and OSF as well as Open BMC