AS-2124BT-HNTR
Four hot-pluggable nodes in 2U Server. 6 Hot-swap 2.5" drive bays
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
- Dual AMD EPYC™ 7003/7002 Series Processors (7003 Series Processor drop-in support requires BIOS version 2.0 or newer)
- Up to 4TB ECC 3DS LRDIMM, up to DDR4-3200MHz; 16 DIMM slots, 3. 2 PCI-E 4.0 x16 (LP) slot; 1 SIOM card support (flexible networking) Note: must bundle with Network card
- Integrated IPMI 2.0 + KVM with dedicated LAN
- Software Out of Band License key (SFT-OOB-LIC) included for OOB BIOS management
- 6 Hot-swap 2.5" drive bays (4 NVMe + 2 SATA3, or 6 SATA3)
- M.2 Interface: 1 SATA/PCI-E 3.0 x4
- M.2 Form Factor: 2280, 22110
- M.2 Key: M-key
- Video via Aspeed AST2500 BMC
- 2200W Redundant Power Supplies Titanium Level (96%) (Full redundancy based on configuration and application load)
Key Applications
- Compute Intensive Applications
- HPC, Data Center, Enterprise Server
- Hyperscale / Hyperconverged
Product Specification
| AS -2124BT-HNTR | A+ Server 2124BT-HNTR |
| Motherboard (per Node) | Super H12DST-B |
| Processor/Chipset (per Node) | |
| CPU | Dual AMD EPYC™ 7003/7002 Series Processors (7003 Series Processor drop-in support requires BIOS version 2.0 or newer) Socket SP3 Support CPU TDP / cTDP up to 225W* |
| Cores | Up to 64 Cores |
| Note | * Certain CPUs with high TDP may be supported only under specific conditions. |
| System Memory (per Node) | |
| Memory Capacity | 16 DIMM slots Supports up to 4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs 8-channel memory bus For Dual CPUs: Recommended that memory be populated equally in adjacent memory banks |
| Memory Type | DDR4 3200 MHz Registered ECC, 288-pin gold-plated DIMMs |
| Memory Sizes | 8GB, 16GB, 32GB, 64GB, 128GB, 256GB |
| Memory Voltage | 1.2V |
| Error Detection | Corrects single-bit errors Detects double-bit errors (using ECC memory) |
| On-Board Devices (per Node) | |
| Chipset | System on Chip |
| Storage | NVMe SATA3 (6Gbps) via AMD EPYC |
| Network | 1 PCI-E 4.0 x16 SIOM LAN Networking Slot for flexible networking, (Must bundle with at least one SIOM network card) |
| IPMI | Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support |
| Video | ASPEED AST2500 BMC |
| Input / Output (per Node) | |
| LAN | Provided via SIOM (optional) 1 RJ45 Dedicated IPMI LAN port |
| USB | 2 USB 3.0 ports (rear) |
| Video | 1 VGA port |
| DOM | 1 Super DOM (Disk on Module) port |
| Others | 1 COM port (header) 1 TPM 2.0 header |
| System BIOS (per Node) | |
| BIOS Type | AMI 32Mb SPI Flash ROM |
| Management (per Node) | |
| Software | IPMI 2.0 , KVM with dedicated LAN, SSM , SUM , SuperDoctor® 5, Watch Dog |
| Power Configurations | ACPI / APM Power Management |
| Chassis | |
| Form Factor | 2U Rackmount |
| Model | CSE-217BHQ+-R2K22BP |
| Dimensions and Weight | |
| Width | 17.25" (438mm) |
| Height | 3.47" (88mm) |
| Depth | 28.5" (724mm) |
| Package | 26.4" (H) x 11.2" (W) x 39.8" (D) |
| Weight | Gross Weight: 85 lbs (38.6 kg) Net Weight: 54.5 lbs (24.7 kg) |
| Available Colors | Black |
| Front Panel (per Node) | |
| Buttons | Power On/Off button UID button |
| LEDs | Power status LED HDD activity LED Network activity LEDs Universal Information (UID) LED |
| Expansion Slots (per Node) | |
| PCI-Express | 2x PCI-E 4.0 (x16) Low-profile slots 1x SIOM card suppor (must bundle with network card) |
| M.2 | Interface: 1 SATA/PCI-E 3.0 x4 Form Factor: 2280, 22110 Key: M-key |
| Drive Bays (per Node) | |
| Hot-swap | 4 Hot-swap 2.5" NVMe/SATA3 + 2 Hot-swap 2.5" SATA3 drive bays |
| System Cooling | |
| Fans | 4 Heavy duty 8cm PWM fans |
| Power Supply | |
| Power Supply | 2200W Redundant Power Supplies with PMBus |
| Total Output Power | 1200W/1800W/1980W/2090/2200W |
| Dimension (W x H x L) | 45 x 40 x 480 mm |
| Input | 1200W: 100-127Vac / 50-60Hz 1800W: 200-220Vac / 50-60Hz 1980W: 220-230Vac / 50-60Hz 2090W: 230-240Vac / 50-60Hz 2090W: 180-220Vac (for UL/cUL only) 2200W: 220-240Vac (for UL/cUL only) 2090W: 230-240Vdc (for CCC only) |
| +12V | Max: 100A / Min: 0A (100-127Vac) Max: 150A / Min: 0A (200-220Vac) Max: 165A / Min: 0A (220-230Vac) Max: 174.17A / Min: 0A (230-240Vac) Max: 174.17A / Min: 0A (180-220Vac, UL/cUL only) Max: 183.33A / Min: 0A (220-240Vac, UL/cUL only) Max: 174.17A / Min: 0A (230-240Vdc, CCC only) |
| 12Vsb | Max: 2.1A / Min: 0A |
| Output Type | Gold Finger |
| Certification | Titanium Level |
| Operating Environment | |
| RoHS | RoHS Compliant |
| Environmental Spec. | Operating Temperature: 10°C ~ 30°C Non-operating Temperature: -40°C to 60°C Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing) |
Twin Systems: Leading Multi-node Architectures
BigTwin is the 5th generation in the Supermicro® Twin Family with a multitude of innovations and engineering breakthroughs. TwinPro systems are designed for simplified deployment and maintenance, and assembled with the highest quality to ensure continuous operation even at maximum capacity.
With AMD EPYC™ 7003 Series Processors with AMD 3D V-Cache™ Technology, customers in high-end enterprise, data center, HPC and Cloud Computing environments receive the greatest competitive advantage from data center resources with the Supermicro® TwinPro.
NO-COMPROMISE 2U 4-NODE ARCHITECTURE
- Highly configurable 2U 4-node systems
- 2-socket with 16 DIMMs or 1-socket with 8 DIMMs per node
- Flexible storage and I/O options including NVMe/SATA3 and SIOM networking
- Applications: HCI , HPC , CDN , 5G UPF , Technical Computing (EDA, CFD, FEA) , Cloud Computing
