SYS-211GT-HNTF
2U 4-Node GrandTwin Server. 4 hot-swap 2.5" NVMe/SATA drives per node and front I/O
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
- Single-Socket, 5th/4th Gen Intel® Xeon® Scalable processors up to 350W TDP
- Intel® C741
- 16 DIMM Slots up to 4TB (with Intel® Optane™ Persistent Memory support)
- Optional AIOM module or PCIe 5.0 x16
- Integrated GrandTwin I/O Module with BMC, 2x USB, VGA and 2x 10GbE or 2x 25GbE
- Two optional storage modules. Each module supports 2x NVMe or SATA drive bays
- 2x cooling fans per 2U enclosure, 16K RPM Heavy Duty; Shared Cooling Design
- 2200W Redundant Power Supplies Titanium Level (96%+); Shared Power Design
Datasheet
Product Specification
| Product SKU | SuperServer SYS-211GT-HNTF (Gray) |
| Motherboard | Super X13SET-G |
| Processor (per Node) | |
| CPU | Single Socket E (LGA 4677) 5th/4th Gen Intel® Xeon® Scalable processors Max Series with high bandwidth memory (HBM) |
| Note | Supports up to 350W TDP CPUs (Aircooled) CPUs with high TDP (air cooled) only supported under specific conditions. Contact Technical Support for details |
| System Memory (per Node) | |
| Memory | Memory Capacity: 16 DIMM slots Up to 4TB: 16x 256 GB DRAM Memory Type: 4800MHz ECC DDR5 RDIMM |
| On-Board Devices (per Node) | |
| Chipset | Intel® C741 |
| Network Connectivity | Via IO Module |
| IPMI | Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support |
| Input / Output (per Node) | |
| LAN | 1 RJ45 Dedicated BMC LAN port |
| USB | 2 USB 3.0 port(s) (2 USB) |
| Video | 1 VGA port(s) |
| System BIOS | |
| BIOS Type | AMI 32MB Flash ROM |
| Management | |
| Software | Supermicro Server Mgmt (Redfish® API) Supermicro Intelligent Mgmt (BMC Resources) Supermicro IPMI Utilities Supermicro Diagnostics Offline (SDO) Supermicro Thin-Ag SuperDoctor® 5 (SD5) Supermicro Power Manager (SPM) Supermicro Update Manager (SUM) Supermicro Server Manager (SSM) SuperCloud Composer |
| PC Health Monitoring | |
| CPU | 7+1 Phase-switching voltage regulator Monitors for CPU Cores, Chipset Voltages, Memory. |
| FAN | Fans with tachometer monitoring Pulse Width Modulated (PWM) fan connectors Status monitor for speed control |
| Temperature | Monitoring for CPU and chassis environment |
| Chassis | |
| Form Factor | 2U Rackmount |
| Model | CSE-GT214BF-R2K21BP2 |
| Dimensions and Weight | |
| Height | 3.46" (88mm) |
| Width | 17.67" (449mm) |
| Depth | 28" (711.2mm) |
| Package | 9.76" (H) x 24.65" (W) x 45.28" (D) |
| Weight | Net Weight: 68 lbs (30.8 kg) Gross Weight: 88 lbs (39.9 kg) |
| Available Color | Gray |
| Front Panel | |
| Buttons | Power On/Off button UID button |
| LEDs | HDD activity LED Network activity LEDs Power status LED Universal Information (UID) LED |
| Expansion Slots (per Node) | |
| PCI-Express (PCIe) | 1 PCIe 5.0 x16 slot(s) |
| Drive Bays / Storage (per Node) | |
| Hot-swap | 4x 2.5" hot-swap NVMe/SATA drive bays (4x 2.5" NVMe dedicated) |
| M.2 | 2 M.2 NVMe OR 2 M.2 SATA3 |
| System Cooling | |
| Fans | 2x 16.5K RPM Heavy Duty 8cm Fan(s) 2x 16K RPM Heavy Duty 8cm Fan(s) |
| Power Supply | Redundant 2200w Titanium Level(96%)High-Efficiency Power Supplies with I2C & PMBus |
| Dimension (W x H x L) | 106 x 84 x 245 mm |
| AC Input | 100-127Vdc (1200W for the Rest of the World) 200-220Vdc (1800W for the Rest of the World) 200-220Vdc (2090W for North America - UL & cUL) 220-230Vdc (1980W for the Rest of the World) 220-240Vdc (2200W for North America - UL & cUL) 230-240Vdc (2090W for the Rest of the World) |
| Operating Environment | |
| RoHS | RoHS Compliant |
| Environmental Spec. | Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (Non-Condensing) Non-operating Relative Humidity: 5% to 95% (Non-Condensing) |
Highly Configurable Single Processor Systems with Front or Rear I/O
GrandTwin® is an all-new architecture purpose-built for single-processor performance. The design maximizes compute, memory and efficiency to deliver maximum density. Powered by 5th/4th Gen Intel® Xeon® Scalable processors, GrandTwin’s flexible modular design can be easily adapted for a wide range of applications, with the ability to add or remove components as required, reducing cost.
For front configurations, all I/O and node trays are fully accessible from the cold aisle, simplifying installation and servicing in space-constrained environments. Flexible storage and networking options are available via front AIOM modules, allowing countless custom configurations.
GrandTwin®
Multi-Node Architecture Optimized for Single-Processor Performance
- 2U 4-Node single-socket architecture designed for maximum memory density
- Flexible front storage bays support E1.S drives, PCIe Gen5 and CXL
- Front-serviceable nodes reduce downtime for higher availability
- Optional front I/O configuration with integrated GrandTwin module reduces cable complexity for spaceconstrained edge data centers
Highly Configurable Single Processor Systems with Front or Rear I/O
5th Gen Intel® Xeon® Scalable Processors
- Up to 64 cores and 385W TDP per CPU
- Support for Intel Xeon® Max Series CPUs with High Bandwidth Memory
- Support for PCIe 5.0, DDR5 and CXL 1.1
- Built on the Intel® 7 process
- Built in accelerators:
- Intel AMX
- Intel® Dynamic Load Balancer
- Intel® QuickAssist
- Technology (QAT)
- Intel vRAN Boost
Delivering Solutions Optimized for Tomorrow’s Data Center Workloads
Complete Rack-Scale Solutions
- Full design, integration, validation and testing services for rack-scale and multi-rack clusters
- Complete rack-scale liquid cooling solutions developed in house
Performance and Energy Optimized
- Enhanced thermal capacity to support the highest performing CPUs and GPUs
- Optimized to run in high-temperature data center environments up to 40°C
Improved Security and Manageability
- Industry-standard compliance for hardware and silicon Root of Trust (RoT)
- Cryptographical attestation of components throughout the entire supply chain
Supports Open Industry Standards
- The latest industry technologies including PCIe 5.0, DDR5, and CXL
- Open Compute Project (OCP) standards including OCP 3.0, OAM, ORV2 and OSF as well as Open BMC