SYS-212GT-HNF
2U 4-Node GrandTwin with up to 8 hot-swap E1.S NVMe drives per node and Front I/O
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
- Highly configurable 2U 4-Node front access nodes for cold aisle serviceability with up to 8x E1.S NVMe drives per node
- 1 PCIe 5.0 x16 LP slot(offering with 4x E1.S drives), or 1 OCP3.0 slot (offering with 2x U.2 drives) for networking expansions
- GrandTwin front IO module offers additional networking options (10G/25G/200G) with NCSI support
- Single-Socket, Intel® Xeon® 6 6700 series processors with E-cores
- 16 DIMM Slots supporting up to 1TB of memory; ECC RDIMMs up to DDR5-6400
Key Applications
- Enterprise Applications
- Scale-Out Object Storage
- Cloud Computing, Compact Server
- Cloud Gaming
- MEC (Multi-Access Edge Computing)
- Multi-Purpose CDN
- Telco Edge Cloud
- Mission Critical Web Applications
- IoT Edge Computing / Gateway
- Edge AI Inferencing
| Product SKU | SuperServer SYS-212GT-HNF |
| Motherboard | Super X14SBT-G |
| Processor (per Node) | |
| CPU | Single Socket E2 (LGA-4710) Intel® Xeon® 6 6700 series processors with E-cores |
| Core Count | Up to 144C/144T; Up to 108MB Cache |
| Note | Supports up to 350W TDP CPUs (Air Cooled) |
| System Memory (per Node) | |
| Memory | Slot Count: 16 DIMM slots/2 Channels Max Memory (2DPC): Up to 1TB 6400MT/s ECC DDR5 RDIMM |
| On-Board Devices (per Node) | |
| NVMe | NVMe; RAID 0/1/5/10 support(VROC HW key required) |
| Chipset | System on Chip |
| Network Connectivity | Via IO Module |
| Input / Output (per Node) | |
| LAN | 1 RJ45 1 GbE Dedicated BMC LAN port(s) |
| USB | 2 USB 3.0 port(s) |
| Video | 1 VGA port(s) |
| System BIOS | |
| BIOS Type | AMI 64MB Flash ROM |
| Management | |
| Software | SuperCloud Composer Supermicro Server Manager (SSM) Super Diagnostics Offline (SDO) Supermicro Thin-Agent Service (TAS) SuperServer Automation Assistant (SAA) New! |
| Security | |
| Hardware | Trusted Platform Module (TPM) 2.0 Silicon Root of Trust (RoT) – NIST 800-193 Compliant |
| Features | Cryptographically Signed Firmware Secure Boot Secure Firmware Updates Automatic Firmware Recovery Supply Chain Security: Remote Attestation Runtime BMC Protections System Lockdown |
| PC Health Monitoring | |
| FAN | Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors |
| Temperature | Monitoring for CPU and chassis environment |
| CPU | Monitors for CPU Cores, Chipset Voltages, Memory. 8+4 Phase-switching voltage regulator |
| Chassis | |
| Form Factor | 2U Rackmount |
| Model | CSV-GT214E-R3K01TBP |
| Dimensions and Weight | |
| Height | 3.46" (88 mm) |
| Width | 17.67" (449 mm) |
| Depth | 28" (711.2 mm) |
| Package | 9.76" (H) x 24.65" (W) x 45.28" (D) |
| Weight | Gross Weight: 88 lbs (39.9 kg) Net Weight: 68 lbs (30.8 kg) |
| Available Color | Silver |
| Front Panel | |
| LED | HDD activity LED Network activity LEDs Power status LED Universal Information (UID) LED |
| Buttons | Power On/Off button UID button |
| Expansion Slots (per Node) | |
| PCI-Express (PCIe) Configuration | Default* 1 PCIe 5.0 x16 LP slot(s) (*Requires additional parts) |
| M.2 | 2 M.2 PCIe 5.0 x4 NVMe slot(s) (M-key 22110(default); VROC required for RAID) |
| Drive Bays / Storage (per Node) | |
| Drive Bays Configuration | Default: Total 8 bay(s) 8 front hot-swap E1.S PCIe 5.0 x4 NVMe* drive bay(s) Option A: Total 4 bay(s) 4 front hot-swap E1.S PCIe 5.0 x4 NVMe* drive bay(s) Option B: Total 4 bay(s) 4 front hot-swap 2.5" PCIe 5.0 x4 NVMe* drive bay(s) Option C: Total 2 bay(s) 2 front hot-swap 2.5" PCIe 5.0 x4 NVMe* drive bay(s) (*NVMe support may require additional storage controller and/or cables) |
| M.2 | 2 M.2 PCIe 5.0 x4 NVMe slot(s) (M-key 22110(default)/2280; USB 2.0; VROC required for RAID) |
| System Cooling | |
| Fans | 2x 16K RPM Heavy Duty 8cm Fan(s) |
| Power Supply | 2x 3000W Redundant (1 + 1) Titanium (certification pending) Level (96%) power supplies |
| Operating Environment | |
| ROHS | RoHS Compliant |
| Environmental Spec. | Operating Temperature: 5°C ~ 40°C (41°F ~ 104°F) Non-operating Temperature: -30°C to 60°C (-22°F to 140°F) Operating Relative Humidity: 8% to 80% (non-condensing) Non-operating Relative Humidity: 8% to 90% (non-condensing) |
X14 GrandTwin®: Multi-Node Architecture Optimized for Single-Processor Performance
The GrandTwin® architecture is an all-new architecture purpose-built for singleprocessor performance. The design maximizes compute, memory and efficiency to deliver maximum density. Powered by Intel® Xeon® 6 processors, GrandTwin’s flexible modular design can be easily adapted for a wide range of applications, with the ability to add or remove components as required, reducing cost. For front configurations, all I/O and node trays are fully accessible from the cold aisle, simplifying installation and servicing in space-constrained environments.
Flexible storage and networking options are available via front AIOM modules, allowing countless custom configurations.
- Single socket per node supporting Intel® Xeon® 6700 series processors with E-cores
- Support for DDR5-6400 with up to 16 DIMMs per node
- Flexible PCIe, storage, and AIOM configurations to suit a wide range of application requirements
- Front I/O configuration to simplify cold-aisle servicing
- Optional support for EDSSF E1.S NVMe drives
SYS-212GT-HNF
2U 4-Node GrandTwin® (Front I/O)
SYS-212GT-HNR
2U 4-Node GrandTwin® (Rear I/O)
What’s New in Supermicro X14 Servers
New Intel® Xeon® 6 Processors
Higher core count for greater compute density
Faster memory bandwidth and new capabilities to extend capacity
EDSFF E1.S and E3.S NVMe support
Data Center Modular Hardware System (DC-MHS) support