SYS-212B-FN4TP
2U Short-depth front I/O System with 2 x 10G ports, 2x 2.5" NVMe drive bays and redundant AC PSU
- Design with compliance to NEBS-Level 3
- Single Intel® Xeon® 6700E series processors with E-cores
- 8 DIMM slots supporting up to 1TB of memory
- Up to 4 PCIe 5.0 x16 (3 FHHL + 1 HHHL) &1 PCIe 5.0 x8 FHHL expansion slots for Accelerator Add-On-Cards
- Onboard 2x 10GbE, 2X 10G SFP+
- Optional 2 front hot-swap 2.5" NVMe drive bays
Key Applications
- 5G Core and Edge
- AI Inference and Machine Learning
- Network Function Virtualization
- Cloud Computing
Product SKU | SuperServer SYS-212B-FN4TP |
Motherboard | Super X14SBM-TP4F |
Processor | |
CPU | Single Socket E2 (LGA-4710) Intel® Xeon® 6 6700 series processors with E-cores |
Core Count | Up to 144C/144T; Up to 108MB Cache |
Note | Supports up to 350W TDP CPUs (Air Cooled)* *Air Cooled CPUs with TDP over 205W only supported under specific conditions. |
GPU | |
Max GPU Count | Up to 4 single-width GPU(s) |
CPU-GPU Interconnect | PCIe 5.0 x16 CPU-to-GPU Interconnect |
GPU-GPU Interconnect | PCIe |
System Memory | |
Memory | Slot Count: 8 DIMM slots Max Memory (2DPC): Up to 1TB 6400MT/s ECC DDR5 RDIMM |
On-Board Devices | |
NVMe | NVMe; RAID 0/1 support(Intel® VROC RAID key required) |
Chipset | System on Chip |
Network Connectivity | 2 RJ45 10GBASE-T with Intel® X710-TM4 2 SFP+ 10GbE with Intel® X710-TM4 |
Input / Output | |
LAN | 1 RJ45 1 GbE Dedicated BMC LAN port(s) 2 SFP+ 10 GbE LAN port(s) 2 RJ45 10 GbE LAN port(s) (Intel® X550-AT2) |
USB | 2 USB 3.2 Gen1 Type-A port(s) (front) 2 USB 3.2 Gen1 Type-A port(s) (Header) |
Video | 1 VGA port(s) |
Serial | 1 COM port(s) (Header) |
System BIOS | |
BIOS Type | AMI 256MB SPI Flash |
Management | |
Software | SuperCloud Composer Supermicro Server Manager (SSM) Super Diagnostics Offline (SDO) Supermicro Thin-Agent Service (TAS) SuperServer Automation Assistant (SAA) New! |
Power configurations | ACPI Power Management Power-on mode for DC power recovery |
Security | |
Hardware | Trusted Platform Module (TPM) 2.0 Silicon Root of Trust (RoT) – NIST 800-193 Compliant |
Features | Cryptographically Signed Firmware Secure Boot Secure Firmware Updates Automatic Firmware Recovery Supply Chain Security: Remote Attestation Runtime BMC Protections System Lockdown |
PC Health Monitoring | |
CPU | Monitors for CPU Cores, Chipset Voltages, Memory |
FAN | Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors |
Temperature | Monitoring for CPU and chassis environment CPU thermal trip support, PEPI |
Chassis | |
Form Factor | 2U Rackmount |
Model | CSE-211M-R000NDP |
Dimensions and Weight | |
Height | 3.5" (88.9 mm) |
Width | 17.2" (436.88 mm) |
Depth | 11.8" (298.8 mm) |
Package | 7.4" (H) x 19.3" (W) x 23.3" (D) |
Weight | Gross Weight: 22 lbs (10 kg) Net Weight: 17 lbs (7.7 kg) |
Available Color | Silver/Black |
Expansion Slots | |
PCI-Express (PCIe) Configuration | Default 2 PCIe 5.0 x16 FHHL slot(s) 1 PCIe 5.0 x16 HHHL slot(s) 1 PCIe 5.0 x8 HHHL slot(s) Option A* 3 PCIe 5.0 x16 FHHL slot(s) 1 PCIe 5.0 x8 FHHL slot(s) 1 PCIe 5.0 x8 HHHL slot(s) Option B* 3 PCIe 5.0 x16 FHHL slot(s) 1 PCIe 5.0 x8 FHHL slot(s) 1 PCIe 5.0 x16 HHHL slot(s) (*Requires additional parts, please see the optional parts list for details. ) |
M.2 | 2 M.2 PCIe 5.0 x2 NVMe slot(s) (M-key) |
Drive Bays / Storage | |
Drive Bays Configuration | Default: Total 2 bay(s) 2 front hot-swap 2.5" NVMe drive bay(s) |
M.2 | 2 M.2 PCIe 5.0 x2 NVMe slot(s) (M-key 2280/22110) |
System Cooling | |
Fans | 4x 4-PIN PWM 8cm Fan(s) |
Power Supply | 2x 800W Redundant (1 + 1) power supplies 2x 600W Redundant (1 + 1) Typical 90%+ Level (92%) power supplies 2x 800W Redundant (1 + 1) Titanium Level (96%) power supplies |
Operating Environment | |
Environmental Spec. | Operating Temperature: 0°C ~ 45°C (32°F ~ 113°F) Non-operating Temperature: -40°C to 70°C (-40°F to 158°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing) |
Telco/Edge: Optimized Designs for 5G, Edge Computing and Emerging IoT Systems
Supermicro provides innovative and first-to-market technologies that are the building blocks for today's computing platforms. Rapid growth in embedded markets and open standards are driving the need for higher levels of product integration and optimization through virtualization, AI inferencing, network connectivity, remote management, mobile communication, expanded I/O, and device-to-device communications using space and power-efficient configurations.
Supermicro's family of high-performance embedded products is optimized for a wide range of applications and solutions. Supermicro offers many flexible and customized solutions for critical OEM projects, as well as advanced designs for stringent environments, firmware customization, BOM enhancements, and a wide range of legacy IO support.
What’s New in Supermicro X14 Servers
New Intel® Xeon® 6 Processors
Higher core count for greater compute density
Faster memory bandwidth and new capabilities to extend capacity
EDSFF E1.S and E3.S NVMe support
Data Center Modular Hardware System (DC-MHS) support