AS-2145GH-TNMR-LCC
2U AMD liquid cooled quad APU system with 4 AMD Instinct™ MI300A accelerators
- Quad AMD® EPYC™ MI300A processors
- HBM3 Stacks 512GB
- Optional PCIe configurations up to 6 PCIe slots x16 FHHL
- Flexible networking options with 2 AIOM networking slot (OCP NIC 3.0 compatible)
- Default 8x 2.5" Hot-swap NVMe or Optional 8x 2.5" SAS3/SATA3 via storage add-on card;
- 2x internal M.2 NVMe/SATA;
- 3 heavy duty fans w/ Liquid Cooled
- 4x 2700W redundant Titanium level power supplies
Key Applications
- Artificial Intelligence (AI)
- Cloud Solution Provider (CSP)
- High Performance Comptue (HPC)
- Large Language Model (LLM)
| Product SKUs | A+ Server AS -2145GH-TNMR |
| Motherboard | Super H13QSH |
| Processor | |
| CPU | Quad Socket SH5 AMD Instinct™ MI300A Accelerated Processing Units (APUs) |
| Note | Supports up to 760W TDP CPUs (Liquid Cooled) |
| GPU | |
| Max GPU Count | Up to 4 onboard GPU(s) |
| Supported GPU | AMD: Instinct MI300A APU |
| System Memory | |
| Memory | Max Memory (1DPC): Up to 512GB ECC HBM3 |
| On-Board Devices | |
| Chipset | AMD SH5 |
| Network Connectivity | Via AIOM |
| Input / Output | |
| LAN | 1 RJ45 Dedicated IPMI LAN port |
| USB | 2 USB 2.0 port(s) (2 front) 2 USB 3.0 port(s) (2 rear) |
| Video | 1 VGA port(s) 1 DisplayPort (s) |
| Serial Port | 1 COM Port(s) (1 rear) |
| System BIOS | |
| BIOS Type | AMI 32MB SPI Flash EEPROM |
| Security | |
| Hardware | Trusted Platform Module (TPM) 2.0 |
| PC Health Monitoring | |
| CPU | 4+1 Phase-switching voltage regulator Monitors for CPU Cores, Chipset Voltages, Memory |
| FAN | Fans with tachometer monitoring Pulse Width Modulated (PWM) fan connectors Status monitor for speed control |
| Temperature | Monitoring for CPU and chassis environment Thermal Control for fan connectors |
| Chassis | |
| Form Factor | 2U Rackmount |
| Model | CSE-218H2TS-R3K2AWP |
| Dimensions and Weight | |
| Height | 3.5" (87.9mm) |
| Width | 17.3" (438.4mm) |
| Depth | 32" (812.9mm) |
| Package | 9.75" (H) x 26.5" (W) x 43.5" (D) |
| Weight | Net Weight: 45.5 lbs (20.64 kg) Gross Weight: 71.5 lbs (32.43 kg) |
| Available Color | Black |
| Expansion Slots | |
| PCI-Express (PCIe) | 4 PCIe 5.0 x16 FHHL slot(s) 2 PCIe 5.0 x16 AIOM slot(s) |
| Drive Bays / Storage | |
| Hot-swap | 8x 2.5" hot-swap NVMe/SAS3/SATA3 drive bays |
| M.2 | 2 M.2 NVMe OR 2 M.2 SATA3 |
| System Cooling | |
| Fans | 3 Heavy duty counter-rotating 8cm Fan(s) |
| Liquid Cooling | Direct to Chip (D2C) Cold Plate (optional) |
| Power Supply | 4x 2700W Redundant (3 + 1) Titanium Level (96%) power supplies |
| Operating Environment | |
| RoHS | RoHS Compliant |
| Environmental Spec. | Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (Non-Condensing) Non-operating Relative Humidity: 5% to 95% (Non-Condensing) |
Targeting accelerated HPC workloads, this 2U 4-way multi-APU system with liquid cooling integrates 4 AMD Instinct™ MI300A accelerators. Each APU combines high-performance AMD CPU, GPU and HBM3 memory for a total of 912 AMD CDNA™ 3 GPU compute units and 96 “Zen 4” cores in one system. Supermicro's direct-to-chip custom liquid-cooling technology enables exceptional TCO with over 51% data center energy cost savings. Furthermore, there is a 70% reduction in fans compared to air-cooled solutions. The rack-scale integration optimized with the dual AIOM and 400G networking creates a high-density supercomputing cluster with up to 21 2U systems in a 48U rack.
Quad APU Liquid Cooled Server
Powered by AMD Instinct™ MI300A Accelerators
Targeting accelerated HPC workloads, 2U liquid cooled systems integrate 4 AMD Instinct™ MI300A APU accelerators
- 4 APUs combine high-performance AMD CPU, GPU and HBM3 memory for a total of 912 AMD CDNA™ 3 GPU compute units and 96 “Zen 4” cores, and 512GB of unified HBM3 memory in one system.
- PCIe 5.0 expansion slots for high-speed networking including RDMA to APU memory
- 2 PCIe 5.0 Open Compute Project (OCP) 3.0 AIOM slots
- Fully optimized for the most popular AI & ML frameworks—PyTorch, TensorFlow, JAX, ONYX-RT, Triton
Proven to Perform at Scale
Industry-Proven System Designs
8U high-performance fabric 8-GPU system leveraging industry-standard OCP Accelerator Module (OAM) to support AMD’s MI300X Accelerators. 4U and 2U multi-processor APU systems integrate 4 AMD Instinct™ MI300A accelerators.
Purpose Built for AI & HPC
Feature maximized and power optimized, supporting up to 16x dedicated hot-swap NVMe drives, full-performance GPUs, CPUs, and memory, and high-speed networking for large-scale cluster deployments.
Advanced Cooling Options
Flexible cooling options for air- and liquid-cooled racks, with liquid-cooled solutions delivering exceptional TCO with over 51% data center energy cost savings.
Designed to Scale
Designed with full scalability in mind, supporting 8 high-speed 400G networking cards providing direct connectivity to each GPU for massive AI clusters.
Optimized Solutions for AI and HPC
Supermicro Systems with AMD Instinct™ MI300 Series Accelerator
 |  |  | |
| Form Factor | 8U 8-GPU System with AMD Instinct MI300X Accelerators (air-cooled) | 2U 4-GPU System with AMD Instinct MI300A Accelerators (liquid-cooled) | 4U 4-GPU System with AMD Instinct MI300A Accelerators (air-cooled) |
| CPU | Dual AMD EPYC 9004 Series Processors with up to 128 cores/256 threads per socket | Quad AMD Instinct MI300A APUs with total of 96 CPU cores (4x 24 AMD “Zen4” cores) | Quad AMD Instinct MI300A APUs with total of 96 CPU cores (4x 24 AMD “Zen4” cores) |
| GPU | 8x AMD Instinct MI300X Accelerators with 192GB HBM3 memory per GPU interconnected on AMD Universal Base Board (UBB 2.0) | 4x AMD Instinct MI300A with 228 AMD CDNA 3 GPU compute units per APU | 4x AMD Instinct MI300A with 228 AMD CDNA 3 GPU compute units per APU |
| Memory | Up to 6TB (24x 256GB DRAM) 4800MT/s ECC DDR5 RDIMM/LRDIMM | 512 GB unified HBM3 memory with up to 5.3 TB/s bandwidth | 512 GB unified HBM3 memory with up to 5.3 TB/s bandwidth |
| Drives | 16x hot-swap PCIe 5.0 U.2 NVMe, 1x onboard M.2 NVMe, 2x 2.5" SATA | 2x onboard 2280 or 22110 M.2 NVMe and 8x hot-swap 2.5" U.2 NVMe | 2x onboard 2280 or 22110 M.2 NVMe and 8x hot-swap 2.5" U.2 NVMe or 24x 2.5" SAS/SATA |
| Networking | 8x PCIe 5.0 high-performance networking cards, up to 400G with Ethernet or InfiniBand | 2x AIOM (OCP 3.0) with up to 400G and additional 4x PCIe 5.0 (x8) slots | 2x AIOM (OCP 3.0) with up to 400G and additional 4x PCIe 5.0 (x8) slots |
| Interconnect | AMD Infinity Fabric™ Links, up to 896GB/s of peer-to-peer inter-GPU connectivity | AMD Infinity Fabric Links, up to 384GB/s of peer-to-peer inter-GPU connectivity | AMD Infinity Fabric Links, up to 384GB/s of peer-to-peer inter-GPU connectivity |
| Power | 6x or 8x 3000W redundant Titanium Level power supplies | 4x 1600W redundant Titanium Level power supplies | 4x 1600W redundant Titanium Level power supplies |
| Cooling | Air Cooling | Liquid Cooling | Air Cooling |
Resources:
A+ Server Solutions
Up to 128 cores/256 threads per socket, max 400W TDP per socket with AMD EPYC 9004 series processors
Supermicro and AMD Deliver Rack Scale AI and HPC Solutions Accelerators
Incorporating AMD Instinct MI300X and MI300A Accelerators