AS-8125GS-TNMR2
8U 8-GPU Server with AMD Instinct MI300X Accelerators (air-cooled)
- 8 NIC for GPU direct RDMA (1:1 GPU Ratio)
- High density 8U system with AMD Instinct MI300X 8-GPU
- 24 DIMM Slots;
- Up to 6TB DRAM;
- 4800 ECC DDR5 LRDIMM;RDIMM;
- 8 PCIe Gen 5.0 X16 LP, and up to 4 PCIe Gen 5.0 X16 FHFL Slots
- Flexible networking options
- 1 M.2 NVMe for boot drive only
- 2x 2.5" Hot-swap SATA drive bays
- up to 16x 2.5" Hot-swap NVMe drive bays (12 by default + 4 optional)
- 10 heavy duty fans with optimal fan speed control
- 6x 3000W redundant Titanium level power supplies
| Product SKUs | A+ Server AS -8125GS-TNMR2 (Black front & silver body) |
| Motherboard | Super H13DSG-OM |
| Processor | |
| CPU | Dual Socket SP5 AMD EPYC™ 9004 Series Processor |
| Note | Supports up to 400W TDP CPUs (Air Cooled) |
| GPU | |
| Max GPU Count | 8 onboard GPU(s) |
| System Memory | |
| Memory | Slot Count: 24 DIMM slots Max Memory (2DPC): Up to 6TB 4800MT/s ECC DDR5 RDIMM/LRDIMM |
| Memory Voltage | 1.1 V |
| On-Board Devices | |
| Chipset | AMD SP5 |
| Input / Output | |
| Video | 1 VGA port(s) |
| System BIOS | |
| BIOS Type | AMI 32MB SPI Flash EEPROM |
| Security | |
| Hardware | Trusted Platform Module (TPM) 2.0 |
| PC Health Monitoring | |
| CPU | 7 +1 Phase-switching voltage regulator Monitors for CPU Cores, Chipset Voltages, Memory |
| FAN | Fans with tachometer monitoring Status monitor for speed control |
| Temperature | Monitoring for CPU and chassis environment Thermal Control for fan connectors |
| Chassis | |
| Form Factor | 8U Rackmount |
| Model | CSE-GP801TS |
| Dimensions and Weight | |
| Height | 14" (355.6mm) |
| Width | 17.2" (437mm) |
| Depth | 33.2" (843.28mm) |
| Package | 29.5" (H) x 27.5" (W) x 51.2" (D) |
| Weight | Net Weight: 166 lbs (75.3 kg) Gross Weight: 225 lbs (102.1 kg) |
| Available Color | Black front & silver body |
| Front Panel | |
| Buttons | Power On/Off button System Reset button |
| LEDs | Hard drive activity LED Network activity LEDs Power status LED System Overheat & Power Fail LED |
| Expansion Slots | |
| PCI-Express (PCIe) | 8 PCIe 5.0 x16 LP slot(s) 2 PCIe 5.0 x16 FHFL slot(s) |
| Drive Bays / Storage | |
| Hot-swap | 18x 2.5" hot-swap NVMe/SATA drive bays (16x 2.5" NVMe dedicated) |
| M.2 | 1 M.2 NVMe |
| System Cooling | |
| Fans | N/A |
| Power Supply | 6x 3000W Redundant Titanium Level power supplies |
| Dimension (W x H x L) | 106.5 x 82.1 x 245.5 mm |
| AC Input | 3000W: 0240Vdc / 50-60Hz (for CQC only) 2880W: 200-207Vac / 50-60Hz 3000W: 207-240Vac / 50-60Hz |
| +12V | Max: 91.66A / Min: 0A (200Vdc-240Vdc) |
| 12V SB | Max: 3A / Min: 0A |
| Output Type | Backplanes (gold finger) |
| Operating Environment | |
| Environmental Spec. | Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing) |
Built on Supermicro’s proven AI building-block system architecture, the new 8U 8-GPU system with AMD Instinct MI300X accelerators streamline deployment at scale for the largest AI models and reduce lead time. The 8U 8-GPU air-cooled solution is feature maximized and power optimized supporting dedicated I/O and dedicated storage per GPU, full performance GPUs, CPUs, and memory, and high-speed networking for large scale cluster deployments. These powerful GPUs enhance operations per-second and performance-per watt at rack scale.
8U 8-GPU System AS-8125GS-TNMR2
Proven 8U high-performance fabric 8-GPU system design with AMD Instinct™ MI300X accelerators
Key Features
- Industry standard OCP Accelerator Module (OAM) with eight accelerators interconnected on an AMD Universal Base Board (UBB 2.0)
- Industry-leading 1.5TB HBM3 GPU memory in a single server node, over 6TB HBM3 GPU memory in an air-cooled rack
- 1:1 400G networking dedicated for each GPU designed for large scale AI and supercomputing clusters
- 2-socket design supporting 4th Gen AMD EPYC™ Processors
- Up to 24 DIMMs for up to 6 TB of DDR5-4800 memory
- Flexible PCIe 5.0 options for I/O and networking
Proven to Perform at Scale
Industry-Proven System Designs
8U high-performance fabric 8-GPU system leveraging industry-standard OCP Accelerator Module (OAM) to support AMD’s MI300X Accelerators. 4U and 2U multi-processor APU systems integrate 4 AMD Instinct™ MI300A accelerators.
Purpose Built for AI & HPC
Feature maximized and power optimized, supporting up to 16x dedicated hot-swap NVMe drives, full-performance GPUs, CPUs, and memory, and high-speed networking for large-scale cluster deployments.
Advanced Cooling Options
Flexible cooling options for air- and liquid-cooled racks, with liquid-cooled solutions delivering exceptional TCO with over 51% data center energy cost savings.
Designed to Scale
Designed with full scalability in mind, supporting 8 high-speed 400G networking cards providing direct connectivity to each GPU for massive AI clusters.
Optimized Solutions for AI and HPC
Supermicro Systems with AMD Instinct™ MI300 Series Accelerator
 |  |  | |
| Form Factor | 8U 8-GPU System with AMD Instinct MI300X Accelerators (air-cooled) | 2U 4-GPU System with AMD Instinct MI300A Accelerators (liquid-cooled) | 4U 4-GPU System with AMD Instinct MI300A Accelerators (air-cooled) |
| CPU | Dual AMD EPYC 9004 Series Processors with up to 128 cores/256 threads per socket | Quad AMD Instinct MI300A APUs with total of 96 CPU cores (4x 24 AMD “Zen4” cores) | Quad AMD Instinct MI300A APUs with total of 96 CPU cores (4x 24 AMD “Zen4” cores) |
| GPU | 8x AMD Instinct MI300X Accelerators with 192GB HBM3 memory per GPU interconnected on AMD Universal Base Board (UBB 2.0) | 4x AMD Instinct MI300A with 228 AMD CDNA 3 GPU compute units per APU | 4x AMD Instinct MI300A with 228 AMD CDNA 3 GPU compute units per APU |
| Memory | Up to 6TB (24x 256GB DRAM) 4800MT/s ECC DDR5 RDIMM/LRDIMM | 512 GB unified HBM3 memory with up to 5.3 TB/s bandwidth | 512 GB unified HBM3 memory with up to 5.3 TB/s bandwidth |
| Drives | 16x hot-swap PCIe 5.0 U.2 NVMe, 1x onboard M.2 NVMe, 2x 2.5" SATA | 2x onboard 2280 or 22110 M.2 NVMe and 8x hot-swap 2.5" U.2 NVMe | 2x onboard 2280 or 22110 M.2 NVMe and 8x hot-swap 2.5" U.2 NVMe or 24x 2.5" SAS/SATA |
| Networking | 8x PCIe 5.0 high-performance networking cards, up to 400G with Ethernet or InfiniBand | 2x AIOM (OCP 3.0) with up to 400G and additional 4x PCIe 5.0 (x8) slots | 2x AIOM (OCP 3.0) with up to 400G and additional 4x PCIe 5.0 (x8) slots |
| Interconnect | AMD Infinity Fabric™ Links, up to 896GB/s of peer-to-peer inter-GPU connectivity | AMD Infinity Fabric Links, up to 384GB/s of peer-to-peer inter-GPU connectivity | AMD Infinity Fabric Links, up to 384GB/s of peer-to-peer inter-GPU connectivity |
| Power | 6x or 8x 3000W redundant Titanium Level power supplies | 4x 1600W redundant Titanium Level power supplies | 4x 1600W redundant Titanium Level power supplies |
| Cooling | Air Cooling | Liquid Cooling | Air Cooling |