SYS-421GE-TNHR2-LCC
DP Intel 4U Liquid-Cooled GPU Server, NVIDIA HGX H100 8-GPU
- 5th/4th Gen Intel® Xeon® Scalable processor support
- 32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 5600MTs ECC DDR5
- 8 PCIe Gen 5.0 X16 LP
- 2 PCIe Gen 5.0 X16 FHHL Slots, 2 PCIe Gen 5.0 X16 FHHL Slots (optional)
- Flexible networking options
- 2 M.2 NVMe for boot drive only
- Optional: 8x 2.5" Hot-swap SATA drive bays
- 8x 2.5" Hot-swap NVMe drive bays
- 4 heavy duty fans with optimal fan speed control
- 4x 5250W(2+2) Redundant Power Supplies, Titanium Level
Datasheet
Product Specification
| Product SKUs | SuperServer SYS-421GE-TNHR2-LCC |
| Motherboard | Super X13DEG-M |
| Processor | |
| CPU | Dual Socket E (LGA-4677) 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors Supports Intel Xeon CPU Max Series with high bandwidth memory (HBM) |
| Core Count | 64C/128T; 320MB Cache per CPU |
| Note | Supports up to 385W TDP CPUs (Liquid Cooled) |
| GPU | |
| Max GPU Count | Up to 8 onboard GPU(s) |
| Supported GPU | NVIDIA SXM: HGX H100 8-GPU (80GB) |
| CPU-GPU Interconnect | PCIe 5.0 x16 CPU-to-GPU Interconnect |
| GPU-GPU Interconnect | NVIDIA® NVLink® with NVSwitch™ |
| System Memory | |
| Memory | Slot Count: 32 DIMM slots Max Memory (1DPC): 4TB 5600MT/s ECC DDR5 RDIMM Max Memory (2DPC): 8TB 4400MT/s ECC DDR5 RDIMM |
| On-Board Devices | |
| Chipset | Intel® C741 |
| Network Connectivity | 2 SFP28 25GbE with Broadcom® BCM57414 (optional) 2 RJ45 10GbE with Intel® X710-AT2 (optional) |
| IPMI | Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support |
| Input / Output | |
| Video | 1 VGA port(s) |
| System BIOS | |
| BIOS Type | AMI 32MB SPI Flash EEPROM |
| Management | |
| Power configurations | Power-on mode for AC power recovery ACPI Power Management |
| Security | |
| Hardware | Trusted Platform Module (TPM) 2.0 Silicon Root of Trust (RoT) – NIST 800-193 Compliant |
| Features | Cryptographically Signed Firmware Secure Boot Secure Firmware Updates Automatic Firmware Recovery Supply Chain Security: Remote Attestation Runtime BMC Protections System Lockdown |
| PC Health Monitoring | |
| CPU | Monitors for CPU Cores, Chipset Voltages, Memory 8+4 Phase-switching voltage regulator |
| FAN | Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors |
| Temperature | Monitoring for CPU and chassis environment Thermal Control for fan connectors |
| Chassis | |
| Form Factor | 4U Rackmount |
| Model | CSE-GP401TS-R000NP |
| Dimensions and Weight | |
| Height | 6.85" (174 mm) |
| Width | 17.7" (449 mm) |
| Depth | 33.2" (842 mm) |
| Package | 13" (H) x 48" (W) x 26.4" (D) |
| Weight | Gross Weight: 138.89 lbs (63 kg) Net Weight: 80.03 lbs (53 kg) |
| Available Color | Silver |
| Front Panel | |
| Buttons | UID button |
| Expansion Slots | |
| PCI-Express (PCIe) Configuration | Default 8 PCIe 5.0 x16 LP slot(s) 2 PCIe 5.0 x16 FHHL slot(s) Option A 8 PCIe 4.0 x16 LP slot(s) 4 PCIe 5.0 x16 FHHL slot(s) |
| Drive Bays / Storage | |
| Drive Bays Configuration | Default: Total 8 bay(s) 8 front hot-swap 2.5" NVMe drive bay(s) |
| M.2 | 2 M.2 NVMe slot(s) (M-key) |
| System Cooling | |
| Fans | 4 Fan 8cm Fan(s) |
| Liquid Cooling | Direct to Chip (D2C) Cold Plate (optional) |
| Power Supply | 4x 5250W Redundant Titanium (certification pending) Level power supplies |
| Dimension (WxHxL) | 106.5 x 82.1 x 245.3 mm |
| +12V | Max: 125A / Min: 0A (200Vac-240Vac) |
| AC Input | 5250W: 200-240Vac / 50-60Hz |
| Output Type | Backplanes (gold finger) |
| Operating Environment | |
| Environmental Spec. | Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing) |
Generative AI SuperCluster
The full turn-key data center solution accelerates time-to-delivery for mission-critical enterprise use cases, and eliminates the complexity of building a large cluster, which previously was achievable only through the intensive design tuning and time-consuming optimization of supercomputing.
Highest Density Datasheet
With 32 NVIDIA HGX H100/H200 8-GPU, 4U Liquid-cooled Systems (256 GPUs) in 5 Racks
Key Features
- Doubling compute density through Supermicro’s custom liquid-cooling solution with up to 40% reduction in electricity cost for data center
- 256 NVIDIA H100/H200 GPUs in one scalable unit
- 20TB of HBM3 with H100 or 36TB of HBM3e with H200 in one scalable unit
- 1:1 networking to each GPU to enable NVIDIA GPUDirect RDMA and Storage for training large language model with up to trillions of parameters
- Customizable AI data pipeline storage fabric with industry leading parallel file system options
- NVIDIA AI Enterprise Software Ready
Compute Node
