SYS-122HA-TN-LCC
1U Hyper with 8 hot-swap 2.5" NVMe bays and 2 PCIe 5.0 x16 + 1 PCIe 5.0 x16 AIOM slot
- Dual Intel® Xeon® 6900-Series Processors with P-cores up to 500W with D2C liquid cooling
- Up to 24 DIMMs supporting up to 6TB 6400MT/s DDR5 RDIMM or 3TB 8800MT/s DDR5 MRDIMM
- 8 2.5" hot-swap NVMe drive bays; Optional 4 2.5" hot-swap NVMe drive bays
- 2 PCIe 5.0 x16 slots (full-height, 10.5" length)
- 1 AIOM/OCP 3.0 NIC slot for flexible networking options
- Redundant titanium level power supplies with options from 1600W to 2600W
- 1U Rackmount chassis with 30.66" (778.7mm) depth
Key Applications
- Artificial Intelligence (AI)
- Virtualization
- High Performance Computing
- Data Analytics
Datasheet
Product Specification
| Product SKUs | SuperServer SYS-122HA-TN-LCC |
| Motherboard | Super X14DBM-APL |
| Processor | |
| CPU | Dual Socket BR (LGA-7529) Intel® Xeon® 6900 series processors with P-cores |
| Core Count | Up to 128C/256T; Up to 504MB Cache per CPU |
| Note | Supports up to 500W TDP CPUs (Liquid Cooled) |
| System Memory | |
| Memory | Slot Count: 24 DIMM slots Max Memory (1DPC): Up to 6TB 6400MT/s ECC DDR5 RDIMM Max Memory (1DPC): Up to 3TB 8800MT/s ECC DDR5 MRDIMM |
| On-Board Devices | |
| NVMe | NVMe; RAID 0/1/5/10 support(Intel® VROC RAID key required) |
| Chipset | System on Chip |
| Network Connectivity | Via AIOM |
| Input / Output | |
| LAN | 1 RJ45 1 GbE Dedicated BMC LAN port |
| USB | 2 USB 3.0 ports(rear) 1 USB 3.0 port(front) |
| Video | 1 VGA port |
| System BIOS | |
| BIOS Type | AMI 64MB SPI Flash |
| Management | |
| Software | SuperCloud Composer Supermicro Server Manager (SSM) Super Diagnostics Offline (SDO) Supermicro Thin-Agent Service (TAS) SuperServer Automation Assistant (SAA) New! |
| Power configurations | Power-on mode for AC power recovery ACPI Power Management |
| Security | |
| Hardware | Trusted Platform Module (TPM) 2.0 Silicon Root of Trust (RoT) – NIST 800-193 Compliant |
| Features | Cryptographically Signed Firmware Secure Boot Secure Firmware Updates Automatic Firmware Recovery Supply Chain Security: Remote Attestation Runtime BMC Protections System Lockdown |
| PC Health Monitoring | |
| CPU | Monitors for CPU Cores, Chipset Voltages, Memory |
| FAN | Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors |
| Temperature | Monitoring for CPU and chassis environment Thermal Control for fan connectors |
| Chassis | |
| Form Factor | 1U Rackmount |
| Model | CSE-HS101-R000NFP |
| Dimensions and Weight | |
| Height | 1.7" (43 mm) |
| Width | 17.2" (437 mm) |
| Depth | 30.66" (778.7 mm) |
| Package | 8.82" (H) x 26.46" (W) x 43.31" (D) |
| Weight | Gross Weight: 41.4 lbs (18.8 kg) Net Weight: 19.2 lbs (8.7 kg) |
| Available Color | Silver |
| Front Panel | |
| LED | HDD activity LAN1 activity Power status System information |
| Buttons | Power On/Off UID button |
| Expansion Slots | |
| PCI-Express (PCIe) Configuration | Default 2 PCIe 5.0 x16 FH/10.5"L slots 1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible) |
| Drive Bays / Storage | |
| Drive Bays Configuration | Default: Total 8 bays 8 front hot-swap 2.5" NVMe drive bays Option A: Total 12 bays 12 front hot-swap 2.5" NVMe drive bays |
| M.2 | 2 M.2 PCIe 5.0 x2 NVMe slots (M-key 2280/22110) |
| System Cooling | |
| Fans | 8 counter-rotating 40x40x56mm Fan(s) |
| Liquid Cooling | Direct to Chip (D2C) Cold Plate |
| Power Supply | |
| 2x 1600W | 2x 1600W Redundant (1 + 1) Titanium Level (96%) power supplies |
| 2x 2600W | 2x 2600W Redundant (1 + 1) Titanium Level (96%) power supplies |
| 2x 2000W | 2x 2000W Redundant (1 + 1) Titanium Level (96%) power supplies |
| Operating Environment | |
| Environmental Spec. | Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 70°C (-40°F to 158°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing) |
X14 Hyper Server: Flagship Performance Rackmount Architecture
Single or dual socket configurations supporting Intel® Xeon® 6900 series processors with P-cores and direct-to-chip liquid cooling optional
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