SYS-222BT-HNR

2U 4-Node BigTwin with 6 hot-swap 2.5" NVMe drives per node

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

Dual Socket E2 Intel® Xeon® 6 6700 series processors with E-cores up to 205W with air cooling or 330W with liquid cooling
Up to 16 DIMMs supporting up to 4TB DDR5-6400 in 1DPC
Flexible networking with OCP 3.0 AIOM slot
Up to 2 PCIe 5.0 x16 LP slots
Internal PCIe 5.0 for 2x NVMe M.2 support onboard
Optional 4x NVMe M.2 support onboard with built-in HW RAID1 via SCC-A2NM2241GH-B1
Up to 6 front hot-swap 2.5" PCIe 5.0 NVMe drive bays

Key Applications

All-Flash NVMe Hyperconverged Infrastructure
High-Performance File System

Container-as-a-Service; Application Accelerator
Diskless HPC Clusters

Datasheet

SYS-222BT-HNR.pdf

Product Specification

Anewtech-Systems-Twin-Server-Supermicro-SYS-222BT-HNR-BigTwin-SuperServers-Multi-node

Anewtech-Systems-Twin-Server-Supermicro-SYS-222BT-HNR-BigTwin-SuperServer-Supermicro-Singapore

Anewtech-Systems-Twin-Server-Supermicro-SYS-222BT-HNR-BigTwin-SuperServer

Product SKU	SuperServer SYS-222BT-HNR
Motherboard	Super X14DBT-B
Processor (per Node)
CPU	Dual Socket E2 (LGA-4710) Intel® Xeon® 6 6700 series processors with E-cores
Core Count	Up to 144C/144T; Up to 108MB Cache per CPU
Note	Supports up to 205W TDP CPUs (Air Cooled)* Supports up to 330W TDP CPUs (Liquid Cooled) *Air Cooled CPUs with TDP over 205W only supported under specific conditions.
System Memory (per Node)
Memory	Slot Count: 16 DIMM slots Max Memory (1DPC): Up to 4TB 6400MT/s ECC DDR5 RDIMM
On-Board Devices (per Node)
Chipset	System on Chip
Network Connectivity	Via AIOM
Input / Output (per Node)
LAN	1 RJ45 1 GbE Dedicated BMC LAN port(s)
USB	2 USB 3.0 Gen2 Type-A port(s) (Rear)
Video	1 VGA port(s)
System BIOS
BIOS Type	AMI 32MB Flash ROM
Management
Software	SuperCloud Composer Supermicro Server Manager (SSM) Super Diagnostics Offline (SDO) Supermicro Thin-Agent Service (TAS) SuperServer Automation Assistant (SAA)
Power configurations	ACPI/APM Power Management
Security
Hardware	Trusted Platform Module (TPM) 2.0 Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features	Cryptographically Signed Firmware Secure Boot Secure Firmware Updates Automatic Firmware Recovery Supply Chain Security: Remote Attestation Runtime BMC Protections System Lockdown
PC Health Monitoring
FAN	Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors
Temperature	Monitoring for CPU and chassis environment
CPU	Monitors for CPU Cores, Chipset Voltages, Memory. 8+4 Phase-switching voltage regulator
Chassis
Form Factor	2U Rackmount
Model	CSE-217BQ2-R3K60P
Dimensions and Weight
Height	3.47" (88 mm)
Width	17.68" (449 mm)
Depth	28.75" (730 mm)
Package	9.76" (H) x 24.65" (W) x 45.28" (D)
Weight	Gross Weight: 96.6 lbs (43.8 kg) Net Weight: 66.1 lbs (30 kg)
Available Color	Black front & silver body
Front Panel
LED	HDD activity LED Network activity LEDs Power status LED Universal Information (UID) LED
Buttons	Power On/Off button UID button
Expansion Slots (per Node)
PCI-Express (PCIe) Configuration	Default 2 PCIe 5.0 x16 LP slot(s) 1 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
Drive Bays / Storage (per Node)
Drive Bays Configuration	Default: Total 6 bay(s) 6 front hot-swap 2.5" PCIe 5.0 NVMe drive bay(s)
M.2	2 M.2 PCIe 5.0 x4 NVMe slot(s) (M-key 22110 (default); VROC required for RAID)
System Cooling
Fans	4x 16K RPM Counter Rotating 80x80x56mm Fan(s)
Liquid Cooling	Direct to Chip (D2C) Cold Plate (optional)
Power Supply	2x 3600W Redundant (1 + 1) Titanium Level (96%) power supplies
Operating Environment
ROHS	RoHS Compliant
Environmental Spec.	Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -30°C to 60°C (-22°F to 140°F) Operating Relative Humidity: 8% to 80% (non-condensing) Non-operating Relative Humidity: 8% to 90% (non-condensing)

X14 BigTwin®: Industry-leading Multi-node Architectures

Supermicro X14 BigTwin® systems provide superior performance and serviceability with dual Intel® Xeon® 6 processors (Formerly codenamed Sierra Forest and Granite Rapids) per node and hot-swappable tool-less design. Optimized for density (2U4N) or storage (2U2N), BigTwin® architectures can be more cost effective than standard 1U servers thanks to shared power and cooling while also increasing compute density and reducing overall TCO.

The modular mid-plane design provides NVMe Gen 5 storage controller options and a new riser card design can support up to 4 M.2 drives for boot/OS or metadata/caching.