SYS-622BT-HNC8R

2U 4-Node BigTwin with 3 hot-swap 3.5" NVMe/SAS/SATA drives per node

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

Dual Socket E2 Intel® Xeon® 6 6700 processors with E-cores up to 165W with air cooling or 330W with liquid cooling
Single CPU configurations supported while maintaining all expansion slot functionality
Up to 16 DIMMs supporting up to 4TB DDR5-6400 in 1DPC
Flexible networking with OCP 3.0 AIOM slot
Up to 2 PCIe 5.0 x16 LP slots; Tool-less support
Internal PCIe 5.0 for 2x NVMe M.2 support onboard
Optional 4x NVMe M.2 support onboard with built-in HW RAID1 via SCC-A2NM2241GH-B1
Up to 3 front hot-swap 3.5" NVMe/SAS drive bays
Built-in SAS3 Support via Broadcom 3808; IT Mode

Key Applications

Hyperconverged Infrastructure
Scale-Out File Storage
Back-up & Recovery

Datasheet

SYS-622BT-HNC8R.pdf

Product Specification

Anewtech-Systems-Twin-Server-Supermicro-SYS-622BT-HNC8R-BigTwin-SuperServer-Supermicro-Singapore

Anewtech-Systems-Multi-node-Server-Supermicro-SYS-622BT-HNC8R-BigTwin-SuperServers

Product SKU	SuperServer SYS-622BT-HNC8R
Motherboard	Super X14DBT-B
Processor (per Node)
CPU	Dual Socket E2 (LGA-4710) Intel® Xeon® 6 6700 series processors with E-cores
Core Count	Up to 144C/144T; Up to 108MB Cache per CPU
Note	Supports up to 165W TDP CPUs (Air Cooled)* Supports up to 330W TDP CPUs (Liquid Cooled) *Air Cooled CPUs with TDP over 165W only supported under specific conditions.
System Memory (per Node)
Memory	Slot Count: 16 DIMM slots Max Memory (1DPC): Up to 4TB 6400MT/s ECC DDR5 RDIMM
On-Board Devices (per Node)
SAS	SAS (12Gbps) via Broadcom® 3808; (IT mode)
Chipset	System on Chip
Network Connectivity	Via AIOM
Input / Output (per Node)
LAN	1 RJ45 1 GbE Dedicated BMC LAN port(s)
USB	2 USB 3.0 Type-A port(s) (Rear)
Video	1 VGA port(s)
System BIOS
BIOS Type	AMI 32MB SPI Flash
Management
Software	SuperCloud Composer Supermicro Server Manager (SSM) Super Diagnostics Offline (SDO) Supermicro Thin-Agent Service (TAS) SuperServer Automation Assistant (SAA) New!
Power configurations	Power-on mode for AC power recovery ACPI Power Management
Security
Hardware	Trusted Platform Module (TPM) 2.0 Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features	Cryptographically Signed Firmware Secure Boot Secure Firmware Updates Automatic Firmware Recovery Supply Chain Security: Remote Attestation Runtime BMC Protections System Lockdown
PC Health Monitoring
CPU	Monitors for CPU Cores, Chipset Voltages, Memory
FAN	Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors
Temperature	Monitoring for CPU and chassis environment Thermal Control for fan connectors
Chassis
Form Factor	2U Rackmount
Model	CSE-827BQ2-R3K60P
Dimensions and Weight
Height	3.47" (88 mm)
Width	17.68" (449 mm)
Depth	30.5" (774 mm)
Package	9.76" (H) x 24.65" (W) x 45.28" (D)
Weight	Gross Weight: 96.6 lbs (43.8 kg) Net Weight: 66.1 lbs (30 kg)
Available Color	Black front & silver body
Front Panel
LED	HDD activity LED Network activity LEDs Power status LED Universal Information (UID) LED
Buttons	Power On/Off button UID button
Expansion Slots (per Node)
PCI-Express (PCIe) Configuration	Default 2 PCIe 5.0 x16 LP slot(s) 1 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
Drive Bays / Storage (per Node)
Drive Bays Configuration	Default: Total 3 bay(s) 2 front hot-swap 3.5" PCIe 5.0 NVMe/SAS drive bay(s) 1 front hot-swap 3.5" PCIe 4.0 NVMe/SAS drive bay(s)
M.2	2 M.2 PCIe 5.0 x4 NVMe slot(s) (M-key 22110; VROC required for RAID)
System Cooling
Fans	4x 14.9K RPM Heavy Duty 80x80x38mm Fan(s)
Liquid Cooling	Direct to Chip (D2C) Cold Plate (optional)
Power Supply	2x 3600W Redundant (1 + 1) Titanium Level (96%) power supplies
Operating Environment
Environmental Spec.	Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -30°C to 60°C (-22°F to 140°F) Operating Relative Humidity: 8% to 80% (non-condensing) Non-operating Relative Humidity: 8% to 90% (non-condensing)

X14 BigTwin®: Industry-leading Multi-node Architectures

Supermicro X14 BigTwin® systems provide superior performance and serviceability with dual Intel® Xeon® 6 processors (Formerly codenamed Sierra Forest and Granite Rapids) per node and hot-swappable tool-less design. Optimized for density (2U4N) or storage (2U2N), BigTwin® architectures can be more cost effective than standard 1U servers thanks to shared power and cooling while also increasing compute density and reducing overall TCO.

The modular mid-plane design provides NVMe Gen 5 storage controller options and a new riser card design can support up to 4 M.2 drives for boot/OS or metadata/caching.